|
US3532518A
(en)
*
|
1967-06-28 |
1970-10-06 |
Macdermid Inc |
Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
|
|
US3770598A
(en)
*
|
1972-01-21 |
1973-11-06 |
Oxy Metal Finishing Corp |
Electrodeposition of copper from acid baths
|
|
US3876513A
(en)
*
|
1972-06-26 |
1975-04-08 |
Oxy Metal Finishing Corp |
Electrodeposition of bright cobalt plate
|
|
US4073740A
(en)
*
|
1975-06-18 |
1978-02-14 |
Kollmorgen Technologies Corporation |
Composition for the activation of resinous bodies for adherent metallization
|
|
JPS5288772A
(en)
*
|
1976-01-20 |
1977-07-25 |
Matsushita Electric Industrial Co Ltd |
Method of producing printed circuit board
|
|
US4089686A
(en)
*
|
1976-04-19 |
1978-05-16 |
Western Electric Company, Inc. |
Method of depositing a metal on a surface
|
|
US4374709A
(en)
*
|
1980-05-01 |
1983-02-22 |
Occidental Chemical Corporation |
Process for plating polymeric substrates
|
|
US4446176A
(en)
*
|
1980-08-18 |
1984-05-01 |
David Hudson, Inc. |
Fluoroelastomer film compositions containing phenoxy resins and method for the preparation thereof
|
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
|
US4478883A
(en)
*
|
1982-07-14 |
1984-10-23 |
International Business Machines Corporation |
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
|
|
US4608275A
(en)
*
|
1983-07-01 |
1986-08-26 |
Macdermid, Incorporated |
Oxidizing accelerator
|
|
US4554182A
(en)
*
|
1983-10-11 |
1985-11-19 |
International Business Machines Corporation |
Method for conditioning a surface of a dielectric substrate for electroless plating
|
|
US4448804A
(en)
*
|
1983-10-11 |
1984-05-15 |
International Business Machines Corporation |
Method for selective electroless plating of copper onto a non-conductive substrate surface
|
|
US4515829A
(en)
*
|
1983-10-14 |
1985-05-07 |
Shipley Company Inc. |
Through-hole plating
|
|
US4634468A
(en)
*
|
1984-05-07 |
1987-01-06 |
Shipley Company Inc. |
Catalytic metal of reduced particle size
|
|
US4555315A
(en)
*
|
1984-05-29 |
1985-11-26 |
Omi International Corporation |
High speed copper electroplating process and bath therefor
|
|
US4592852A
(en)
*
|
1984-06-07 |
1986-06-03 |
Enthone, Incorporated |
Composition and process for treating plastics with alkaline permanganate solutions
|
|
US4673459A
(en)
*
|
1985-06-18 |
1987-06-16 |
Kamyr, Inc. |
Radial configuration of evaporator heating elements and method
|
|
US4904506A
(en)
*
|
1986-01-03 |
1990-02-27 |
International Business Machines Corporation |
Copper deposition from electroless plating bath
|
|
US5389496A
(en)
*
|
1987-03-06 |
1995-02-14 |
Rohm And Haas Company |
Processes and compositions for electroless metallization
|
|
US4803097A
(en)
*
|
1987-04-20 |
1989-02-07 |
Allied-Signal Inc. |
Metal plating of plastic materials
|
|
US4810333A
(en)
*
|
1987-12-14 |
1989-03-07 |
Shipley Company Inc. |
Electroplating process
|
|
US4948707A
(en)
*
|
1988-02-16 |
1990-08-14 |
International Business Machines Corporation |
Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
|
|
US5068013A
(en)
*
|
1988-08-23 |
1991-11-26 |
Shipley Company Inc. |
Electroplating composition and process
|
|
US5051154A
(en)
*
|
1988-08-23 |
1991-09-24 |
Shipley Company Inc. |
Additive for acid-copper electroplating baths to increase throwing power
|
|
US4919768A
(en)
*
|
1989-09-22 |
1990-04-24 |
Shipley Company Inc. |
Electroplating process
|
|
US5342501A
(en)
*
|
1989-11-21 |
1994-08-30 |
Eric F. Harnden |
Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
|
|
US5015339A
(en)
*
|
1990-03-26 |
1991-05-14 |
Olin Hunt Sub Iii Corp. |
Process for preparing nonconductive substrates
|
|
US5318803A
(en)
*
|
1990-11-13 |
1994-06-07 |
International Business Machines Corporation |
Conditioning of a substrate for electroless plating thereon
|
|
JPH05202483A
(ja)
*
|
1991-04-25 |
1993-08-10 |
Shipley Co Inc |
無電解金属化方法と組成物
|
|
JPH0525298A
(ja)
*
|
1991-06-19 |
1993-02-02 |
Kureha Chem Ind Co Ltd |
樹脂成形品の金属化に好適な粗面化方法
|
|
US5207888A
(en)
*
|
1991-06-24 |
1993-05-04 |
Shipley Company Inc. |
Electroplating process and composition
|
|
US5227013A
(en)
*
|
1991-07-25 |
1993-07-13 |
Microelectronics And Computer Technology Corporation |
Forming via holes in a multilevel substrate in a single step
|
|
US5455072A
(en)
*
|
1992-11-18 |
1995-10-03 |
Bension; Rouvain M. |
Initiation and bonding of diamond and other thin films
|
|
US5419954A
(en)
*
|
1993-02-04 |
1995-05-30 |
The Alpha Corporation |
Composition including a catalytic metal-polymer complex and a method of manufacturing a laminate preform or a laminate which is catalytically effective for subsequent electroless metallization thereof
|
|
US5425873A
(en)
*
|
1994-04-11 |
1995-06-20 |
Shipley Company Llc |
Electroplating process
|
|
US5745984A
(en)
*
|
1995-07-10 |
1998-05-05 |
Martin Marietta Corporation |
Method for making an electronic module
|
|
US5648125A
(en)
*
|
1995-11-16 |
1997-07-15 |
Cane; Frank N. |
Electroless plating process for the manufacture of printed circuit boards
|
|
US5721014A
(en)
*
|
1995-12-19 |
1998-02-24 |
Surface Tek Specialty Products, Inc. |
Composition and method for reducing copper oxide to metallic copper
|
|
EP0927060B1
(en)
*
|
1996-09-23 |
2009-04-01 |
Best Vascular, Inc. |
Intraluminal radiation treatment system
|
|
TW409261B
(en)
*
|
1998-01-13 |
2000-10-21 |
Toppan Printing Co Ltd |
A electrode plate with transmission-type or reflection-type multilayer electroconductive film, and the process for producing the electrode plate
|
|
US6284317B1
(en)
*
|
1998-04-17 |
2001-09-04 |
Massachusetts Institute Of Technology |
Derivatization of silicon surfaces
|
|
JP4013352B2
(ja)
*
|
1998-09-24 |
2007-11-28 |
松下電工株式会社 |
樹脂基材表面への金属膜形成方法
|
|
US6344309B2
(en)
*
|
1998-10-22 |
2002-02-05 |
Shin-Etsu Chemical Co., Ltd. |
Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
|
|
US6221653B1
(en)
*
|
1999-04-27 |
2001-04-24 |
Agilent Technologies, Inc. |
Method of performing array-based hybridization assays using thermal inkjet deposition of sample fluids
|
|
WO2001003126A2
(en)
*
|
1999-07-01 |
2001-01-11 |
The Regents Of The University Of California |
High density non-volatile memory device
|
|
US6324091B1
(en)
*
|
2000-01-14 |
2001-11-27 |
The Regents Of The University Of California |
Tightly coupled porphyrin macrocycles for molecular memory storage
|
|
US6208553B1
(en)
*
|
1999-07-01 |
2001-03-27 |
The Regents Of The University Of California |
High density non-volatile memory device incorporating thiol-derivatized porphyrins
|
|
US6381169B1
(en)
*
|
1999-07-01 |
2002-04-30 |
The Regents Of The University Of California |
High density non-volatile memory device
|
|
US6294392B1
(en)
|
1999-07-21 |
2001-09-25 |
The Regents Of The University Of California |
Spatially-encoded analyte detection
|
|
JP2001091745A
(ja)
*
|
1999-09-22 |
2001-04-06 |
Nitto Denko Corp |
複合位相差板、光学補償偏光板及び液晶表示装置
|
|
US6272038B1
(en)
*
|
2000-01-14 |
2001-08-07 |
North Carolina State University |
High-density non-volatile memory devices incorporating thiol-derivatized porphyrin trimers
|
|
JP2003520384A
(ja)
*
|
2000-01-14 |
2003-07-02 |
ノース・キャロライナ・ステイト・ユニヴァーシティ |
連結されたサンドイッチ型配位化合物のポリマーを担持する基板およびそれを使用する方法
|
|
US6212093B1
(en)
*
|
2000-01-14 |
2001-04-03 |
North Carolina State University |
High-density non-volatile memory devices incorporating sandwich coordination compounds
|
|
FR2804973B1
(fr)
*
|
2000-02-11 |
2002-09-20 |
Univ Paris 7 Denis Diderot |
Materiau metallique dont la surface est modifiee, son procede de preparation et utilisation du materiau modifie
|
|
JP2002041276A
(ja)
|
2000-07-24 |
2002-02-08 |
Sony Corp |
対話型操作支援システム及び対話型操作支援方法、並びに記憶媒体
|
|
JP2002080997A
(ja)
*
|
2000-09-11 |
2002-03-22 |
Matsushita Electric Ind Co Ltd |
回路基板用金属箔の製造方法、多層回路基板およびその製造方法
|
|
US20040161545A1
(en)
*
|
2000-11-28 |
2004-08-19 |
Shipley Company, L.L.C. |
Adhesion method
|
|
US7112366B2
(en)
*
|
2001-01-05 |
2006-09-26 |
The Ohio State University |
Chemical monolayer and micro-electronic junctions and devices containing same
|
|
US6451685B1
(en)
*
|
2001-02-05 |
2002-09-17 |
Micron Technology, Inc. |
Method for multilevel copper interconnects for ultra large scale integration
|
|
WO2002067641A1
(en)
*
|
2001-02-21 |
2002-08-29 |
Kaneka Corporation |
Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process
|
|
WO2002077633A1
(en)
|
2001-03-23 |
2002-10-03 |
The Regents Of The University Of California |
Open circuit potential amperometry and voltammetry
|
|
US6642376B2
(en)
*
|
2001-04-30 |
2003-11-04 |
North Carolina State University |
Rational synthesis of heteroleptic lanthanide sandwich coordination complexes
|
|
JP4997670B2
(ja)
*
|
2001-06-29 |
2012-08-08 |
日本電気株式会社 |
共重合高分子膜の作製方法、前記形成方法で作製される共重合高分子膜、共重合高分子膜を利用する半導体装置
|
|
US20040231141A1
(en)
*
|
2001-07-06 |
2004-11-25 |
Masaru Nishinaka |
Laminate and its producing method
|
|
AU2002355856A1
(en)
*
|
2001-08-03 |
2003-02-17 |
Elisha Holding Llc |
An electroless process for treating metallic surfaces and products formed thereby
|
|
DE10140246A1
(de)
*
|
2001-08-09 |
2003-03-06 |
Forsch Pigmente Und Lacke E V |
Verfahren zur Behandlung von Oberflächen von Substraten
|
|
FR2829046B1
(fr)
*
|
2001-08-28 |
2005-01-14 |
Commissariat Energie Atomique |
Procede de greffage et de croissance d'un film organique conducteur sur une surface
|
|
CN1179613C
(zh)
*
|
2001-09-20 |
2004-12-08 |
联华电子股份有限公司 |
一种改善有机低介电常数层附着力的表面处理方法
|
|
US6765069B2
(en)
*
|
2001-09-28 |
2004-07-20 |
Biosurface Engineering Technologies, Inc. |
Plasma cross-linked hydrophilic coating
|
|
US7074519B2
(en)
|
2001-10-26 |
2006-07-11 |
The Regents Of The University Of California |
Molehole embedded 3-D crossbar architecture used in electrochemical molecular memory device
|
|
US7348206B2
(en)
*
|
2001-10-26 |
2008-03-25 |
The Regents Of The University Of California |
Formation of self-assembled monolayers of redox SAMs on silicon for molecular memory applications
|
|
US6674121B2
(en)
*
|
2001-12-14 |
2004-01-06 |
The Regents Of The University Of California |
Method and system for molecular charge storage field effect transistor
|
|
CN100395059C
(zh)
*
|
2001-12-18 |
2008-06-18 |
旭化成株式会社 |
金属氧化物分散体、由其得到的金属薄膜和生产该金属薄膜的方法
|
|
US6728129B2
(en)
|
2002-02-19 |
2004-04-27 |
The Regents Of The University Of California |
Multistate triple-decker dyads in three distinct architectures for information storage applications
|
|
JP4241098B2
(ja)
*
|
2002-03-05 |
2009-03-18 |
日立化成工業株式会社 |
金属張積層板、これを用いたプリント配線板およびその製造方法
|
|
TW573451B
(en)
*
|
2002-03-05 |
2004-01-21 |
Hitachi Chemical Co Ltd |
Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
|
|
JP2004006700A
(ja)
*
|
2002-03-27 |
2004-01-08 |
Seiko Epson Corp |
表面処理方法、表面処理基板、膜パターンの形成方法、電気光学装置の製造方法、電気光学装置、及び電子機器
|
|
JP2004006672A
(ja)
*
|
2002-04-19 |
2004-01-08 |
Dainippon Screen Mfg Co Ltd |
基板処理方法および基板処理装置
|
|
US6850096B2
(en)
*
|
2002-05-10 |
2005-02-01 |
Yoshio Nishida |
Interpolating sense amplifier circuits and methods of operating the same
|
|
US6900126B2
(en)
*
|
2002-11-20 |
2005-05-31 |
International Business Machines Corporation |
Method of forming metallized pattern
|
|
US6958270B2
(en)
|
2002-12-17 |
2005-10-25 |
North Carolina State University |
Methods of fabricating crossbar array microelectronic electrochemical cells
|
|
US6944047B2
(en)
|
2002-12-19 |
2005-09-13 |
North Carolina State University |
Variable-persistence molecular memory devices and methods of operation thereof
|
|
FR2851258B1
(fr)
*
|
2003-02-17 |
2007-03-30 |
Commissariat Energie Atomique |
Procede de revetement d'une surface, fabrication d'interconnexion en microelectronique utilisant ce procede, et circuits integres
|
|
FR2851181B1
(fr)
*
|
2003-02-17 |
2006-05-26 |
Commissariat Energie Atomique |
Procede de revetement d'une surface
|
|
DE10315877B4
(de)
|
2003-04-08 |
2005-11-17 |
Roche Diagnostics Gmbh |
Krankheitsverlaufkontrolle
|
|
AU2004256392B2
(en)
*
|
2003-04-28 |
2009-10-01 |
Oned Material Llc |
Super-hydrophobic surfaces, methods of their construction and uses therefor
|
|
US7312100B2
(en)
*
|
2003-05-27 |
2007-12-25 |
The North Carolina State University |
In situ patterning of electrolyte for molecular information storage devices
|
|
US7332599B2
(en)
*
|
2003-06-06 |
2008-02-19 |
North Carolina State University |
Methods and intermediates for the synthesis of dipyrrin-substituted porphyrinic macrocycles
|
|
US7026716B2
(en)
*
|
2003-06-06 |
2006-04-11 |
Rensselaer Polytechnic Institute |
Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers
|
|
US6943054B2
(en)
*
|
2003-07-25 |
2005-09-13 |
The Regents Of The University Of California |
Attachment of organic molecules to group III, IV or V substrates
|
|
US7223628B2
(en)
*
|
2003-07-25 |
2007-05-29 |
The Regents Of The University Of California |
High temperature attachment of organic molecules to substrates
|
|
US7056648B2
(en)
*
|
2003-09-17 |
2006-06-06 |
International Business Machines Corporation |
Method for isotropic etching of copper
|
|
US7324385B2
(en)
|
2004-01-28 |
2008-01-29 |
Zettacore, Inc. |
Molecular memory
|
|
US7307870B2
(en)
|
2004-01-28 |
2007-12-11 |
Zettacore, Inc. |
Molecular memory devices and methods
|
|
US20050162895A1
(en)
*
|
2004-01-28 |
2005-07-28 |
Kuhr Werner G. |
Molecular memory arrays and devices
|
|
US7695756B2
(en)
|
2004-04-29 |
2010-04-13 |
Zettacore, Inc. |
Systems, tools and methods for production of molecular memory
|
|
FR2868085B1
(fr)
*
|
2004-03-24 |
2006-07-14 |
Alchimer Sa |
Procede de revetement selectif d'une surface composite, fabrication d'interconnexions en microelectronique utilisant ce procede, et circuits integres
|
|
EP1581031B1
(en)
|
2004-03-25 |
2010-10-06 |
FUJIFILM Corporation |
Methods of forming a pattern and a conductive pattern
|
|
KR100638620B1
(ko)
*
|
2004-09-23 |
2006-10-26 |
삼성전기주식회사 |
임베디드 수동소자용 인쇄회로기판재료
|
|
WO2006058034A2
(en)
*
|
2004-11-22 |
2006-06-01 |
Intermolecular, Inc. |
Molecular self-assembly in substrate processing
|
|
US7566971B2
(en)
*
|
2005-05-27 |
2009-07-28 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device and manufacturing method thereof
|
|
US8173630B2
(en)
|
2005-06-03 |
2012-05-08 |
The Regents Of The University Of California |
Multipodal tethers for high-density attachment of redox-active moieties to substrates
|
|
KR100716304B1
(ko)
*
|
2005-06-30 |
2007-05-08 |
엘지.필립스 엘시디 주식회사 |
액정 표시 장치용 인쇄판 및 그의 제조 방법
|
|
JP2007073834A
(ja)
*
|
2005-09-08 |
2007-03-22 |
Shinko Electric Ind Co Ltd |
絶縁樹脂層上の配線形成方法
|
|
US20080131709A1
(en)
*
|
2006-09-28 |
2008-06-05 |
Aculon Inc. |
Composite structure with organophosphonate adherent layer and method of preparing
|
|
US8167684B2
(en)
*
|
2006-10-24 |
2012-05-01 |
Cabot Microelectronics Corporation |
Chemical mechanical polishing slurry, its preparation method, and use for the same
|
|
US8540899B2
(en)
*
|
2007-02-07 |
2013-09-24 |
Esionic Es, Inc. |
Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof
|