JP2010541219A5 - - Google Patents
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- Publication number
- JP2010541219A5 JP2010541219A5 JP2010526154A JP2010526154A JP2010541219A5 JP 2010541219 A5 JP2010541219 A5 JP 2010541219A5 JP 2010526154 A JP2010526154 A JP 2010526154A JP 2010526154 A JP2010526154 A JP 2010526154A JP 2010541219 A5 JP2010541219 A5 JP 2010541219A5
- Authority
- JP
- Japan
- Prior art keywords
- structure according
- arrangement structure
- web
- optoelectronic
- optoelectronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005693 optoelectronics Effects 0.000 claims 16
- 239000000463 material Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- HAQWSKVTPMWLCU-UHFFFAOYSA-J N(=O)[O-].[W+4].N(=O)[O-].N(=O)[O-].N(=O)[O-] Chemical compound N(=O)[O-].[W+4].N(=O)[O-].N(=O)[O-].N(=O)[O-] HAQWSKVTPMWLCU-UHFFFAOYSA-J 0.000 claims 1
- MFKBOPVTELWCDM-UHFFFAOYSA-F N(=O)[O-].[W+4].[Ti+4].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-] Chemical compound N(=O)[O-].[W+4].[Ti+4].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-].N(=O)[O-] MFKBOPVTELWCDM-UHFFFAOYSA-F 0.000 claims 1
- -1 One of a dielectric Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- QLJCFNUYUJEXET-UHFFFAOYSA-K aluminum;trinitrite Chemical compound [Al+3].[O-]N=O.[O-]N=O.[O-]N=O QLJCFNUYUJEXET-UHFFFAOYSA-K 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- XOUPWBJVJFQSLK-UHFFFAOYSA-J titanium(4+);tetranitrite Chemical compound [Ti+4].[O-]N=O.[O-]N=O.[O-]N=O.[O-]N=O XOUPWBJVJFQSLK-UHFFFAOYSA-J 0.000 claims 1
- 239000012780 transparent material Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007046720 | 2007-09-28 | ||
| DE102007046720.8 | 2007-09-28 | ||
| DE102007053849.0 | 2007-11-12 | ||
| DE102007053849A DE102007053849A1 (de) | 2007-09-28 | 2007-11-12 | Anordnung umfassend ein optoelektronisches Bauelement |
| PCT/DE2008/001513 WO2009039825A1 (de) | 2007-09-28 | 2008-09-09 | Anordnung umfassend ein optoelektronisches bauelement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010541219A JP2010541219A (ja) | 2010-12-24 |
| JP2010541219A5 true JP2010541219A5 (enExample) | 2011-08-18 |
| JP5389034B2 JP5389034B2 (ja) | 2014-01-15 |
Family
ID=40384467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010526154A Expired - Fee Related JP5389034B2 (ja) | 2007-09-28 | 2008-09-09 | オプトエレクトロニクス部品を備えている配置構造 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8427839B2 (enExample) |
| EP (1) | EP2193551B1 (enExample) |
| JP (1) | JP5389034B2 (enExample) |
| KR (1) | KR101475978B1 (enExample) |
| CN (1) | CN101809773B (enExample) |
| DE (1) | DE102007053849A1 (enExample) |
| TW (1) | TWI447943B (enExample) |
| WO (1) | WO2009039825A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013175333A1 (en) * | 2012-05-23 | 2013-11-28 | Koninklijke Philips N.V. | Surface mountable semiconductor device |
| DE102014100773A1 (de) | 2014-01-23 | 2015-07-23 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
| US10541190B2 (en) * | 2015-11-30 | 2020-01-21 | Intel Corporation | Stacked die package with through-mold thermally conductive structures between a bottom die and a thermally conductive material |
| DE102016103862A1 (de) | 2016-03-03 | 2017-09-07 | Osram Opto Semiconductors Gmbh | Optoelektronische Leuchtvorrichtung, Träger für einen optoelektronischen Halbleiterchip und optoelektronisches Leuchtsystem |
| CN107464873A (zh) * | 2017-05-03 | 2017-12-12 | 合肥彩虹蓝光科技有限公司 | 一种避免倒装芯片固晶漏电的方法 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4831507B1 (enExample) * | 1969-07-10 | 1973-09-29 | ||
| US3811186A (en) * | 1972-12-11 | 1974-05-21 | Ibm | Method of aligning and attaching circuit devices on a substrate |
| DE4020048A1 (de) * | 1990-06-23 | 1992-01-02 | Ant Nachrichtentech | Anordnung aus substrat und bauelement und verfahren zur herstellung |
| JP3138343B2 (ja) | 1992-09-30 | 2001-02-26 | 日本電信電話株式会社 | 光モジュールの製造方法 |
| JP3152834B2 (ja) * | 1993-06-24 | 2001-04-03 | 株式会社東芝 | 電子回路装置 |
| EP0631461B1 (en) | 1993-06-24 | 1998-05-13 | Kabushiki Kaisha Toshiba | Electronic circuit device |
| JPH07209559A (ja) * | 1994-01-24 | 1995-08-11 | Oki Electric Ind Co Ltd | 光モジュールとその組立て方法 |
| JPH08191141A (ja) * | 1995-01-09 | 1996-07-23 | Sony Corp | 固体撮像素子 |
| US5931371A (en) * | 1997-01-16 | 1999-08-03 | Ford Motor Company | Standoff controlled interconnection |
| CN1191394A (zh) * | 1997-02-20 | 1998-08-26 | 杨泰和 | 藉前置光－电转换元件驱动的绝缘栅双极晶体管 |
| JP3011232B2 (ja) * | 1997-02-25 | 2000-02-21 | 日本電気株式会社 | 固体撮像素子及びその製造方法 |
| EP1122567A1 (en) * | 2000-02-02 | 2001-08-08 | Corning Incorporated | Passive alignement using slanted wall pedestal |
| JP3786128B2 (ja) | 2001-03-06 | 2006-06-14 | ソニー株式会社 | 表示装置の製造方法 |
| CN1220283C (zh) * | 2001-04-23 | 2005-09-21 | 松下电工株式会社 | 使用led芯片的发光装置 |
| JP2002319705A (ja) | 2001-04-23 | 2002-10-31 | Matsushita Electric Works Ltd | Ｌｅｄ装置 |
| JP4122784B2 (ja) * | 2001-09-19 | 2008-07-23 | 松下電工株式会社 | 発光装置 |
| DE10157205A1 (de) * | 2001-11-22 | 2003-06-12 | Fraunhofer Ges Forschung | Kontakthöcker mit profilierter Oberflächenstruktur sowie Verfahren zur Herstellung |
| JP4348894B2 (ja) * | 2002-03-22 | 2009-10-21 | 日亜化学工業株式会社 | 発光装置 |
| JP4139634B2 (ja) * | 2002-06-28 | 2008-08-27 | 松下電器産業株式会社 | Ｌｅｄ照明装置およびその製造方法 |
| JP4153914B2 (ja) * | 2003-01-27 | 2008-09-24 | 日本碍子株式会社 | 光デバイス |
| JP3947481B2 (ja) | 2003-02-19 | 2007-07-18 | 浜松ホトニクス株式会社 | 光モジュール及びその製造方法 |
| EP1475835A3 (en) * | 2003-04-14 | 2004-12-15 | Epitech Corporation, Ltd. | Color mixing light emitting diode |
| JP2005158957A (ja) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | 発光装置 |
| JP4123105B2 (ja) * | 2003-05-26 | 2008-07-23 | 松下電工株式会社 | 発光装置 |
| TWI253765B (en) | 2003-05-26 | 2006-04-21 | Matsushita Electric Works Ltd | Light-emitting device |
| EP1683209A2 (en) * | 2003-11-12 | 2006-07-26 | E.I. Dupont De Nemours And Company | Encapsulation assembly for electronic devices |
| WO2005067063A1 (en) * | 2004-01-12 | 2005-07-21 | Asetronics Ag | Arrangement with a light emitting device on a substrate |
| JP2006066519A (ja) * | 2004-08-25 | 2006-03-09 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
| KR100867515B1 (ko) * | 2004-12-06 | 2008-11-07 | 삼성전기주식회사 | 발광소자 패키지 |
| DE202005014073U1 (de) * | 2005-09-06 | 2007-01-18 | Ic-Haus Gmbh | Chipträgerbaugruppe |
| JP4789671B2 (ja) * | 2006-03-28 | 2011-10-12 | 京セラ株式会社 | 発光素子用配線基板ならびに発光装置 |
| JP4967548B2 (ja) | 2006-09-06 | 2012-07-04 | 株式会社ニコン | 発光装置 |
-
2007
- 2007-11-12 DE DE102007053849A patent/DE102007053849A1/de not_active Withdrawn
-
2008
- 2008-09-09 CN CN2008801093434A patent/CN101809773B/zh not_active Expired - Fee Related
- 2008-09-09 US US12/678,511 patent/US8427839B2/en not_active Expired - Fee Related
- 2008-09-09 EP EP08801317.2A patent/EP2193551B1/de not_active Not-in-force
- 2008-09-09 KR KR1020107009231A patent/KR101475978B1/ko not_active Expired - Fee Related
- 2008-09-09 JP JP2010526154A patent/JP5389034B2/ja not_active Expired - Fee Related
- 2008-09-09 WO PCT/DE2008/001513 patent/WO2009039825A1/de not_active Ceased
- 2008-09-26 TW TW097137011A patent/TWI447943B/zh not_active IP Right Cessation
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