KR20080093996A - 내잉크성 커버코트를 구비한 가요성 회로 - Google Patents

내잉크성 커버코트를 구비한 가요성 회로 Download PDF

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Publication number
KR20080093996A
KR20080093996A KR1020087017525A KR20087017525A KR20080093996A KR 20080093996 A KR20080093996 A KR 20080093996A KR 1020087017525 A KR1020087017525 A KR 1020087017525A KR 20087017525 A KR20087017525 A KR 20087017525A KR 20080093996 A KR20080093996 A KR 20080093996A
Authority
KR
South Korea
Prior art keywords
circuit
film
block copolymer
flexible circuit
inkjet printer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087017525A
Other languages
English (en)
Korean (ko)
Inventor
로날드 엘. 임켄
타치 지. 트루옹
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20080093996A publication Critical patent/KR20080093996A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020087017525A 2006-01-19 2007-01-19 내잉크성 커버코트를 구비한 가요성 회로 Withdrawn KR20080093996A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/334,892 US20070165075A1 (en) 2006-01-19 2006-01-19 Flexible circuits having ink-resistant covercoats
US11/334,892 2006-01-19
US11/624,638 US7871150B2 (en) 2006-01-19 2007-01-18 Flexible circuits having ink-resistant covercoats
US11/624,638 2007-01-18

Publications (1)

Publication Number Publication Date
KR20080093996A true KR20080093996A (ko) 2008-10-22

Family

ID=38262774

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087017525A Withdrawn KR20080093996A (ko) 2006-01-19 2007-01-19 내잉크성 커버코트를 구비한 가요성 회로

Country Status (4)

Country Link
US (2) US20070165075A1 (enExample)
JP (1) JP2009523633A (enExample)
KR (1) KR20080093996A (enExample)
CN (1) CN101370661B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102907184B (zh) * 2010-05-20 2016-08-24 3M创新有限公司 柔性电路覆盖膜的附着增强
CN102451798A (zh) * 2010-10-14 2012-05-16 研能科技股份有限公司 单孔喷嘴装置
US8794743B2 (en) * 2011-11-30 2014-08-05 Xerox Corporation Multi-film adhesive design for interfacial bonding printhead structures
US8529022B2 (en) * 2011-12-07 2013-09-10 Xerox Corporation Reduction of arc-tracking in chip on flexible circuit substrates
WO2013158094A1 (en) * 2012-04-18 2013-10-24 Hewlett-Packard Development Company, L.P. Flexible circuit cable with floating contact
US8740357B1 (en) 2013-02-05 2014-06-03 Xerox Corporation Method and structure for sealing fine fluid features in a printing device
KR20160138156A (ko) 2014-03-25 2016-12-02 스트라타시스 엘티디. 교차 계층 패턴의 제조 방법 및 시스템
KR20170130515A (ko) * 2015-03-25 2017-11-28 스트라타시스 엘티디. 전도성 잉크의 인 시츄 소결을 위한 방법 및 시스템
US11938477B2 (en) * 2019-07-17 2024-03-26 The Procter & Gamble Company Microfluidic cartridge comprising silicone pressure-sensitive adhesive

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874974A (en) 1992-04-02 1999-02-23 Hewlett-Packard Company Reliable high performance drop generator for an inkjet printhead
US5751323A (en) 1994-10-04 1998-05-12 Hewlett-Packard Company Adhesiveless printhead attachment for ink-jet pen
AU7599598A (en) * 1997-06-06 1998-12-21 Minnesota Mining And Manufacturing Company Bonding system in an inkjet printer pen and method for providing the same
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US6489042B2 (en) * 1998-12-23 2002-12-03 3M Innovative Properties Company Photoimageable dielectric material for circuit protection
US6915566B2 (en) * 1999-03-01 2005-07-12 Texas Instruments Incorporated Method of fabricating flexible circuits for integrated circuit interconnections
JP4662598B2 (ja) 1999-09-06 2011-03-30 積水化学工業株式会社 反応性ホットメルト接着剤組成物
US6320137B1 (en) * 2000-04-11 2001-11-20 3M Innovative Properties Company Flexible circuit with coverplate layer and overlapping protective layer
JP2001311009A (ja) * 2000-04-28 2001-11-09 Daicel Chem Ind Ltd 熱融着性熱可塑性弾性体組成物及び複層成形体
JP2001316594A (ja) * 2000-05-10 2001-11-16 Daicel Chem Ind Ltd 耐久性に優れた熱可塑性弾性体組成物
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
JP2002344130A (ja) * 2001-05-15 2002-11-29 Canon Inc フレキシブル配線基板の接着方法、フレキシブル配線基板、該フレキシブル配線基板を用いたインクジェットヘッドユニット、およびインクジェット記録装置
TW508310B (en) 2001-09-25 2002-11-01 Acer Comm & Amp Multimedia Inc Ink cartridge and method of using flexible circuit board color to represent ink color in the ink cartridge
JP2003306651A (ja) * 2002-04-15 2003-10-31 Hitachi Chem Co Ltd 多層接着フィルム
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US7629537B2 (en) * 2004-07-09 2009-12-08 Finisar Corporation Single layer flex circuit
TW200718300A (en) 2005-08-29 2007-05-01 Innovex Inc Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing

Also Published As

Publication number Publication date
CN101370661A (zh) 2009-02-18
US20070165075A1 (en) 2007-07-19
US20070165076A1 (en) 2007-07-19
US7871150B2 (en) 2011-01-18
JP2009523633A (ja) 2009-06-25
CN101370661B (zh) 2011-04-13

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20080718

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid