JP2011029390A - ウエハ搬送方法およびウエハ搬送装置 - Google Patents

ウエハ搬送方法およびウエハ搬送装置 Download PDF

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Publication number
JP2011029390A
JP2011029390A JP2009173210A JP2009173210A JP2011029390A JP 2011029390 A JP2011029390 A JP 2011029390A JP 2009173210 A JP2009173210 A JP 2009173210A JP 2009173210 A JP2009173210 A JP 2009173210A JP 2011029390 A JP2011029390 A JP 2011029390A
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Japan
Prior art keywords
wafer
wafers
suction
liquid
uppermost
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Pending
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JP2009173210A
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English (en)
Japanese (ja)
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JP2011029390A5 (cg-RX-API-DMAC10.html
Inventor
Tamotsu Nishioka
保 西岡
Kazuo Shirai
和夫 白井
Hirotaka Miyai
寛高 宮井
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Nippon Steel Precision Machining Co Ltd
Original Assignee
Sumitomo Metal Fine Tech Co Ltd
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Publication date
Application filed by Sumitomo Metal Fine Tech Co Ltd filed Critical Sumitomo Metal Fine Tech Co Ltd
Priority to JP2009173210A priority Critical patent/JP2011029390A/ja
Priority to CN201080033609.9A priority patent/CN102473666B/zh
Priority to PCT/JP2010/062303 priority patent/WO2011010683A1/ja
Priority to KR1020117029322A priority patent/KR101370578B1/ko
Publication of JP2011029390A publication Critical patent/JP2011029390A/ja
Publication of JP2011029390A5 publication Critical patent/JP2011029390A5/ja
Pending legal-status Critical Current

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009173210A 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置 Pending JP2011029390A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009173210A JP2011029390A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置
CN201080033609.9A CN102473666B (zh) 2009-07-24 2010-07-22 晶片输送方法和晶片输送装置
PCT/JP2010/062303 WO2011010683A1 (ja) 2009-07-24 2010-07-22 ウエハ搬送方法およびウエハ搬送装置
KR1020117029322A KR101370578B1 (ko) 2009-07-24 2010-07-22 웨이퍼 반송방법 및 웨이퍼 반송장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009173210A JP2011029390A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置

Publications (2)

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JP2011029390A true JP2011029390A (ja) 2011-02-10
JP2011029390A5 JP2011029390A5 (cg-RX-API-DMAC10.html) 2012-07-05

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JP2009173210A Pending JP2011029390A (ja) 2009-07-24 2009-07-24 ウエハ搬送方法およびウエハ搬送装置

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JP (1) JP2011029390A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029401A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
JP2011061122A (ja) * 2009-09-14 2011-03-24 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
CN109969792A (zh) * 2019-05-07 2019-07-05 张家港市德昶自动化科技有限公司 用于半导体晶圆的干式分片机
WO2019216972A1 (en) * 2018-05-08 2019-11-14 Applied Materials, Inc. Vacuum conveyor substrate loading module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580212B2 (ja) * 1987-11-24 1997-02-12 住友シチックス株式会社 ウエーハの枚葉化装置
JPH09148278A (ja) * 1995-11-28 1997-06-06 Nippei Toyama Corp ウエハの分離搬送装置及び分離搬送方法
JPH1059544A (ja) * 1996-08-13 1998-03-03 Mitsubishi Materials Shilicon Corp 板材の搬送装置
JP2002254378A (ja) * 2001-02-22 2002-09-10 Hiroshi Akashi 液中ワーク取り出し装置
JP2003292160A (ja) * 2002-04-01 2003-10-15 Hitachi Kiden Kogyo Ltd ガラス基板の取り出し装置
WO2008075970A1 (en) * 2006-12-19 2008-06-26 Rec Scanwafer As Method and device for se aration of silicon wafers
WO2009074317A1 (de) * 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und vorrichtung zum vereinzeln von wafern von einem waferstapel
JP2011029401A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580212B2 (ja) * 1987-11-24 1997-02-12 住友シチックス株式会社 ウエーハの枚葉化装置
JPH09148278A (ja) * 1995-11-28 1997-06-06 Nippei Toyama Corp ウエハの分離搬送装置及び分離搬送方法
JPH1059544A (ja) * 1996-08-13 1998-03-03 Mitsubishi Materials Shilicon Corp 板材の搬送装置
JP2002254378A (ja) * 2001-02-22 2002-09-10 Hiroshi Akashi 液中ワーク取り出し装置
JP2003292160A (ja) * 2002-04-01 2003-10-15 Hitachi Kiden Kogyo Ltd ガラス基板の取り出し装置
WO2008075970A1 (en) * 2006-12-19 2008-06-26 Rec Scanwafer As Method and device for se aration of silicon wafers
WO2009074317A1 (de) * 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und vorrichtung zum vereinzeln von wafern von einem waferstapel
JP2011029401A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029401A (ja) * 2009-07-24 2011-02-10 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
JP2011061122A (ja) * 2009-09-14 2011-03-24 Sumitomo Metal Fine Technology Co Ltd ウエハ搬送方法およびウエハ搬送装置
WO2019216972A1 (en) * 2018-05-08 2019-11-14 Applied Materials, Inc. Vacuum conveyor substrate loading module
CN112041979A (zh) * 2018-05-08 2020-12-04 应用材料公司 真空输送机基板装载模块
CN112041979B (zh) * 2018-05-08 2024-09-03 应用材料公司 真空输送机基板装载模块
CN109969792A (zh) * 2019-05-07 2019-07-05 张家港市德昶自动化科技有限公司 用于半导体晶圆的干式分片机

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