JP2011029390A5 - - Google Patents

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Publication number
JP2011029390A5
JP2011029390A5 JP2009173210A JP2009173210A JP2011029390A5 JP 2011029390 A5 JP2011029390 A5 JP 2011029390A5 JP 2009173210 A JP2009173210 A JP 2009173210A JP 2009173210 A JP2009173210 A JP 2009173210A JP 2011029390 A5 JP2011029390 A5 JP 2011029390A5
Authority
JP
Japan
Prior art keywords
wafer
liquid
wafers
compartments
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009173210A
Other languages
English (en)
Japanese (ja)
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JP2011029390A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009173210A priority Critical patent/JP2011029390A/ja
Priority claimed from JP2009173210A external-priority patent/JP2011029390A/ja
Priority to CN201080033609.9A priority patent/CN102473666B/zh
Priority to PCT/JP2010/062303 priority patent/WO2011010683A1/ja
Priority to KR1020117029322A priority patent/KR101370578B1/ko
Publication of JP2011029390A publication Critical patent/JP2011029390A/ja
Publication of JP2011029390A5 publication Critical patent/JP2011029390A5/ja
Pending legal-status Critical Current

Links

JP2009173210A 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置 Pending JP2011029390A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009173210A JP2011029390A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置
CN201080033609.9A CN102473666B (zh) 2009-07-24 2010-07-22 晶片输送方法和晶片输送装置
PCT/JP2010/062303 WO2011010683A1 (ja) 2009-07-24 2010-07-22 ウエハ搬送方法およびウエハ搬送装置
KR1020117029322A KR101370578B1 (ko) 2009-07-24 2010-07-22 웨이퍼 반송방법 및 웨이퍼 반송장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009173210A JP2011029390A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置

Publications (2)

Publication Number Publication Date
JP2011029390A JP2011029390A (ja) 2011-02-10
JP2011029390A5 true JP2011029390A5 (cg-RX-API-DMAC10.html) 2012-07-05

Family

ID=43637802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009173210A Pending JP2011029390A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置

Country Status (1)

Country Link
JP (1) JP2011029390A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029401A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
JP5457113B2 (ja) * 2009-09-14 2014-04-02 日鉄住金ファインテック株式会社 ウエハ搬送方法およびウエハ搬送装置
US10507991B2 (en) * 2018-05-08 2019-12-17 Applied Materials, Inc. Vacuum conveyor substrate loading module
CN109969792A (zh) * 2019-05-07 2019-07-05 张家港市德昶自动化科技有限公司 用于半导体晶圆的干式分片机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580212B2 (ja) * 1987-11-24 1997-02-12 住友シチックス株式会社 ウエーハの枚葉化装置
JP3150888B2 (ja) * 1995-11-28 2001-03-26 株式会社日平トヤマ ウエハの分離搬送装置及び分離搬送方法
JP3668336B2 (ja) * 1996-08-13 2005-07-06 三菱住友シリコン株式会社 半導体ウェーハの搬送装置
JP2002254378A (ja) * 2001-02-22 2002-09-10 Hiroshi Akashi 液中ワーク取り出し装置
JP2003292160A (ja) * 2002-04-01 2003-10-15 Hitachi Kiden Kogyo Ltd ガラス基板の取り出し装置
CN101652849B (zh) * 2006-12-19 2011-09-14 Rec斯坎沃佛股份有限公司 用于分离硅晶片的方法和设备
DE102007061410A1 (de) * 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel
JP2011029401A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置

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