JP2010517283A - 電子ウェーハを相互接続する方法 - Google Patents

電子ウェーハを相互接続する方法 Download PDF

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JP2010517283A
JP2010517283A JP2009546775A JP2009546775A JP2010517283A JP 2010517283 A JP2010517283 A JP 2010517283A JP 2009546775 A JP2009546775 A JP 2009546775A JP 2009546775 A JP2009546775 A JP 2009546775A JP 2010517283 A JP2010517283 A JP 2010517283A
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JP5303791B2 (ja
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クリスチャン、バル
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3D Plus SA
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y10T29/49167Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path

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Abstract

本発明は、第1のウェーハ(T1)の電子部品と第2のウェーハ(T2)の電子部品を相互接続する方法に関し、各ウェーハは当該ウェーハを厚さ方向に貫通する金属化されたビアホール(1)を有する。
本方法は次のステップを含む:
−第1のウェーハ(T1)の各ビアホール(1)上に、溶剤を含む導電性のインクの液滴(3)を置くステップと、
−第2のウェーハ(T2)のビアホール(1)が実質的に第1のウェーハ(T1)のビアホール(1)に重なるように、第2のウェーハ(T2)を第1のウェーハ上に積み上げるステップと、
−ペースト状のインクを得るように、加熱又は真空の適用によって、液滴(3)の中に含まれる溶剤を50〜90%除去するステップと、
−重なっている金属化されたビアホール(1)間に電気的接続(31)を生成するように、ペースト状のインクの液滴(3)をレーザー焼結するステップ。
【選択図】 図2b

Description

本発明の分野は3次元(3D)電子モジュールの相互接続に、そしてより正確にはその垂直の相互接続に関する。
3次元電子モジュールは異種混合の電子部品のスタックである。用語「異種混合の構成部品」は、共に接続された1つ以上の能動素子及び/又は受動素子を同時に含み、従って所与の電子機能を確実にする電子回路を形成する電子部品を意味すると理解される。能動素子は一般に「チップ」と呼ばれ、かつ半導体技術を用いる、あらゆる構成部品を含む。それは例えばダイオード、トランジスタ、集積回路、専用ASIC回路、メモリ、あるいはマイクロプロセッサであってもよい。用語「受動素子」はそれらが抵抗、コンデンサ、インダクタンス・タイプの従来の表面実装型部品か、あるいはシリコン内へエッチングされ、MEMS(マイクロ電気機械システム:microelectromechanical systems)として知られる、電気機械部品かのいずれにせよ、その他の構成部品を意味すると理解される。
用語「垂直の相互接続」は、積み重ねる方向への相互接続と理解される。
3次元電子モジュールを相互接続するために多くの技術が存在し、次の2つのグループに分割され得る。
−異種混合の構成部品の相互接続及び積み重ね、
−各々が多数の同じ異種混合の構成部品を含む、シリコンウェーハの相互接続及び積み重ね。
本発明はそのようなウェーハの垂直の相互接続に関する。
既知の技術によれば、これらのウェーハはビアホール、すなわちウェーハから電気的に絶縁され次に金属化された、ウェーハをその厚さ方向に貫通している穴により相互接続される。構成部品はビアホールに接続される。金属化されたビアホールの相互接続はデリケートであり、次の方法に基づく。
−熱圧着、
−はんだ合金のリフロー、
−その他。
一般に、これらの方法は、
−無視できない数の構成部品を損傷する、各相互接続に対する高温の処理及び/又は圧力、
−達成が困難な、極度に正確な位置合わせ、
−全てのビアホールが接触しなければならないため、非常に良好な平坦度、
を必要とする。
さらに、得られた3次元モジュールは個々に点検されるが、相互接続の品質は点検されない。
本発明の目的はこれらの欠点を克服することである。
本発明は、ビアホール上に置かれるインク中に存在する、銀のナノ粒子の焼結による相互接続に基づく。
より正確には、本発明の主題は第1のウェーハの電子部品と第2のウェーハの電子部品を相互接続する方法であって、各ウェーハが当該ウェーハを厚さ方向に貫通する金属化されたビアホールを有し、方法が、
−第1のウェーハの各ビアホール上に、溶剤を含む導電性のインクの液滴を置くステップと、
−第2のウェーハのビアホールが実質的に第1のウェーハのビアホール上に重なるように、第2のウェーハを第1のウェーハ上に積み上げるステップと、
−ペースト状のインクを得るように、加熱又は真空の適用によって、液滴の中に含まれる溶剤を50〜90%除去するステップと、
−重なっている金属化されたビアホール間に電気的接続を生成するように、ペースト状のインクの液滴をレーザー焼結するステップと、
を含むことを特徴とする。
本発明の1つの特徴によれば、それは集積されたレーザーダイオードを用いた少なくとも1つの電気的接続を点検する、追加ステップを含む。
第1のウェーハは、場合によっては少なくとも1つの別のウェーハに前もって接続されたウェーハである。
導電性のインクは、典型的にはAg又はCu、あるいはAuなどの金属のナノ粒子を含む。
本発明のその他の特徴と利点は、制限されない例として与えられた以下の詳細説明を読み、添付図を参照することにより明らかになるであろう。
図1はビアホールの各種実施形態の断面図を概略的に示す。 図2、図2’は本発明による相互接続方法における、各種ステップの断面図を概略的に例示する。 図3、図3’は本発明による3つのウェーハのスタックを相互接続するためのステップの1つの断面図を例示する。
1つの図から別の図にわたり、同じ要素は同一の参照番号により識別される。
本発明は金属化されたビアホールを備えるウェーハの垂直の相互接続に関し、各ウェーハは相互に、及び/又はこれらのビアホールに電気的に接続された、多数の同じ異種混合の構成部品を含む。ウェーハは典型的には10〜200μmの厚さを有する。
ビアホールの幾つかの実施形態が想定され、これらは図1に関連して説明されている。ビアホールの金属は例えば銅又は金であり、それはビアホールの壁のみを覆うか、あるいはピラーを形成するように、それらを完全に満たし得る。典型的には、ビアホールは2〜50μmの直径を有する。各ビアホール1は図1aに示すように、SiOなどの電気絶縁体4によりシリコンウェーハTから電気的に絶縁される。突起物11がピラー1の一端に生成され得る(図1bを参照)。導電性の突起した隆起もまたピラー上に成長し得る。1つの実施形態によれば、例えば銅製の導電性のカラー2が、ウェーハTの片面又は両面(a、b)においてビアホール1を囲む。場合によっては、カラー2はビアホール上にほぼ中心のある中空でない円板を形成する。これら2つのカラー形状は図1dに例示され、円板を形成するカラーはa面上に置かれている。カラー2は微小な隆起21又は大きな隆起22を備えることがあり、これらは例えば金で作られて導電性であり、それぞれ図1c及び図1fに示されている。
本発明による方法の様々なステップはこれから、図2又は2’に関連して説明される。図2及び3に示すビアホール1はピラーであり、円板2は各ウェーハの両面aとbにおいてビアホール上に置かれている。図2’及び3’において、ビアホール1の金属は壁のみを覆い、カラー2は各ウェーハの両面aとbにおいて、これらビアホールの周りに置かれている。
厚さ1〜20μmの導電性インクの液滴3は、図2a’及び2aに例示されているように、第1のウェーハT1の各ビアホール1上に置かれ、この液滴は場合によってはあり得るカラーにより中心に置かれ、又はカラーが円板のときは実質的に当該カラーを覆っている。図1に示す、場合によってはあり得る隆起又は突起物11、21、又は22の目的は、インクの液滴3との接触点を強化することである。ピラーの突起物11及び突出した隆起22はまた、図1fに例示されるように、カラー2により境界を定められる空洞内へ、又は隆起の幾何学的形状に適合する中空のビアホール1内へ嵌まり込むよう意図されている。このインクは溶剤中に溶かされた金属のナノ粒子を含み、金属は典型的には銀、銅、又は金である。これらの液滴3は、例えば要求に応じた滴下方法を用いるノズルによるインクジェット、又はシルクスクリーン印刷により置かれる。それらはビアホール上又はそのカラー上に局部的に置かれ得る。
第2のウェーハT2は、第2のウェーハのビアホール1が第1のウェーハのビアホール上に完全に、あるいは実質的に重なるように、第1のウェーハ上に積み重ねられる。これは図2b及び2b’において見られる。そのような積み重ねの後で、インクの液滴3はその元の位置から僅かにずらされ得る。
インクの液滴中に含まれる溶剤は、オーブン内において100℃未満で加熱されるか、又は100〜200ミリバールの減圧を作ることによる真空下で、部分的に除去される。図2c及び2c’における矢印33により例示される、この溶剤除去の目的は、ペースト状のインクを得るように、その50〜90%を取り除くことである。
図2d及び2d’を参照すると、次のステップはエネルギー34の供給により得られる、導電性の液滴3を焼結することである。焼結は材料を溶かす所まで行かずに、エネルギーの供給により得られる材料の圧密である。この場合、材料は銀のナノ粒子を含む前記インクである。このエネルギーの影響下で、ナノ粒子は1つにされ、従って機械的又は電気的接続を形成する。このエネルギー供給34は、例えば1〜50kHzの間のパルス反復周波数において、約数nsの持続時間の、YAG又はCOレーザー放射パルスなどのパルス状レーザーを用いて得られる、ビアホール1における局部的なエネルギーの供給であることが望ましい。積み重ねられたウェーハを、水素/窒素の混合であるフォーミング・ガスを一般的に含む、還元性又は非酸化性の雰囲気内に置くことにより、液滴の全体的加熱を行なうこともまた可能である。
ウェーハT2の上面aへと主に向けられる熱34は、この熱を導きウェーハT2の下面bの円板2に伝える、ビアホール1の金属化された中央ピラー内へ拡散する。インクの液滴3と接触するこの円板2は、第1のウェーハT1上面の円板2ともまた接触する(場合によっては部分的接触)、この液滴の中へも熱を伝える。例えそれらの円板が図に例示されているように完全に重ねられていなくても、熱は第2のウェーハT2の下部円板2と、第1のウェーハT1の上部円板2との間の銀の粒子を焼結するために役立つ。従って電気的接続31が第1と第2のウェーハT1、T2のビアホール1間で生成される。
次に、そのステップは必須ではないが、2つのウェーハT1、T2の間の接続31(図2e及び2e’を参照)を点検するステップを実施することが望ましい。それはこの接続の熱的な識別特徴を解析することにより、有利に行なわれる。これは第1のウェーハT1の上部円板2(a面)と、第2のウェーハT2の下部円板2(b面)との間の熱伝達、従って熱的な識別特徴が、当該接続の有無によって完全に異なるためである。この識別特徴は焼結用に使われるレーザーにより有利にも解析され、当該レーザーはそのとき、上部ウェーハT2の円板2から返される信号32を解析するためのダイオードを備えている。
ウェーハの数n>3の場合は、n個のウェーハのスタックを得るように、2つのウェーハT1、T2を積み重ねて接続した後で、本方法は既に接続されたスタックの上部ウェーハT2に第3のウェーハT3を接続し、そしてそれが続けられるように繰り返され得る。図2bに示すステップに対応する、インクの液滴がウェーハT2上に置かれた後のウェーハT3を積み重ねるステップは図3に示され、本方法により接続された3つのウェーハのスタックは図3’に示されている。1つの変形として、その上にインクの液滴が置かれているk個(k>2)のウェーハが積み重ねられる。溶剤を部分的に蒸発させるステップ、液滴を焼結するステップ、及び場合によっては接続を点検するステップが、次にスタックに適用される。

Claims (10)

  1. 第1のウェーハ(T1)の電子部品と第2のウェーハ(T2)の電子部品を相互接続する方法であって、各ウェーハが、当該ウェーハを厚さ方向に貫通する金属化されたビアホール(1)を有し、
    −前記第1のウェーハ(T1)の各ビアホール(1)上に、溶剤を含む導電性のインクの液滴(3)を置くステップと、
    −前記第2のウェーハ(T2)の前記ビアホール(1)が実質的に前記第1のウェーハ(T1)の前記ビアホール(1)に重なるように、前記第2のウェーハ(T2)を前記第1のウェーハ上に積み上げるステップと、
    −ペースト状のインクを得るように、加熱又は真空の適用によって、前記液滴(3)の中に含まれる前記溶剤を50〜90%除去するステップと、
    −前記重なっている金属化されたビアホール(1)間に電気的接続(31)を生成するように、前記ペースト状のインクの液滴(3)をレーザー焼結するステップと
    を含むことを特徴とする方法。
  2. 集積されたレーザーダイオードを用いて少なくとも1つの電気的接続(31)を点検する追加ステップを含むことを特徴とする請求項1に記載の方法。
  3. 前記第1のウェーハ(T1)が、少なくとも1つの別のウェーハに前もって接続されたウェーハであることを特徴とする、請求項1または2に記載の方法。
  4. 前記導電性のインクが、Ag、Cu、あるいはAuなどの金属のナノ粒子を含むことを特徴とする、請求項1〜3のいずれか一項に記載の方法。
  5. 前記液滴(3)が、インクジェット又はシルクスクリーン印刷により置かれることを特徴とする、請求項1〜4のいずれか一項に記載の方法。
  6. 前記金属化されたビアホールの前記金属が前記ビアホールを完全に満たし、従ってピラーを形成することを特徴とする、請求項1〜5のいずれか一項に記載の方法。
  7. ピラーが突起物(11)により延長されることを特徴とする、請求項1〜6のいずれか一項に記載の方法。
  8. ウェーハが2つの面(a、b)を有し、導電性のカラー(2)がウェーハの片面又は両面において、金属化されたビアホール(1)を囲み、前記ビアホール(1)上に置かれた液滴(3)がこのカラー(2)と接触することを特徴とする、請求項1〜7のいずれか一項に記載の方法。
  9. 前記カラー(2)が、前記ビアホール(1)上にほぼ中心のある中空でない円板を形成することを特徴とする、請求項6及び8のいずれか一項に記載の方法。
  10. 少なくとも1つのカラー(2)が隆起(21)を備えることを特徴とする、請求項8あるいは9のいずれか一項に記載の方法。
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FR2911995B1 (fr) 2009-03-06
EP2126969B1 (fr) 2012-06-27
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US8136237B2 (en) 2012-03-20
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