JP2010534931A5 - - Google Patents
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- JP2010534931A5 JP2010534931A5 JP2010517514A JP2010517514A JP2010534931A5 JP 2010534931 A5 JP2010534931 A5 JP 2010534931A5 JP 2010517514 A JP2010517514 A JP 2010517514A JP 2010517514 A JP2010517514 A JP 2010517514A JP 2010534931 A5 JP2010534931 A5 JP 2010534931A5
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- Japan
- Prior art keywords
- light
- semiconductor structure
- emitted
- ceramic layer
- disposed
- Prior art date
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- 239000004065 semiconductor Substances 0.000 claims 9
- 239000000919 ceramic Substances 0.000 claims 7
- 239000004038 photonic crystal Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
Claims (14)
- n型領域とp型領域との間に配される光放射層と、半導体構造の面内又は面上に形成される屈折率の変動部であって、光結晶である屈折率の前記変動部とを有する前記半導体構造と、前記光放射層により放射される光の通路に配される、波長変換物質を有するセラミック層とを有する、デバイス。
- 前記セラミック層が剛性の凝集蛍光体粒子を有する、請求項1に記載のデバイス。
- 前記デバイスの半導体層の全体の厚さが約1μmより小さい、請求項1に記載のデバイス。
- 前記セラミック層の面が加工されている、請求項1に記載のデバイス。
- ホスト基板を更に有する請求項1に記載のデバイスであって、前記半導体構造が前記ホスト基板に取り付けられ、前記セラミック層が前記ホスト基板とは反対側の前記半導体構造の面近くに配される、デバイス。
- 前記半導体構造と前記セラミック層との間に配される光バルブを更に有する、請求項1に記載のデバイス。
- 前記光バルブが誘電体積層、配布されたブラッグリフレクタ、ダイクロイックフィルタ、2次元光結晶及び3次元光結晶のうちの一つを有する、請求項6に記載のデバイス。
- 屈折率の前記変動部が、あらかじめ決められた角度放射プロフィール内の光を放射し、前記光バルブが、前記あらかじめ決められた角度放射プロフィール内で放射されて前記光バルブに入射する主要な部分の光を透過する、請求項6に記載のデバイス。
- 前記半導体構造から出る光の60%より多い光が前記半導体構造の主表面に対する法線から円錐45°内で放射され、前記円錐45°内で放射される光の90%より多い光が前記光バルブにより透過される、請求項8に記載のデバイス。
- 前記セラミック層により放射される光の10%より少ない光が前記光バルブにより透過される、請求項9に記載のデバイス。
- 前記光放射層により放射される光の通路に配される誘電体集光器を更に有する、請求項1に記載のデバイス。
- 前記誘電体集光器がガラスレンズである、請求項11に記載のデバイス。
- 屈折率の前記変動部が、あらかじめ決められた放射プロフィール内で光を放射し、前記誘電体集光器は、前記あらかじめ決められた放射プロフィール内で放射される主要な光が前記誘電体集光器へ放射されるように構成されている、請求項11に記載のデバイス。
- 反射層を更に有する請求項1に記載のデバイスであって、前記セラミック層が前記反射層と前記半導体構造との間に配される、デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/829,799 US20070267646A1 (en) | 2004-06-03 | 2007-07-27 | Light Emitting Device Including a Photonic Crystal and a Luminescent Ceramic |
US11/829,799 | 2007-07-27 | ||
PCT/IB2008/052687 WO2009016529A1 (en) | 2007-07-27 | 2008-07-03 | Light emitting device including a photonic crystal and a luminescent ceramic |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010534931A JP2010534931A (ja) | 2010-11-11 |
JP2010534931A5 true JP2010534931A5 (ja) | 2011-08-18 |
JP5746505B2 JP5746505B2 (ja) | 2015-07-08 |
Family
ID=40039980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010517514A Active JP5746505B2 (ja) | 2007-07-27 | 2008-07-03 | 光結晶及び発光セラミックを含む光放射デバイス |
Country Status (9)
Country | Link |
---|---|
US (2) | US20070267646A1 (ja) |
EP (1) | EP2176892B1 (ja) |
JP (1) | JP5746505B2 (ja) |
KR (1) | KR20100052504A (ja) |
CN (1) | CN101821862B (ja) |
BR (1) | BRPI0814324A2 (ja) |
RU (1) | RU2479072C2 (ja) |
TW (1) | TWI481066B (ja) |
WO (1) | WO2009016529A1 (ja) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070020578A1 (en) * | 2005-07-19 | 2007-01-25 | Scott Robert R | Dental curing light having a short wavelength LED and a fluorescing lens for converting wavelength light to curing wavelengths and related method |
KR100571818B1 (ko) * | 2003-10-08 | 2006-04-17 | 삼성전자주식회사 | 질화물계 발광소자 및 그 제조방법 |
CN101103088A (zh) * | 2005-01-10 | 2008-01-09 | 皇家飞利浦电子股份有限公司 | 包含陶瓷发光转换器的照明系统 |
US7581994B2 (en) * | 2006-08-10 | 2009-09-01 | The Boeing Company | Method and assembly for establishing an electrical interface between parts |
KR101338698B1 (ko) * | 2007-04-16 | 2013-12-06 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 |
US20090050921A1 (en) * | 2007-08-23 | 2009-02-26 | Philips Lumileds Lighting Company Llc | Light Emitting Diode Array |
US20090154137A1 (en) * | 2007-12-14 | 2009-06-18 | Philips Lumileds Lighting Company, Llc | Illumination Device Including Collimating Optics |
DE102007061140A1 (de) * | 2007-12-19 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit Kühlelement |
WO2009079777A1 (en) * | 2007-12-21 | 2009-07-02 | The University Of British Columbia | Gallium arsenide semiconductor material incorporating bismuth and process for epitaxial growth |
JP4575966B2 (ja) * | 2008-02-27 | 2010-11-04 | 株式会社沖データ | 半導体装置 |
CN102015961A (zh) * | 2008-06-02 | 2011-04-13 | 松下电器产业株式会社 | 半导体发光设备以及使用所述半导体发光设备的光源设备 |
US10147843B2 (en) * | 2008-07-24 | 2018-12-04 | Lumileds Llc | Semiconductor light emitting device including a window layer and a light-directing structure |
KR20110053377A (ko) * | 2008-09-04 | 2011-05-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 향상된 단색성을 갖는 광원 |
WO2010027649A1 (en) * | 2008-09-04 | 2010-03-11 | 3M Innovative Properties Company | Monochromatic light source with high aspect ratio |
WO2010027648A1 (en) * | 2008-09-04 | 2010-03-11 | 3M Innovative Properties Company | I i-vi mqw vcsel on a heat sink optically pumped by a gan ld |
WO2010027581A1 (en) | 2008-09-04 | 2010-03-11 | 3M Innovative Properties Company | Monochromatic light source |
DE102008046523B4 (de) * | 2008-09-10 | 2020-10-29 | Osram Gmbh | Leuchtmittel |
EP2346101A4 (en) * | 2008-10-15 | 2015-11-25 | Koito Mfg Co Ltd | LIGHT-EMITTING MODULE, MANUFACTURING METHOD FOR A LIGHT-EMITTING MODULE AND LIGHTING BODY |
EP2374165B1 (en) * | 2008-12-02 | 2019-01-09 | Lumileds Holding B.V. | Led assembly |
US9711688B2 (en) | 2008-12-02 | 2017-07-18 | Koninklijke Philips N.V. | Controlling LED emission pattern using optically active materials |
EP3427690B1 (en) | 2008-12-30 | 2020-09-30 | Ultradent Products, Inc. | Dental curing light having unibody design that acts as a heat sink |
TWI470823B (zh) | 2009-02-11 | 2015-01-21 | Epistar Corp | 發光元件及其製造方法 |
US20140175377A1 (en) * | 2009-04-07 | 2014-06-26 | Soraa, Inc. | Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors |
CN102414850B (zh) * | 2009-04-21 | 2014-07-09 | 皇家飞利浦电子股份有限公司 | 具有磷光体的照明装置 |
JP6164843B2 (ja) * | 2009-05-28 | 2017-07-19 | フィリップス ライティング ホールディング ビー ヴィ | 光源を囲むエンベロープを具備する照明装置 |
DE102009023351A1 (de) * | 2009-05-29 | 2010-12-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
US9322973B2 (en) * | 2009-07-16 | 2016-04-26 | Koninklijke Philips N.V. | Lighting device with light sources positioned near the bottom surface of a waveguide |
DE102009027977A1 (de) * | 2009-07-23 | 2011-01-27 | Osram Opto Semiconductors Gmbh | Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode |
US8580593B2 (en) * | 2009-09-10 | 2013-11-12 | Micron Technology, Inc. | Epitaxial formation structures and associated methods of manufacturing solid state lighting devices |
US20110062472A1 (en) * | 2009-09-17 | 2011-03-17 | Koninklijke Philips Electronics N.V. | Wavelength-converted semiconductor light emitting device |
KR20110043282A (ko) * | 2009-10-21 | 2011-04-27 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
EP2323184A1 (en) * | 2009-11-13 | 2011-05-18 | Koninklijke Philips Electronics N.V. | LED assembly |
JP2011108588A (ja) * | 2009-11-20 | 2011-06-02 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
KR101181000B1 (ko) * | 2009-12-29 | 2012-09-07 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법 및 발광소자 패키지 |
KR101020995B1 (ko) | 2010-02-18 | 2011-03-09 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
US9991427B2 (en) * | 2010-03-08 | 2018-06-05 | Cree, Inc. | Photonic crystal phosphor light conversion structures for light emitting devices |
WO2012014360A1 (ja) * | 2010-07-26 | 2012-02-02 | 株式会社小糸製作所 | 発光モジュール |
JP2012038889A (ja) * | 2010-08-06 | 2012-02-23 | Koito Mfg Co Ltd | 蛍光部材および発光モジュール |
KR20120024104A (ko) * | 2010-09-06 | 2012-03-14 | 서울옵토디바이스주식회사 | 발광 소자 |
CN103180945B (zh) * | 2010-10-27 | 2016-12-07 | 皇家飞利浦电子股份有限公司 | 用于制造发光器件的层压支撑膜及其制造方法 |
JP5002703B2 (ja) | 2010-12-08 | 2012-08-15 | 株式会社東芝 | 半導体発光素子 |
DE102011010118A1 (de) | 2011-02-02 | 2012-08-02 | Osram Opto Semiconductors Gmbh | Keramisches Konversionselement, Halbleiterchip mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements |
JP2012186414A (ja) * | 2011-03-08 | 2012-09-27 | Toshiba Corp | 発光装置 |
US8841146B2 (en) | 2011-09-12 | 2014-09-23 | SemiLEDs Optoelectronics Co., Ltd. | Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics |
US8912021B2 (en) | 2011-09-12 | 2014-12-16 | SemiLEDs Optoelectronics Co., Ltd. | System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers |
US8492746B2 (en) | 2011-09-12 | 2013-07-23 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) dice having wavelength conversion layers |
US8410508B1 (en) | 2011-09-12 | 2013-04-02 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method |
JP2013110273A (ja) * | 2011-11-21 | 2013-06-06 | Sharp Corp | 半導体発光装置 |
JP5426650B2 (ja) * | 2011-12-22 | 2014-02-26 | 株式会社東芝 | 半導体発光素子 |
JP5990014B2 (ja) * | 2012-03-13 | 2016-09-07 | スタンレー電気株式会社 | 半導体発光素子及びその製造方法 |
CN102757229A (zh) * | 2012-07-03 | 2012-10-31 | 深圳光启创新技术有限公司 | 一种共形陶瓷超材料及其制备方法 |
EP2896077B1 (en) * | 2012-09-17 | 2019-01-16 | Lumileds Holding B.V. | Light emitting device including shaped substrate |
DE102012109650A1 (de) * | 2012-10-10 | 2014-04-10 | Osram Opto Semiconductors Gmbh | Keramisches Konversionselement, optoelektronisches Halbleiterelement und Verfahren zur Herstellung eines keramischen Konversionselements |
KR101493601B1 (ko) | 2013-07-17 | 2015-02-13 | 쌩-고벵 글래스 프랑스 | 발광 디바이스용 적층체 및 그의 제조 방법 |
CN105393370B (zh) * | 2013-07-22 | 2018-11-13 | 亮锐控股有限公司 | 倒装芯片侧发射式led |
RU2541394C1 (ru) * | 2013-10-18 | 2015-02-10 | федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский ядерный университет МИФИ" (НИЯУ МИФИ) | Синий флип-чип светодиода на нитридных гетероструктурах |
JP6438648B2 (ja) | 2013-11-15 | 2018-12-19 | 日亜化学工業株式会社 | 半導体発光装置およびその製造方法 |
JP5768159B2 (ja) * | 2014-03-14 | 2015-08-26 | 株式会社小糸製作所 | 半導体素子の製造方法 |
CN106461182B (zh) * | 2014-06-05 | 2020-01-31 | 飞利浦照明控股有限公司 | 具有增加的效率的发光聚光器 |
US9373761B2 (en) * | 2014-09-23 | 2016-06-21 | Osram Sylvania Inc. | Patterned thin-film wavelength converter and method of making same |
US9580650B1 (en) | 2014-12-25 | 2017-02-28 | DM Lighting Technologies Inc. | Method of manufacturing Ce:YAG polycrystalline phosphor |
JP6230038B2 (ja) * | 2015-09-03 | 2017-11-15 | 丸文株式会社 | 深紫外led及びその製造方法 |
WO2017168811A1 (ja) | 2016-03-30 | 2017-10-05 | 丸文株式会社 | 深紫外led及びその製造方法 |
AU2017263569B2 (en) * | 2016-05-13 | 2022-09-15 | Corning Incorporated | Quantum memory systems and quantum repeater systems comprising doped polycrystalline ceramic optical devices and methods of manufacturing the same |
DE102016109308B4 (de) | 2016-05-20 | 2024-01-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes bauelement |
TWI685961B (zh) * | 2016-06-17 | 2020-02-21 | 優顯科技股份有限公司 | 光電半導體裝置 |
EP3492556A4 (en) | 2016-07-27 | 2019-10-02 | Mitsubishi Chemical Corporation | SINTER PHOSPHOR, LIGHT EMITTING DEVICE, LIGHTING DEVICE AND VEHICLE LAMP LAMP |
KR101880078B1 (ko) * | 2016-12-07 | 2018-07-20 | 한국기계연구원 | 플라즈모닉 메타표면 제작방법 |
US10553280B2 (en) | 2017-03-01 | 2020-02-04 | Corning Incorporated | Quantum memory systems and quantum repeater systems comprising doped polycrystalline ceramic optical devices and methods of manufacturing the same |
FR3068173B1 (fr) * | 2017-06-27 | 2020-05-15 | Aledia | Dispositif optoelectronique |
JP7316610B6 (ja) | 2018-01-26 | 2024-02-19 | 丸文株式会社 | 深紫外led及びその製造方法 |
EP3857553A1 (en) | 2018-09-24 | 2021-08-04 | Corning Incorporated | Rare-earth doped metal oxide ceramic waveguide quantum memories and methods of manufacturing the same |
US10804440B2 (en) | 2018-12-21 | 2020-10-13 | Lumileds Holding B.V. | Light extraction through adhesive layer between LED and converter |
WO2020128626A1 (en) * | 2018-12-21 | 2020-06-25 | Lumileds Holding B.V. | Improved light extraction through adhesive layer between led and converter |
WO2020132843A1 (zh) * | 2018-12-24 | 2020-07-02 | 泉州三安半导体科技有限公司 | 一种发光二极管及其制作方法 |
CN109841714B (zh) * | 2019-01-09 | 2020-12-11 | 南京邮电大学 | 垂直结构近紫外发光二极管及其制备方法 |
CN112117637B (zh) * | 2019-06-21 | 2024-03-08 | 富昱晶雷射科技股份有限公司 | 倒晶式的电激发光子晶体面射型激光元件 |
DE102021128854A1 (de) * | 2021-11-05 | 2023-05-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenemittierender halbleiterlaser und verfahren zur herstellung eines oberflächenemittierenden halbleiterlasers |
DE102022103128A1 (de) | 2022-02-10 | 2023-08-10 | Ams-Osram International Gmbh | Optoelektronisches halbleiterlaserbauelement und optoelektronische anordnung |
FR3136863A1 (fr) * | 2022-06-20 | 2023-12-22 | Aledia | Elément émetteur de lumière à générateur d’onde stationnaire et dispositif optoélectronique associé |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010042866A1 (en) * | 1999-02-05 | 2001-11-22 | Carrie Carter Coman | Inxalygazn optical emitters fabricated via substrate removal |
US6155699A (en) * | 1999-03-15 | 2000-12-05 | Agilent Technologies, Inc. | Efficient phosphor-conversion led structure |
US6504156B1 (en) * | 1999-07-16 | 2003-01-07 | Kabushiki Kaisha Toshiba | Ceramic scintillator material and manufacturing method thereof, and radiation detector therewith and radiation inspection apparatus therewith |
US6630691B1 (en) * | 1999-09-27 | 2003-10-07 | Lumileds Lighting U.S., Llc | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
US6696703B2 (en) * | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
US6486499B1 (en) * | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
US7064355B2 (en) * | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
US6650044B1 (en) * | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
US6630692B2 (en) * | 2001-05-29 | 2003-10-07 | Lumileds Lighting U.S., Llc | III-Nitride light emitting devices with low driving voltage |
US6576488B2 (en) * | 2001-06-11 | 2003-06-10 | Lumileds Lighting U.S., Llc | Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor |
US6878973B2 (en) * | 2001-08-23 | 2005-04-12 | Lumileds Lighting U.S., Llc | Reduction of contamination of light emitting devices |
US7279718B2 (en) * | 2002-01-28 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | LED including photonic crystal structure |
US6828596B2 (en) * | 2002-06-13 | 2004-12-07 | Lumileds Lighting U.S., Llc | Contacting scheme for large and small area semiconductor light emitting flip chip devices |
US7554258B2 (en) * | 2002-10-22 | 2009-06-30 | Osram Opto Semiconductors Gmbh | Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body |
US6917057B2 (en) * | 2002-12-31 | 2005-07-12 | Gelcore Llc | Layered phosphor coatings for LED devices |
CN100379040C (zh) * | 2003-01-27 | 2008-04-02 | 3M创新有限公司 | 具有柔性短通反射器的基于荧光粉的光源 |
US20040145289A1 (en) * | 2003-01-27 | 2004-07-29 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar short pass reflector and method of making |
US7211831B2 (en) * | 2003-04-15 | 2007-05-01 | Luminus Devices, Inc. | Light emitting device with patterned surfaces |
US6831302B2 (en) * | 2003-04-15 | 2004-12-14 | Luminus Devices, Inc. | Light emitting devices with improved extraction efficiency |
US7083993B2 (en) * | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Methods of making multi-layer light emitting devices |
US7166871B2 (en) * | 2003-04-15 | 2007-01-23 | Luminus Devices, Inc. | Light emitting systems |
US6876008B2 (en) * | 2003-07-31 | 2005-04-05 | Lumileds Lighting U.S., Llc | Mount for semiconductor light emitting device |
US7009213B2 (en) * | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
JP2005158795A (ja) * | 2003-11-20 | 2005-06-16 | Sumitomo Electric Ind Ltd | 発光ダイオード及び半導体発光装置 |
US7250715B2 (en) * | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
US7408201B2 (en) * | 2004-03-19 | 2008-08-05 | Philips Lumileds Lighting Company, Llc | Polarized semiconductor light emitting device |
US20050205883A1 (en) * | 2004-03-19 | 2005-09-22 | Wierer Jonathan J Jr | Photonic crystal light emitting device |
JP4836410B2 (ja) * | 2004-04-07 | 2011-12-14 | シャープ株式会社 | 窒化物半導体発光素子およびその製造方法 |
US6956246B1 (en) * | 2004-06-03 | 2005-10-18 | Lumileds Lighting U.S., Llc | Resonant cavity III-nitride light emitting devices fabricated by growth substrate removal |
US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
US7256483B2 (en) * | 2004-10-28 | 2007-08-14 | Philips Lumileds Lighting Company, Llc | Package-integrated thin film LED |
US7754507B2 (en) * | 2005-06-09 | 2010-07-13 | Philips Lumileds Lighting Company, Llc | Method of removing the growth substrate of a semiconductor light emitting device |
KR100640497B1 (ko) * | 2005-11-24 | 2006-11-01 | 삼성전기주식회사 | 수직 구조 질화갈륨계 발광다이오드 소자 |
-
2007
- 2007-07-27 US US11/829,799 patent/US20070267646A1/en not_active Abandoned
-
2008
- 2008-07-03 JP JP2010517514A patent/JP5746505B2/ja active Active
- 2008-07-03 RU RU2010107241/28A patent/RU2479072C2/ru active
- 2008-07-03 CN CN2008801008520A patent/CN101821862B/zh active Active
- 2008-07-03 WO PCT/IB2008/052687 patent/WO2009016529A1/en active Application Filing
- 2008-07-03 BR BRPI0814324-2A2A patent/BRPI0814324A2/pt not_active Application Discontinuation
- 2008-07-03 EP EP08776564.0A patent/EP2176892B1/en active Active
- 2008-07-03 KR KR1020107004607A patent/KR20100052504A/ko not_active Application Discontinuation
- 2008-07-24 TW TW097128199A patent/TWI481066B/zh active
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2011
- 2011-12-02 US US13/309,887 patent/US20120074448A1/en not_active Abandoned
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