JP2011035269A5 - - Google Patents
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- Publication number
- JP2011035269A5 JP2011035269A5 JP2009181832A JP2009181832A JP2011035269A5 JP 2011035269 A5 JP2011035269 A5 JP 2011035269A5 JP 2009181832 A JP2009181832 A JP 2009181832A JP 2009181832 A JP2009181832 A JP 2009181832A JP 2011035269 A5 JP2011035269 A5 JP 2011035269A5
- Authority
- JP
- Japan
- Prior art keywords
- columnar member
- conductive paste
- face
- pad
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000005304 joining Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009181832A JP5250502B2 (ja) | 2009-08-04 | 2009-08-04 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009181832A JP5250502B2 (ja) | 2009-08-04 | 2009-08-04 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011035269A JP2011035269A (ja) | 2011-02-17 |
| JP2011035269A5 true JP2011035269A5 (enExample) | 2012-08-16 |
| JP5250502B2 JP5250502B2 (ja) | 2013-07-31 |
Family
ID=43764027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009181832A Active JP5250502B2 (ja) | 2009-08-04 | 2009-08-04 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5250502B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185360B (zh) * | 2014-08-18 | 2017-05-24 | 深圳市华星光电技术有限公司 | 一种印刷电路板及其设计方法 |
| CN112309998B (zh) * | 2019-07-30 | 2023-05-16 | 华为技术有限公司 | 封装器件及其制备方法、电子设备 |
| JP2023103693A (ja) * | 2022-01-14 | 2023-07-27 | 三菱電機株式会社 | 電子機器 |
| WO2025121100A1 (ja) * | 2023-12-04 | 2025-06-12 | 株式会社村田製作所 | 回路モジュール |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107055A (ja) * | 1986-06-02 | 1988-05-12 | Fujitsu Ltd | 集積回路用パッケ−ジ |
| JP2920066B2 (ja) * | 1994-05-19 | 1999-07-19 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2809212B2 (ja) * | 1996-07-30 | 1998-10-08 | 日本電気株式会社 | 電子装置パッケ−ジ |
| JP3798620B2 (ja) * | 2000-12-04 | 2006-07-19 | 富士通株式会社 | 半導体装置の製造方法 |
| JP4494175B2 (ja) * | 2004-11-30 | 2010-06-30 | 新光電気工業株式会社 | 半導体装置 |
| JP2007042977A (ja) * | 2005-08-05 | 2007-02-15 | Shinko Electric Ind Co Ltd | 半導体装置 |
| JP5215587B2 (ja) * | 2007-04-27 | 2013-06-19 | ラピスセミコンダクタ株式会社 | 半導体装置 |
-
2009
- 2009-08-04 JP JP2009181832A patent/JP5250502B2/ja active Active
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