JP2011009514A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP2011009514A
JP2011009514A JP2009152259A JP2009152259A JP2011009514A JP 2011009514 A JP2011009514 A JP 2011009514A JP 2009152259 A JP2009152259 A JP 2009152259A JP 2009152259 A JP2009152259 A JP 2009152259A JP 2011009514 A JP2011009514 A JP 2011009514A
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substrate
semiconductor device
main surface
manufacturing
conductive member
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Japanese (ja)
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JP2011009514A5 (enExample
Inventor
Michiaki Sugiyama
道昭 杉山
Takashi Miwa
孝志 三輪
Tomokazu Ishikawa
智和 石川
Tatsuya Hirai
達也 平井
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Renesas Electronics Corp
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Renesas Electronics Corp
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Priority to JP2009152259A priority Critical patent/JP2011009514A/ja
Priority to US12/793,923 priority patent/US8138022B2/en
Publication of JP2011009514A publication Critical patent/JP2011009514A/ja
Publication of JP2011009514A5 publication Critical patent/JP2011009514A5/ja
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2009152259A 2009-06-26 2009-06-26 半導体装置の製造方法 Pending JP2011009514A (ja)

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US12/793,923 US8138022B2 (en) 2009-06-26 2010-06-04 Method of manufacturing semiconductor device

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TWI584430B (zh) * 2014-09-10 2017-05-21 矽品精密工業股份有限公司 半導體封裝件及其製法
JP5873152B1 (ja) * 2014-09-29 2016-03-01 日本特殊陶業株式会社 配線基板
JP6429647B2 (ja) * 2015-01-26 2018-11-28 ルネサスエレクトロニクス株式会社 半導体装置
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