AU7599598A - Bonding system in an inkjet printer pen and method for providing the same - Google Patents

Bonding system in an inkjet printer pen and method for providing the same

Info

Publication number
AU7599598A
AU7599598A AU75995/98A AU7599598A AU7599598A AU 7599598 A AU7599598 A AU 7599598A AU 75995/98 A AU75995/98 A AU 75995/98A AU 7599598 A AU7599598 A AU 7599598A AU 7599598 A AU7599598 A AU 7599598A
Authority
AU
Australia
Prior art keywords
providing
same
inkjet printer
bonding system
printer pen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU75995/98A
Inventor
Clayton A George
Robert R. Rohloff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of AU7599598A publication Critical patent/AU7599598A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14362—Assembling elements of heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
AU75995/98A 1997-06-06 1998-05-26 Bonding system in an inkjet printer pen and method for providing the same Abandoned AU7599598A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US87016297A 1997-06-06 1997-06-06
US08870162 1997-06-06
PCT/US1998/010717 WO1998055316A1 (en) 1997-06-06 1998-05-26 Bonding system in an inkjet printer pen and method for providing the same

Publications (1)

Publication Number Publication Date
AU7599598A true AU7599598A (en) 1998-12-21

Family

ID=25354891

Family Applications (1)

Application Number Title Priority Date Filing Date
AU75995/98A Abandoned AU7599598A (en) 1997-06-06 1998-05-26 Bonding system in an inkjet printer pen and method for providing the same

Country Status (7)

Country Link
EP (1) EP0986480A1 (en)
JP (1) JP2002504032A (en)
KR (1) KR20010013348A (en)
CN (1) CN1259085A (en)
AU (1) AU7599598A (en)
BR (1) BR9809732A (en)
WO (1) WO1998055316A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6210522B1 (en) 1999-06-15 2001-04-03 Lexmark International, Inc. Adhesive bonding laminates
US6543890B1 (en) * 2001-12-19 2003-04-08 3M Innovative Properties Company Method and apparatus for radiation curing of ink used in inkjet printing
CN100541673C (en) * 2003-06-19 2009-09-16 矢崎总业株式会社 coloring nozzle for electric wire
US20070165075A1 (en) * 2006-01-19 2007-07-19 3M Innovative Properties Company Flexible circuits having ink-resistant covercoats
US20070236542A1 (en) * 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
CN102153963A (en) * 2011-03-28 2011-08-17 常州拓邦新材料科技有限公司 Hot-melt pressure-sensitive structural adhesive film and preparation technique thereof
JP2013048680A (en) * 2011-08-30 2013-03-14 Gc Corp Occlusal pressure measuring device and occlusal pressure measuring system
KR102128734B1 (en) 2014-01-28 2020-07-01 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. Flexible carrier
CN111394028A (en) * 2019-05-08 2020-07-10 枚林优交(上海)新材料开发有限公司 Photo-activated delayed thermosetting adhesive and preparation method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1051391A (en) 1959-12-24
US4256828A (en) 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US5089536A (en) 1982-11-22 1992-02-18 Minnesota Mining And Manufacturing Company Energy polmerizable compositions containing organometallic initiators
US5568171A (en) * 1992-04-02 1996-10-22 Hewlett-Packard Company Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof
DE69329359T2 (en) * 1992-06-01 2001-03-08 Canon Kk Method of manufacturing an ink jet recording head
CA2101454C (en) * 1992-07-31 1998-09-22 Kenjiro Watanabe Ink jet recording head, ink jet recording head cartridge, recording apparatus using the same and method of manufacturing the head
CA2115888A1 (en) 1993-04-15 1994-10-16 Clayton A. George Epoxy/polyester hot melt compositions
US5388326A (en) * 1993-09-07 1995-02-14 Hewlett-Packard Corporation Self aligning orifice construction for thermal ink-jet printheads
JPH07314671A (en) * 1994-05-25 1995-12-05 Citizen Watch Co Ltd Recording head for ink jet recorder
US5637166A (en) * 1994-10-04 1997-06-10 Hewlett-Packard Company Similar material thermal tab attachment process for ink-jet pen
JP3176245B2 (en) * 1995-03-23 2001-06-11 シャープ株式会社 Inkjet head
US6243117B1 (en) * 1995-05-12 2001-06-05 Lexmark International, Inc. Print head cartridge and method of making a print head cartridge by one-shot injection molding

Also Published As

Publication number Publication date
JP2002504032A (en) 2002-02-05
WO1998055316A1 (en) 1998-12-10
KR20010013348A (en) 2001-02-26
BR9809732A (en) 2000-07-11
EP0986480A1 (en) 2000-03-22
CN1259085A (en) 2000-07-05

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase