JP2010531550A - 鉛フリーはんだの銅溶解の抑制 - Google Patents
鉛フリーはんだの銅溶解の抑制 Download PDFInfo
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- H—ELECTRICITY
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- H05K3/22—Secondary treatment of printed circuits
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- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
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Abstract
Description
Claims (24)
- 銅層を有するデバイス基板を用意することと、
前記銅層に隣接するスズ−銅−合金層を形成して、前記基板上に層状構造を形成することと
を含むデバイス製造方法。 - 前記形成する工程が、
前記銅層に隣接するスズ層を形成することと、
前記スズ層および前記銅層を熱処理にかけて、前記スズ層と前記銅層の間の界面で前記スズ−銅−合金層を形成することと
を含む、請求項1に記載の発明。 - 熱処理にかける前記工程が、
前記スズ層および前記銅層を約125℃〜約231℃の温度で約0.01〜48時間の期間にわたってアニールすることを含む、請求項2に記載の発明。 - 熱処理にかける前記工程が、
前記スズ層および前記銅層を約150℃で約1時間〜約7時間の期間にわたってアニールすることを含む、請求項3に記載の発明。 - 熱処理にかける前記工程が、溶融し、次いで前記アニール前に前記スズ層を固化することをさらに含む、請求項3に記載の発明。
- 熱処理にかける前記工程が、溶融し、次いで前記スズ層を固化することを含む、請求項2に記載の発明。
- 前記スズ層が、約0.1μm〜約3μmの厚さを有する、請求項2に記載の発明。
- 前記スズ層が、約0.5μm〜約1.5μmの厚さを有する、請求項7に記載の発明。
- 前記スズ−銅−合金層がCu3Snを含む、請求項1に記載の発明。
- 前記スズ−銅−合金層がCu3Snから本質的になる、請求項9に記載の発明。
- 前記層状構造に隣接して配置されたはんだをリフローして、前記銅層と外付け回路の間に電気的接続を形成すること
をさらに含む、請求項1に記載の発明。 - 前記はんだがSn−Ag−Cu合金を含む、請求項11に記載の発明。
- 前記スズ−銅−合金層が、液化したはんだに実質的に溶解しない、請求項11に記載の発明。
- 請求項1に記載の方法を用いて作製される製品。
- 基板上の銅層と、
前記銅層に隣接するスズ−銅−合金層であって、前記銅層および前記スズ−銅−合金層が前記基板上に層状構造を形成するスズ−銅−合金層と、
前記層状構造に隣接するはんだと
を備える、デバイス。 - 前記スズ−銅−合金層がCu3Snを含む、請求項15に記載の発明。
- 前記はんだがSn−Ag−Cu合金を含む、請求項15に記載の発明。
- 前記はんだが、前記銅層と外付け回路の間に電気的接続を形成するリフローされたはんだである、請求項15に記載の発明。
- キャリアにはんだ付けされる集積回路をさらに含み、前記集積回路と前記キャリアの間の接続が、前記銅層およびスズ−銅−合金層の例の少なくとも1つを含む、
請求項15に記載の発明。 - 回路ボードにはんだ付けされる回路コンポーネントをさらに含み、前記回路コンポーネントと前記回路ボードの間の接続が、前記銅層およびスズ−銅−合金層の例の少なくとも1つを含む、
請求項15に記載の発明。 - 銅層と
前記銅層に隣接するスズ−銅−合金層とを含み、前記スズ−銅−合金層がCu3Snを含む
デバイス。 - 前記デバイスが、集積回路であり、
前記銅層および前記スズ−銅−合金層が、前記集積回路と外付け回路の間に電気的接続をもたらすようになされる少なくとも1つの金属化パッドまたはピンの一部である
請求項21に記載の発明。 - 前記デバイスが、ディスクリート回路コンポーネントであり、
前記銅層およびスズ−銅−合金層が、前記ディスクリート回路コンポーネントと外付け回路の間に電気的接続をもたらすようになされる少なくとも1つの金属化パッドまたはピンの一部である
請求項21に記載の発明。 - 前記デバイスが、回路ボードであり、
前記銅層および前記スズ−銅−合金層が、前記回路ボードと前記回路ボード上に実装される回路コンポーネントの間に電気的接続をもたらすようになされる少なくとも1つの金属化パッドまたはピンの一部である
請求項21に記載の発明。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2007/072375 WO2009002343A1 (en) | 2007-06-28 | 2007-06-28 | Inhibition of copper dissolution for lead-free soldering |
Publications (1)
Publication Number | Publication Date |
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JP2010531550A true JP2010531550A (ja) | 2010-09-24 |
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ID=40185925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010514730A Pending JP2010531550A (ja) | 2007-06-28 | 2007-06-28 | 鉛フリーはんだの銅溶解の抑制 |
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Country | Link |
---|---|
US (1) | US20100319967A1 (ja) |
EP (1) | EP2171753A4 (ja) |
JP (1) | JP2010531550A (ja) |
KR (1) | KR20100035168A (ja) |
WO (1) | WO2009002343A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011096803A (ja) * | 2009-10-29 | 2011-05-12 | Fujitsu Ltd | 半導体装置とその製造方法 |
JP2014033172A (ja) * | 2012-11-02 | 2014-02-20 | Tanigurogumi:Kk | 電極溶食防止層を有する部品及びその製造方法 |
JP7032113B2 (ja) | 2017-11-27 | 2022-03-08 | 住友電気工業株式会社 | プリント配線板及び接続体 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011099934A1 (en) * | 2010-02-10 | 2011-08-18 | Agency For Science, Technology And Research | A method of forming a bonded structure |
FR2961638B1 (fr) * | 2010-06-21 | 2012-07-06 | Commissariat Energie Atomique | Microbatterie et procede de fabrication d'une microbatterie |
JP6165411B2 (ja) | 2011-12-26 | 2017-07-19 | 富士通株式会社 | 電子部品及び電子機器 |
GB2569466B (en) * | 2016-10-24 | 2021-06-30 | Jaguar Land Rover Ltd | Apparatus and method relating to electrochemical migration |
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JPS61126606A (ja) * | 1984-11-22 | 1986-06-14 | Alps Electric Co Ltd | 垂直磁気記録用磁気ヘツド |
JPS6419794A (en) * | 1987-07-15 | 1989-01-23 | Furukawa Electric Co Ltd | Method of soldering electronic component |
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- 2007-06-28 US US12/666,437 patent/US20100319967A1/en not_active Abandoned
- 2007-06-28 EP EP07812430A patent/EP2171753A4/en not_active Withdrawn
- 2007-06-28 WO PCT/US2007/072375 patent/WO2009002343A1/en active Application Filing
- 2007-06-28 JP JP2010514730A patent/JP2010531550A/ja active Pending
- 2007-06-28 KR KR1020107001864A patent/KR20100035168A/ko not_active Application Discontinuation
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011096803A (ja) * | 2009-10-29 | 2011-05-12 | Fujitsu Ltd | 半導体装置とその製造方法 |
JP2014033172A (ja) * | 2012-11-02 | 2014-02-20 | Tanigurogumi:Kk | 電極溶食防止層を有する部品及びその製造方法 |
JP7032113B2 (ja) | 2017-11-27 | 2022-03-08 | 住友電気工業株式会社 | プリント配線板及び接続体 |
Also Published As
Publication number | Publication date |
---|---|
US20100319967A1 (en) | 2010-12-23 |
KR20100035168A (ko) | 2010-04-02 |
WO2009002343A1 (en) | 2008-12-31 |
EP2171753A4 (en) | 2010-09-08 |
EP2171753A1 (en) | 2010-04-07 |
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