JP2011035184A - 半導体発光装置の製造方法 - Google Patents
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
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- H01L33/0004—Devices characterised by their operation
- H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
- H01L33/0016—Devices characterised by their operation having p-n or hi-lo junctions having at least two p-n junctions
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- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
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Abstract
【解決手段】本発明の半導体発光装置の製造方法は、基板1の主面に発光層を有する半導体層12a、12bを形成する工程と、基板1の主面上で半導体層12a、12bを複数の素子12に分離する分離溝31を形成する工程と、半導体層12a、12bを覆い、分離溝31の底面を覆う絶縁膜15を基板1の主面上に形成する工程と、基板1における主面の反対面側から半導体層12aにレーザ光Lを照射して、半導体層12aと基板1とを分離する工程とを備え、レーザ光Lの照射範囲の縁部50が分離溝31に位置するようにレーザ光Lを照射する。
【選択図】図2
Description
分離溝31には、絶縁膜15が充填されていることが好ましいが、充填されていなくとも、基板1の主面上で半導体層12aの周辺近傍に絶縁膜15が設けられていれば、上記の屈折率差によるレーザ光Lの波面屈曲は抑えられ、強度分布が安定化し剥離条件が安定化しやすいという効果を得られる。
このとき、重なったレーザ光Lの部分には、絶縁膜15が設けられているので、分離溝31が空洞になっているものに比べて、屈折率差によるレーザ光Lの波面屈曲は抑えられ、強度分布が安定化し剥離条件が安定化しやすいという効果が得られる。
Claims (5)
- 基板の主面に、発光層を有する半導体層を形成する工程と、
前記基板の前記主面上で前記半導体層を複数の素子に分離する分離溝を形成する工程と、
前記半導体層を覆い、前記基板上に設けられた前記分離溝の底面を覆う絶縁膜を前記基板の前記主面上に形成する工程と、
前記基板における前記主面の反対面側から前記半導体層にレーザ光を照射して、前記半導体層と前記基板とを分離する工程と、
を備え、
前記レーザ光の照射範囲の縁部が、前記分離溝に隣接する前記半導体層の縁部近傍に位置するように前記レーザ光を照射することを特徴とする半導体発光装置の製造方法。 - 前記レーザ光の照射範囲の縁部が、前記分離溝に位置するように前記レーザ光を照射することを特徴とする請求項1記載の半導体発光装置の製造方法。
- 前記レーザ光の照射範囲の縁部が、前記分離溝よりも前記半導体層側に位置するように前記レーザ光を照射することを特徴とする請求項1記載の半導体発光装置の製造方法。
- 前記基板における前記分離溝に対向する部分に溝を形成する工程をさらに備えたことを特徴とする請求項1〜3のいずれか1つに記載の半導体発光装置の製造方法。
- 前記分離溝の少なくとも一部に前記絶縁膜が設けられない空所を形成する工程をさらに備えたことを特徴とする請求項1〜3のいずれか1つに記載の半導体発光装置の製造方法。
Priority Applications (10)
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JP2009180402A JP4686625B2 (ja) | 2009-08-03 | 2009-08-03 | 半導体発光装置の製造方法 |
US12/797,711 US8148183B2 (en) | 2009-08-03 | 2010-06-10 | Method for manufacturing semiconductor light emitting device |
TW102139066A TWI549315B (zh) | 2009-08-03 | 2010-07-27 | 製造半導體發光裝置之方法 |
TW099124724A TWI430472B (zh) | 2009-08-03 | 2010-07-27 | 製造半導體發光裝置之方法 |
CN201310258023.8A CN103354253B (zh) | 2009-08-03 | 2010-08-02 | 半导体发光装置制造方法 |
CN201010243804.6A CN101989573B (zh) | 2009-08-03 | 2010-08-02 | 半导体发光装置制造方法 |
US13/406,840 US8610163B2 (en) | 2009-08-03 | 2012-02-28 | Method for manufacturing semiconductor light emitting device |
US14/081,688 US8852976B2 (en) | 2009-08-03 | 2013-11-15 | Method for manufacturing semiconductor light emitting device |
US14/334,164 US9105828B2 (en) | 2009-08-03 | 2014-07-17 | Method for manufacturing semiconductor light emitting device |
US14/788,213 US9306141B2 (en) | 2009-08-03 | 2015-06-30 | Method for manufacturing semiconductor light emitting device |
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JP2009180402A JP4686625B2 (ja) | 2009-08-03 | 2009-08-03 | 半導体発光装置の製造方法 |
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JP2011022801A Division JP4719323B2 (ja) | 2011-02-04 | 2011-02-04 | 半導体発光装置の製造方法 |
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JP4686625B2 JP4686625B2 (ja) | 2011-05-25 |
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US (5) | US8148183B2 (ja) |
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CN (2) | CN103354253B (ja) |
TW (2) | TWI549315B (ja) |
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US20120153344A1 (en) | 2012-06-21 |
CN103354253B (zh) | 2016-05-11 |
US9105828B2 (en) | 2015-08-11 |
CN101989573B (zh) | 2015-11-25 |
US8852976B2 (en) | 2014-10-07 |
TW201407812A (zh) | 2014-02-16 |
US8148183B2 (en) | 2012-04-03 |
TWI549315B (zh) | 2016-09-11 |
US20110027921A1 (en) | 2011-02-03 |
US20140070264A1 (en) | 2014-03-13 |
JP4686625B2 (ja) | 2011-05-25 |
US8610163B2 (en) | 2013-12-17 |
CN101989573A (zh) | 2011-03-23 |
CN103354253A (zh) | 2013-10-16 |
TWI430472B (zh) | 2014-03-11 |
US9306141B2 (en) | 2016-04-05 |
US20150303361A1 (en) | 2015-10-22 |
TW201123526A (en) | 2011-07-01 |
US20140329348A1 (en) | 2014-11-06 |
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