JP2009523633A5 - - Google Patents

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Publication number
JP2009523633A5
JP2009523633A5 JP2008551391A JP2008551391A JP2009523633A5 JP 2009523633 A5 JP2009523633 A5 JP 2009523633A5 JP 2008551391 A JP2008551391 A JP 2008551391A JP 2008551391 A JP2008551391 A JP 2008551391A JP 2009523633 A5 JP2009523633 A5 JP 2009523633A5
Authority
JP
Japan
Prior art keywords
film
crosslinkable precursor
adhesive film
adjacent
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008551391A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009523633A (ja
Filing date
Publication date
Priority claimed from US11/334,892 external-priority patent/US20070165075A1/en
Application filed filed Critical
Priority claimed from PCT/US2007/001339 external-priority patent/WO2007084619A1/en
Publication of JP2009523633A publication Critical patent/JP2009523633A/ja
Publication of JP2009523633A5 publication Critical patent/JP2009523633A5/ja
Pending legal-status Critical Current

Links

JP2008551391A 2006-01-19 2007-01-19 耐インク性カバーコートを有するフレキシブル回路 Pending JP2009523633A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/334,892 US20070165075A1 (en) 2006-01-19 2006-01-19 Flexible circuits having ink-resistant covercoats
US11/624,638 US7871150B2 (en) 2006-01-19 2007-01-18 Flexible circuits having ink-resistant covercoats
PCT/US2007/001339 WO2007084619A1 (en) 2006-01-19 2007-01-19 Flexible circuits having ink-resistant covercoats

Publications (2)

Publication Number Publication Date
JP2009523633A JP2009523633A (ja) 2009-06-25
JP2009523633A5 true JP2009523633A5 (enExample) 2010-04-02

Family

ID=38262774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008551391A Pending JP2009523633A (ja) 2006-01-19 2007-01-19 耐インク性カバーコートを有するフレキシブル回路

Country Status (4)

Country Link
US (2) US20070165075A1 (enExample)
JP (1) JP2009523633A (enExample)
KR (1) KR20080093996A (enExample)
CN (1) CN101370661B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110284268A1 (en) 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
CN102451798A (zh) * 2010-10-14 2012-05-16 研能科技股份有限公司 单孔喷嘴装置
US8794743B2 (en) * 2011-11-30 2014-08-05 Xerox Corporation Multi-film adhesive design for interfacial bonding printhead structures
US8529022B2 (en) * 2011-12-07 2013-09-10 Xerox Corporation Reduction of arc-tracking in chip on flexible circuit substrates
CN104081470A (zh) * 2012-04-18 2014-10-01 惠普发展公司，有限责任合伙企业 具有浮动接触器的柔性电路电缆
US8740357B1 (en) 2013-02-05 2014-06-03 Xerox Corporation Method and structure for sealing fine fluid features in a printing device
CN106538074B (zh) 2014-03-25 2020-03-06 斯特拉塔西斯公司 用在制造跨层图案的方法及系统
HK1245727A1 (zh) * 2015-03-25 2018-08-31 斯特拉塔西斯公司 导电油墨原位烧结的方法和系统
US11938477B2 (en) 2019-07-17 2024-03-26 The Procter & Gamble Company Microfluidic cartridge comprising silicone pressure-sensitive adhesive

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874974A (en) 1992-04-02 1999-02-23 Hewlett-Packard Company Reliable high performance drop generator for an inkjet printhead
US5751323A (en) 1994-10-04 1998-05-12 Hewlett-Packard Company Adhesiveless printhead attachment for ink-jet pen
EP0986480A1 (en) * 1997-06-06 2000-03-22 Minnesota Mining And Manufacturing Company Bonding system in an inkjet printer pen and method for providing the same
US6489042B2 (en) * 1998-12-23 2002-12-03 3M Innovative Properties Company Photoimageable dielectric material for circuit protection
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US6915566B2 (en) * 1999-03-01 2005-07-12 Texas Instruments Incorporated Method of fabricating flexible circuits for integrated circuit interconnections
JP4662598B2 (ja) 1999-09-06 2011-03-30 積水化学工業株式会社 反応性ホットメルト接着剤組成物
US6320137B1 (en) * 2000-04-11 2001-11-20 3M Innovative Properties Company Flexible circuit with coverplate layer and overlapping protective layer
JP2001311009A (ja) * 2000-04-28 2001-11-09 Daicel Chem Ind Ltd 熱融着性熱可塑性弾性体組成物及び複層成形体
JP2001316594A (ja) * 2000-05-10 2001-11-16 Daicel Chem Ind Ltd 耐久性に優れた熱可塑性弾性体組成物
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
JP2002344130A (ja) * 2001-05-15 2002-11-29 Canon Inc フレキシブル配線基板の接着方法、フレキシブル配線基板、該フレキシブル配線基板を用いたインクジェットヘッドユニット、およびインクジェット記録装置
TW508310B (en) 2001-09-25 2002-11-01 Acer Comm & Amp Multimedia Inc Ink cartridge and method of using flexible circuit board color to represent ink color in the ink cartridge
JP2003306651A (ja) * 2002-04-15 2003-10-31 Hitachi Chem Co Ltd 多層接着フィルム
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US7629537B2 (en) * 2004-07-09 2009-12-08 Finisar Corporation Single layer flex circuit
TW200718300A (en) 2005-08-29 2007-05-01 Innovex Inc Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing

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