JP2010541159A5 - - Google Patents

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Publication number
JP2010541159A5
JP2010541159A5 JP2010526900A JP2010526900A JP2010541159A5 JP 2010541159 A5 JP2010541159 A5 JP 2010541159A5 JP 2010526900 A JP2010526900 A JP 2010526900A JP 2010526900 A JP2010526900 A JP 2010526900A JP 2010541159 A5 JP2010541159 A5 JP 2010541159A5
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JP
Japan
Prior art keywords
reactive gas
substrate
deposition
gas material
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010526900A
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English (en)
Japanese (ja)
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JP2010541159A (ja
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Publication date
Priority claimed from US11/861,519 external-priority patent/US20090081356A1/en
Application filed filed Critical
Publication of JP2010541159A publication Critical patent/JP2010541159A/ja
Publication of JP2010541159A5 publication Critical patent/JP2010541159A5/ja
Pending legal-status Critical Current

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JP2010526900A 2007-09-26 2008-09-17 薄膜封止層を形成する方法 Pending JP2010541159A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/861,519 US20090081356A1 (en) 2007-09-26 2007-09-26 Process for forming thin film encapsulation layers
PCT/US2008/010804 WO2009042052A2 (en) 2007-09-26 2008-09-17 Process for forming thin film encapsulation layers

Publications (2)

Publication Number Publication Date
JP2010541159A JP2010541159A (ja) 2010-12-24
JP2010541159A5 true JP2010541159A5 (enExample) 2011-11-10

Family

ID=40351857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010526900A Pending JP2010541159A (ja) 2007-09-26 2008-09-17 薄膜封止層を形成する方法

Country Status (5)

Country Link
US (2) US20090081356A1 (enExample)
EP (1) EP2193219A2 (enExample)
JP (1) JP2010541159A (enExample)
CN (1) CN101809188B (enExample)
WO (1) WO2009042052A2 (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080166880A1 (en) * 2007-01-08 2008-07-10 Levy David H Delivery device for deposition
US11136667B2 (en) * 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
US8398770B2 (en) * 2007-09-26 2013-03-19 Eastman Kodak Company Deposition system for thin film formation
US7972898B2 (en) * 2007-09-26 2011-07-05 Eastman Kodak Company Process for making doped zinc oxide
DE102009024411A1 (de) * 2009-03-24 2010-09-30 Osram Opto Semiconductors Gmbh Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement
JP5648349B2 (ja) * 2009-09-17 2015-01-07 東京エレクトロン株式会社 成膜装置
EP2480703A4 (en) * 2009-09-22 2013-10-30 3M Innovative Properties Co PROCESS FOR APPLYING COATINGS BY DEPOSITION OF ATOMIC LAYERS ON POROUS NON-CERAMIC SUBSTRATES
EP2599142A1 (en) 2010-07-26 2013-06-05 Merck Patent GmbH Nanocrystals in devices
KR102138213B1 (ko) * 2010-11-24 2020-07-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 유기 광 디바이스 및 유기 광 디바이스의 보호 부재
JP6351974B2 (ja) 2011-02-14 2018-07-04 メルク パテント ゲーエムベーハー 細胞および細胞組織の処置のためのデバイスおよび方法
JP6356060B2 (ja) 2011-03-24 2018-07-11 メルク パテント ゲーエムベーハー 有機イオン性機能材料
EP2707911B1 (en) 2011-05-12 2017-07-05 Merck Patent GmbH Compositions and electronic devices
DE102011077833A1 (de) * 2011-06-20 2012-12-20 Gebr. Schmid Gmbh Verfahren zur Bearbeitung von Substraten und Vorrichtung dazu
KR20130117510A (ko) * 2012-04-18 2013-10-28 가부시키가이샤 가네카 무기막을 이용한 수분 투과 방지막의 제조 방법, 무기막을 이용한 수분 투과 방지막 및 전기, 전자 봉지 소자
US8647943B2 (en) * 2012-06-12 2014-02-11 Intermolecular, Inc. Enhanced non-noble electrode layers for DRAM capacitor cell
DE102012214411B4 (de) 2012-08-14 2022-05-25 Osram Oled Gmbh Vorrichtung und verfahren zum herstellen hermetisch dichter kavitäten
JP6186698B2 (ja) * 2012-10-29 2017-08-30 セイコーエプソン株式会社 有機ｅｌ装置、電子機器
KR101420333B1 (ko) * 2012-11-19 2014-07-16 삼성디스플레이 주식회사 기상 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법
KR102083448B1 (ko) * 2012-12-20 2020-03-03 삼성디스플레이 주식회사 기상 증착 장치, 이를 이용한 증착 방법 및 유기 발광 표시 장치 제조 방법
KR102103421B1 (ko) * 2013-02-07 2020-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
WO2014159267A1 (en) * 2013-03-14 2014-10-02 Applied Materials, Inc. Thin film encapsulation - thin ultra high barrier layer for oled application
US8940646B1 (en) 2013-07-12 2015-01-27 Lam Research Corporation Sequential precursor dosing in an ALD multi-station/batch reactor
US9494792B2 (en) * 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9356256B2 (en) * 2013-07-31 2016-05-31 Samsung Display Co., Ltd. Flexible display device and manufacturing method thereof
KR20150109984A (ko) * 2014-03-21 2015-10-02 삼성전자주식회사 기체 차단 필름, 이를 포함하는 냉장고 및 기체 차단 필름의 제조방법
CN111477657B (zh) * 2014-10-28 2024-03-05 株式会社半导体能源研究所 功能面板、功能面板的制造方法、模块、数据处理装置
SG11201706564UA (en) 2015-02-13 2017-09-28 Entegris Inc Coatings for enhancement of properties and performance of substrate articles and apparatus
KR102382025B1 (ko) * 2015-03-04 2022-04-04 삼성디스플레이 주식회사 표시 장치
JP2016207452A (ja) * 2015-04-22 2016-12-08 ソニー株式会社 表示装置の製造方法、表示装置、及び、電子機器
KR102404648B1 (ko) * 2015-09-21 2022-05-31 엘지디스플레이 주식회사 표시장치
JP2017147059A (ja) * 2016-02-15 2017-08-24 セイコーエプソン株式会社 電気光学装置及び電子機器
EP3455326B1 (de) 2016-05-11 2021-02-24 Merck Patent GmbH Zusammensetzungen für elektrochemische zellen
US10584413B2 (en) 2017-03-14 2020-03-10 Eastman Kodak Company Vertical system with vacuum pre-loaded deposition head
US10501848B2 (en) 2017-03-14 2019-12-10 Eastman Kodak Company Deposition system with modular deposition heads
US20180265977A1 (en) 2017-03-14 2018-09-20 Eastman Kodak Company Deposition system with vacuum pre-loaded deposition head
US10422038B2 (en) 2017-03-14 2019-09-24 Eastman Kodak Company Dual gas bearing substrate positioning system
US10435788B2 (en) 2017-03-14 2019-10-08 Eastman Kodak Deposition system with repeating motion profile
US10550476B2 (en) 2017-03-14 2020-02-04 Eastman Kodak Company Heated gas-bearing backer
US10400332B2 (en) * 2017-03-14 2019-09-03 Eastman Kodak Company Deposition system with interlocking deposition heads
US11248292B2 (en) 2017-03-14 2022-02-15 Eastman Kodak Company Deposition system with moveable-position web guides
US10895011B2 (en) 2017-03-14 2021-01-19 Eastman Kodak Company Modular thin film deposition system
CN107123621A (zh) * 2017-05-10 2017-09-01 京东方科技集团股份有限公司 一种oled触控显示面板及其制作方法、触控显示装置
KR102387125B1 (ko) * 2017-07-11 2022-04-14 엘지디스플레이 주식회사 유기발광소자를 이용한 조명장치
CN108846211A (zh) * 2018-06-19 2018-11-20 南方电网科学研究院有限责任公司 一种基于Matlab的直流控制保护功能模块建模的方法和装置
CN110416437B (zh) * 2018-07-25 2021-01-26 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
JP6929265B2 (ja) 2018-12-13 2021-09-01 キヤノン株式会社 有機発光装置とその製造方法、照明装置、移動体、撮像装置、電子機器
CA3180926A1 (en) * 2020-06-05 2021-12-09 Michael S. Lebby A-axis josephson junctions with improved smoothness
US20220328605A1 (en) * 2021-04-13 2022-10-13 Canon Kabushiki Kaisha Light-emitting element, light-emitting device, photoelectric conversion device, and electronic device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI57975C (fi) * 1979-02-28 1980-11-10 Lohja Ab Oy Foerfarande och anordning vid uppbyggande av tunna foereningshinnor
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US20010052752A1 (en) 2000-04-25 2001-12-20 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
US20020003403A1 (en) * 2000-04-25 2002-01-10 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
US6541353B1 (en) * 2000-08-31 2003-04-01 Micron Technology, Inc. Atomic layer doping apparatus and method
US6926572B2 (en) * 2002-01-25 2005-08-09 Electronics And Telecommunications Research Institute Flat panel display device and method of forming passivation film in the flat panel display device
JP4158139B2 (ja) * 2002-04-30 2008-10-01 スズキ株式会社 薄膜の製造方法およびその装置
JP4062981B2 (ja) * 2002-06-14 2008-03-19 株式会社デンソー 有機ｅｌ素子
US20050084610A1 (en) * 2002-08-13 2005-04-21 Selitser Simon I. Atmospheric pressure molecular layer CVD
US20050181212A1 (en) * 2004-02-17 2005-08-18 General Electric Company Composite articles having diffusion barriers and devices incorporating the same
US20040065255A1 (en) * 2002-10-02 2004-04-08 Applied Materials, Inc. Cyclical layer deposition system
US6821563B2 (en) * 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US6888172B2 (en) * 2003-04-11 2005-05-03 Eastman Kodak Company Apparatus and method for encapsulating an OLED formed on a flexible substrate
WO2004105149A1 (en) 2003-05-16 2004-12-02 E.I. Dupont De Nemours And Company Barrier films for plastic substrates fabricated by atomic layer deposition
JP4108633B2 (ja) * 2003-06-20 2008-06-25 シャープ株式会社 薄膜トランジスタおよびその製造方法ならびに電子デバイス
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices
US20050252449A1 (en) * 2004-05-12 2005-11-17 Nguyen Son T Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
JP4613587B2 (ja) * 2004-08-11 2011-01-19 株式会社明電舎 酸化膜形成方法とその装置
KR100647711B1 (ko) * 2005-11-03 2006-11-23 삼성에스디아이 주식회사 평판 디스플레이 장치 및 이의 제조방법
EP2000008B1 (en) * 2006-03-26 2011-04-27 Lotus Applied Technology, Llc Atomic layer deposition system and method for coating flexible substrates
US20080100202A1 (en) * 2006-11-01 2008-05-01 Cok Ronald S Process for forming oled conductive protective layer
US7646144B2 (en) * 2006-12-27 2010-01-12 Eastman Kodak Company OLED with protective bi-layer electrode

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