CN101370661B - 涂有耐油墨保护层的柔性电路 - Google Patents

涂有耐油墨保护层的柔性电路 Download PDF

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Publication number
CN101370661B
CN101370661B CN2007800025365A CN200780002536A CN101370661B CN 101370661 B CN101370661 B CN 101370661B CN 2007800025365 A CN2007800025365 A CN 2007800025365A CN 200780002536 A CN200780002536 A CN 200780002536A CN 101370661 B CN101370661 B CN 101370661B
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CN
China
Prior art keywords
curing agent
inkjet printing
circuit
block copolymer
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800025365A
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English (en)
Chinese (zh)
Other versions
CN101370661A (zh
Inventor
罗纳德·L·伊姆肯
撒奇·G·张
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority claimed from PCT/US2007/001339 external-priority patent/WO2007084619A1/en
Publication of CN101370661A publication Critical patent/CN101370661A/zh
Application granted granted Critical
Publication of CN101370661B publication Critical patent/CN101370661B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN2007800025365A 2006-01-19 2007-01-19 涂有耐油墨保护层的柔性电路 Expired - Fee Related CN101370661B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11/334,892 2006-01-19
US11/334,892 US20070165075A1 (en) 2006-01-19 2006-01-19 Flexible circuits having ink-resistant covercoats
US11/624,638 2007-01-18
US11/624,638 US7871150B2 (en) 2006-01-19 2007-01-18 Flexible circuits having ink-resistant covercoats
PCT/US2007/001339 WO2007084619A1 (en) 2006-01-19 2007-01-19 Flexible circuits having ink-resistant covercoats

Publications (2)

Publication Number Publication Date
CN101370661A CN101370661A (zh) 2009-02-18
CN101370661B true CN101370661B (zh) 2011-04-13

Family

ID=38262774

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800025365A Expired - Fee Related CN101370661B (zh) 2006-01-19 2007-01-19 涂有耐油墨保护层的柔性电路

Country Status (4)

Country Link
US (2) US20070165075A1 (enExample)
JP (1) JP2009523633A (enExample)
KR (1) KR20080093996A (enExample)
CN (1) CN101370661B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011146258A2 (en) 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
CN102451798A (zh) * 2010-10-14 2012-05-16 研能科技股份有限公司 单孔喷嘴装置
US8794743B2 (en) * 2011-11-30 2014-08-05 Xerox Corporation Multi-film adhesive design for interfacial bonding printhead structures
US8529022B2 (en) * 2011-12-07 2013-09-10 Xerox Corporation Reduction of arc-tracking in chip on flexible circuit substrates
KR20150001715A (ko) * 2012-04-18 2015-01-06 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 부동 접점을 가진 플렉시블 회로 케이블
US8740357B1 (en) 2013-02-05 2014-06-03 Xerox Corporation Method and structure for sealing fine fluid features in a printing device
US11090858B2 (en) 2014-03-25 2021-08-17 Stratasys Ltd. Method and system for fabricating cross-layer pattern
WO2016151586A1 (en) * 2015-03-25 2016-09-29 Stratasys Ltd. Method and system for in situ sintering of conductive ink
US11938477B2 (en) * 2019-07-17 2024-03-26 The Procter & Gamble Company Microfluidic cartridge comprising silicone pressure-sensitive adhesive

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874974A (en) * 1992-04-02 1999-02-23 Hewlett-Packard Company Reliable high performance drop generator for an inkjet printhead
US5924198A (en) * 1994-10-04 1999-07-20 Hewlett-Packard Company Method of forming an ink-resistant seal between a printhead assembly and the headland region of an ink-jet pen cartridge.
US6860592B2 (en) * 2001-09-25 2005-03-01 Benq Corporation Inkjet cartridge and method of identifying color of ink thereof by flexible printed circuit board

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010013348A (ko) * 1997-06-06 2001-02-26 스프레이그 로버트 월터 잉크젯 프린터 펜 중의 결합 시스템 및 이 시스템을제공하는 방법
US6489042B2 (en) * 1998-12-23 2002-12-03 3M Innovative Properties Company Photoimageable dielectric material for circuit protection
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US6915566B2 (en) * 1999-03-01 2005-07-12 Texas Instruments Incorporated Method of fabricating flexible circuits for integrated circuit interconnections
JP4662598B2 (ja) 1999-09-06 2011-03-30 積水化学工業株式会社 反応性ホットメルト接着剤組成物
US6320137B1 (en) * 2000-04-11 2001-11-20 3M Innovative Properties Company Flexible circuit with coverplate layer and overlapping protective layer
JP2001311009A (ja) * 2000-04-28 2001-11-09 Daicel Chem Ind Ltd 熱融着性熱可塑性弾性体組成物及び複層成形体
JP2001316594A (ja) * 2000-05-10 2001-11-16 Daicel Chem Ind Ltd 耐久性に優れた熱可塑性弾性体組成物
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
JP2002344130A (ja) * 2001-05-15 2002-11-29 Canon Inc フレキシブル配線基板の接着方法、フレキシブル配線基板、該フレキシブル配線基板を用いたインクジェットヘッドユニット、およびインクジェット記録装置
JP2003306651A (ja) * 2002-04-15 2003-10-31 Hitachi Chem Co Ltd 多層接着フィルム
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US7629537B2 (en) * 2004-07-09 2009-12-08 Finisar Corporation Single layer flex circuit
TW200718300A (en) 2005-08-29 2007-05-01 Innovex Inc Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874974A (en) * 1992-04-02 1999-02-23 Hewlett-Packard Company Reliable high performance drop generator for an inkjet printhead
US5924198A (en) * 1994-10-04 1999-07-20 Hewlett-Packard Company Method of forming an ink-resistant seal between a printhead assembly and the headland region of an ink-jet pen cartridge.
US6860592B2 (en) * 2001-09-25 2005-03-01 Benq Corporation Inkjet cartridge and method of identifying color of ink thereof by flexible printed circuit board

Also Published As

Publication number Publication date
CN101370661A (zh) 2009-02-18
US7871150B2 (en) 2011-01-18
US20070165075A1 (en) 2007-07-19
JP2009523633A (ja) 2009-06-25
US20070165076A1 (en) 2007-07-19
KR20080093996A (ko) 2008-10-22

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110413

Termination date: 20180119

CF01 Termination of patent right due to non-payment of annual fee