JP2010532429A5 - - Google Patents

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Publication number
JP2010532429A5
JP2010532429A5 JP2010514971A JP2010514971A JP2010532429A5 JP 2010532429 A5 JP2010532429 A5 JP 2010532429A5 JP 2010514971 A JP2010514971 A JP 2010514971A JP 2010514971 A JP2010514971 A JP 2010514971A JP 2010532429 A5 JP2010532429 A5 JP 2010532429A5
Authority
JP
Japan
Prior art keywords
substrate
organic composition
patterned
ionizable substituent
patterning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010514971A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010532429A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/067179 external-priority patent/WO2009006010A2/en
Publication of JP2010532429A publication Critical patent/JP2010532429A/ja
Publication of JP2010532429A5 publication Critical patent/JP2010532429A5/ja
Pending legal-status Critical Current

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JP2010514971A 2007-07-02 2008-06-17 基材のパターニング方法 Pending JP2010532429A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94752707P 2007-07-02 2007-07-02
PCT/US2008/067179 WO2009006010A2 (en) 2007-07-02 2008-06-17 Method of patterning a substrate

Publications (2)

Publication Number Publication Date
JP2010532429A JP2010532429A (ja) 2010-10-07
JP2010532429A5 true JP2010532429A5 (ru) 2011-07-21

Family

ID=40226752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010514971A Pending JP2010532429A (ja) 2007-07-02 2008-06-17 基材のパターニング方法

Country Status (6)

Country Link
EP (1) EP2162237A4 (ru)
JP (1) JP2010532429A (ru)
KR (1) KR20100036260A (ru)
CN (1) CN101687218A (ru)
BR (1) BRPI0813652A2 (ru)
WO (1) WO2009006010A2 (ru)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
US9023560B1 (en) 2013-11-05 2015-05-05 Eastman Kodak Company Electroless plating method using non-reducing agent
US9005854B1 (en) 2013-11-05 2015-04-14 Eastman Kodak Company Electroless plating method using halide
US9122161B2 (en) 2013-11-05 2015-09-01 Eastman Kodak Company Electroless plating method using bleaching
US9128378B2 (en) 2013-11-05 2015-09-08 Eastman Kodak Company Forming conductive metal patterns with reactive polymers
US8936890B1 (en) 2013-11-05 2015-01-20 Eastman Kodak Company Electroless plating method
US9380700B2 (en) 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
US10573610B2 (en) 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
US9631279B2 (en) 2014-05-19 2017-04-25 Sierra Circuits, Inc. Methods for forming embedded traces
JP6316960B2 (ja) 2014-07-03 2018-04-25 Ｊｘ金属株式会社 放射線検出器用ｕｂｍ電極構造体、放射線検出器及びその製造方法
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US9706650B1 (en) 2016-08-18 2017-07-11 Sierra Circuits, Inc. Catalytic laminate apparatus and method
US9922951B1 (en) 2016-11-12 2018-03-20 Sierra Circuits, Inc. Integrated circuit wafer integration with catalytic laminate or adhesive
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
IT201900011958A1 (it) 2019-07-17 2021-01-17 Milano Politecnico Metallization of plastic substrates
JP2022165788A (ja) * 2021-04-20 2022-11-01 東京応化工業株式会社 ナノインプリント用組成物及びパターン形成方法

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5627013A (en) * 1991-11-14 1997-05-06 Rohm Co., Ltd. Method of forming a fine pattern of ferroelectric film
JP3973060B2 (ja) * 1998-03-04 2007-09-05 日本リーロナール有限会社 パターン状選択的銀の析出を利用する無電解めっきによる回路形成方法
JP3535418B2 (ja) * 1999-07-14 2004-06-07 富士通株式会社 導体パターン形成方法
JP2001135168A (ja) * 1999-08-26 2001-05-18 Sharp Corp 金属配線の製造方法
JP2002129345A (ja) * 2000-10-19 2002-05-09 Sumitomo Osaka Cement Co Ltd 選択メッキ下地形成用感光性塗布液
US20040101665A1 (en) * 2001-02-14 2004-05-27 Shipley Company, L.L.C. Direct patterning method
JP3548130B2 (ja) * 2001-03-28 2004-07-28 株式会社東芝 複合部材の製造方法、感光性組成物および多孔質基材
US6899999B2 (en) * 2001-03-28 2005-05-31 Kabushiki Kaisha Toshiba Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member
US6927471B2 (en) * 2001-09-07 2005-08-09 Peter C. Salmon Electronic system modules and method of fabrication
JP3857564B2 (ja) * 2001-10-22 2006-12-13 積水化学工業株式会社 樹脂表面への導電性被膜及び導電性回路パターンの形成方法
US6797278B2 (en) * 2001-12-21 2004-09-28 Milliken & Company Antimicrobial sol-gel films comprising specific metal-containing antimicrobial agents
JP2004152651A (ja) * 2002-10-31 2004-05-27 Canon Inc 表面伝導型電子放出素子及び画像形成装置の製造方法
JP4108538B2 (ja) * 2003-05-28 2008-06-25 太陽インキ製造株式会社 無電解めっきパターン形成用組成物、無電解めっきパターン及びその形成方法
JP2007131875A (ja) * 2005-11-08 2007-05-31 Fujifilm Corp 金属膜形成方法及び金属パターン形成方法

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