JP2010516044A5 - - Google Patents

Download PDF

Info

Publication number
JP2010516044A5
JP2010516044A5 JP2009544842A JP2009544842A JP2010516044A5 JP 2010516044 A5 JP2010516044 A5 JP 2010516044A5 JP 2009544842 A JP2009544842 A JP 2009544842A JP 2009544842 A JP2009544842 A JP 2009544842A JP 2010516044 A5 JP2010516044 A5 JP 2010516044A5
Authority
JP
Japan
Prior art keywords
solvent
group
alkyl groups
independently selected
ester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009544842A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010516044A (ja
Filing date
Publication date
Priority claimed from US11/649,600 external-priority patent/US8021490B2/en
Application filed filed Critical
Publication of JP2010516044A publication Critical patent/JP2010516044A/ja
Publication of JP2010516044A5 publication Critical patent/JP2010516044A5/ja
Pending legal-status Critical Current

Links

JP2009544842A 2007-01-04 2007-12-20 溶媒および系の使用による基材洗浄方法 Pending JP2010516044A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/649,600 US8021490B2 (en) 2007-01-04 2007-01-04 Substrate cleaning processes through the use of solvents and systems
PCT/US2007/026088 WO2008085390A2 (en) 2007-01-04 2007-12-20 Substrate cleaning processes through the use of solvents and systems

Publications (2)

Publication Number Publication Date
JP2010516044A JP2010516044A (ja) 2010-05-13
JP2010516044A5 true JP2010516044A5 (enExample) 2011-02-10

Family

ID=39262665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009544842A Pending JP2010516044A (ja) 2007-01-04 2007-12-20 溶媒および系の使用による基材洗浄方法

Country Status (7)

Country Link
US (1) US8021490B2 (enExample)
EP (1) EP2106616A2 (enExample)
JP (1) JP2010516044A (enExample)
KR (1) KR20090106499A (enExample)
CN (1) CN101573777A (enExample)
TW (1) TWI494426B (enExample)
WO (1) WO2008085390A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8021490B2 (en) * 2007-01-04 2011-09-20 Eastman Chemical Company Substrate cleaning processes through the use of solvents and systems
JP4922329B2 (ja) * 2009-03-25 2012-04-25 株式会社東芝 半導体基板の洗浄装置および半導体基板の洗浄方法
US8324093B2 (en) * 2009-07-23 2012-12-04 GlobalFoundries, Inc. Methods for fabricating semiconductor devices including azeotropic drying processes
US9335367B2 (en) * 2013-08-27 2016-05-10 International Business Machines Corporation Implementing low temperature wafer test
JP6426927B2 (ja) 2013-09-30 2018-11-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US9580672B2 (en) * 2014-09-26 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning composition and method for semiconductor device fabrication
US20180074115A1 (en) * 2016-09-09 2018-03-15 General Electric Company Residual ionic cleanliness evaluation component
US10833567B2 (en) * 2017-06-05 2020-11-10 Cutsforth, Inc. Monitoring system for grounding apparatus
US10767941B2 (en) * 2018-09-14 2020-09-08 Ford Global Technologies, Llc Method of forming a superhydrophobic layer on a motor vehicle heat exchanger housing and a heat exchanger incorporating such a housing

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6250490A (ja) 1985-08-29 1987-03-05 Asahi Chem Ind Co Ltd 銀もしくは銀メツキ製品の洗浄方法
US4983490A (en) * 1985-10-28 1991-01-08 Hoechst Celanese Corporation Photoresist treating composition consisting of a mixture of propylene glycol alkyl ether and propylene glycol alkyl ether acetate
US4746397A (en) * 1986-01-17 1988-05-24 Matsushita Electric Industrial Co., Ltd. Treatment method for plate-shaped substrate
US4683075A (en) * 1986-07-23 1987-07-28 Allied Corporation Azeotrope-like compositions of trichlorotrifluoroethane, methanol, nitromethane, acetone, and methyl acetate
JPH01139539A (ja) 1987-11-25 1989-06-01 Asahi Glass Co Ltd 共沸組成物の安定化方法
JPH01318092A (ja) 1988-06-17 1989-12-22 Asahi Glass Co Ltd 混合溶剤組成物
JPH02200789A (ja) 1989-01-31 1990-08-09 Asahi Glass Co Ltd 脱脂洗浄剤
JPH02200788A (ja) 1989-01-31 1990-08-09 Asahi Glass Co Ltd バフ研磨洗浄剤
CA2008882A1 (en) 1989-02-01 1990-08-01 Takamasa Tsumoto Washing agent, washing method and process for preparing semiconductor integrated circuit device by use thereof
WO1990008814A1 (en) * 1989-02-01 1990-08-09 Asahi Glass Company Ltd. Hydrochlorofluorocarbon azeotropic or azeotropic-like mixture
JPH02202998A (ja) 1989-02-02 1990-08-13 Asahi Glass Co Ltd 混合溶剤組成物
JPH03179097A (ja) 1989-12-07 1991-08-05 Daikin Ind Ltd 洗浄剤組成物
AU635362B2 (en) 1989-12-07 1993-03-18 Daikin Industries, Ltd. Cleaning composition
FR2658532B1 (fr) * 1990-02-20 1992-05-15 Atochem Application des (perfluoroalkyl)-ethylenes comme agents de nettoyage ou de sechage, et compositions utilisables a cet effet.
US5458800A (en) * 1990-02-20 1995-10-17 Societe Atochem Use of (perfluoroalkyl) ethylenes as cleaning or drying agents, and compositions which can be used for this purpose
US5426017A (en) * 1990-05-31 1995-06-20 Hoechst Celanese Corporation Composition and method for removing photoresist composition from substrates surfaces
BE1005163A3 (fr) * 1991-08-01 1993-05-11 Solvay Compositions contenant un ether fluore et utilisation de ces compositions.
US5773403A (en) * 1992-01-21 1998-06-30 Olympus Optical Co., Ltd. Cleaning and drying solvent
JPH06179897A (ja) 1992-12-15 1994-06-28 Asahi Chem Ind Co Ltd 洗浄用溶剤
JPH06179896A (ja) 1992-12-15 1994-06-28 Asahi Chem Ind Co Ltd 洗浄剤
JPH06184595A (ja) 1992-12-18 1994-07-05 Nitto Chem Ind Co Ltd レジスト剥離工程用洗浄剤
JPH06212193A (ja) 1992-12-21 1994-08-02 Nitto Chem Ind Co Ltd レジスト剥離剤除去用洗浄剤
WO1994014858A1 (en) 1992-12-29 1994-07-07 Hoechst Celanese Corporation Metal ion reduction in polyhydroxystyrene and photoresists
JPH06293899A (ja) 1993-04-08 1994-10-21 Nitto Chem Ind Co Ltd フラックス除去用洗浄剤
JP3619261B2 (ja) 1993-06-15 2005-02-09 三菱レイヨン株式会社 溶剤組成物
JP2816928B2 (ja) * 1993-09-16 1998-10-27 花王株式会社 洗浄方法
JP3264405B2 (ja) * 1994-01-07 2002-03-11 三菱瓦斯化学株式会社 半導体装置洗浄剤および半導体装置の製造方法
JP3074634B2 (ja) * 1994-03-28 2000-08-07 三菱瓦斯化学株式会社 フォトレジスト用剥離液及び配線パターンの形成方法
JPH08151600A (ja) 1994-11-28 1996-06-11 Central Glass Co Ltd 混合洗浄溶剤
JPH08211592A (ja) * 1995-02-07 1996-08-20 Nikon Corp 洗浄乾燥方法及び洗浄乾燥装置
JPH1055993A (ja) * 1996-08-09 1998-02-24 Hitachi Ltd 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法
JPH10289891A (ja) 1997-04-11 1998-10-27 Mitsubishi Gas Chem Co Inc 半導体回路用洗浄剤及びそれを用いた半導体回路の製造方法
JP3978255B2 (ja) 1997-06-24 2007-09-19 Ａｚエレクトロニックマテリアルズ株式会社 リソグラフィー用洗浄剤
JPH1121187A (ja) 1997-07-02 1999-01-26 Ngk Insulators Ltd セラミックス製品の洗浄方法
US6689734B2 (en) * 1997-07-30 2004-02-10 Kyzen Corporation Low ozone depleting brominated compound mixtures for use in solvent and cleaning applications
JP3975301B2 (ja) 1997-08-22 2007-09-12 三菱瓦斯化学株式会社 半導体素子製造用洗浄液及びこれを用いた半導体素子 の製造方法
BE1011609A3 (fr) * 1997-12-15 1999-11-09 Solvay Compositions comprenant du perfluorobutyl methyl ether et utilisation de ces compositions.
JPH11212276A (ja) 1998-01-26 1999-08-06 Daicel Chem Ind Ltd 電子部品用基板のリンス液、及びこのリンス液を用いた電子部品用基板のリンス処理法
JPH11218933A (ja) * 1998-01-30 1999-08-10 Fuji Film Olin Kk レジスト洗浄除去用溶剤および電子部品製造用基材の製造方法
JPH11323394A (ja) * 1998-05-14 1999-11-26 Texas Instr Japan Ltd 半導体素子製造用洗浄剤及びそれを用いた半導体素子の製造方法
US6517636B1 (en) * 1999-01-05 2003-02-11 Cfmt, Inc. Method for reducing particle contamination during the wet processing of semiconductor substrates
JP4224651B2 (ja) * 1999-02-25 2009-02-18 三菱瓦斯化学株式会社 レジスト剥離剤およびそれを用いた半導体素子の製造方法
KR100434485B1 (ko) * 1999-10-08 2004-06-05 삼성전자주식회사 포토레지스트 스트립퍼 조성물 및 이를 이용한 포토레지스트 스트립 방법
IT1317827B1 (it) * 2000-02-11 2003-07-15 Ausimont Spa Composizioni solventi.
US6488040B1 (en) * 2000-06-30 2002-12-03 Lam Research Corporation Capillary proximity heads for single wafer cleaning and drying
US6777380B2 (en) * 2000-07-10 2004-08-17 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductor devices
US6486078B1 (en) * 2000-08-22 2002-11-26 Advanced Micro Devices, Inc. Super critical drying of low k materials
US6401361B1 (en) * 2000-11-15 2002-06-11 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for drying wafers by a solvent
US6764551B2 (en) * 2001-10-05 2004-07-20 International Business Machines Corporation Process for removing dopant ions from a substrate
US6737225B2 (en) * 2001-12-28 2004-05-18 Texas Instruments Incorporated Method of undercutting micro-mechanical device with super-critical carbon dioxide
JP2005524972A (ja) * 2002-02-06 2005-08-18 アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド 半導体応力緩衝剤コーティングの改良されたエッジビーズ除去組成物およびその使用
US6699829B2 (en) * 2002-06-07 2004-03-02 Kyzen Corporation Cleaning compositions containing dichloroethylene and six carbon alkoxy substituted perfluoro compounds
AU2003257636A1 (en) * 2002-08-22 2004-03-11 Daikin Industries, Ltd. Removing solution
KR100951364B1 (ko) 2003-06-03 2010-04-08 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물
KR20050032719A (ko) 2003-10-02 2005-04-08 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물
KR101142868B1 (ko) 2004-05-25 2012-05-10 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물
US6926590B1 (en) * 2004-06-25 2005-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method of improving device performance
JP2006083308A (ja) * 2004-09-16 2006-03-30 Nippon Zeon Co Ltd 洗浄剤組成物
JP4442376B2 (ja) 2004-09-22 2010-03-31 東ソー株式会社 レジスト除去用組成物
JP4876215B2 (ja) * 2005-01-21 2012-02-15 独立行政法人産業技術総合研究所 Ｃｍｐ研磨方法、ｃｍｐ研磨装置、及び半導体デバイスの製造方法
US8026201B2 (en) * 2007-01-03 2011-09-27 Az Electronic Materials Usa Corp. Stripper for coating layer
US8021490B2 (en) * 2007-01-04 2011-09-20 Eastman Chemical Company Substrate cleaning processes through the use of solvents and systems

Similar Documents

Publication Publication Date Title
JP2010516044A5 (enExample)
JP5513196B2 (ja) 洗浄組成物及び半導体装置の製造方法
JP2009500415A5 (enExample)
JP2009520765A5 (enExample)
JP2005041880A5 (enExample)
JP2010536766A5 (enExample)
JP2010530897A5 (enExample)
JP2009543792A5 (enExample)
JP2006526608A5 (enExample)
JP2012502048A5 (enExample)
TW200603262A (en) Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
JP2009543794A5 (enExample)
JP2010505861A5 (enExample)
JP2011526896A5 (enExample)
JP2005530783A5 (enExample)
JP2004531527A5 (enExample)
JP2010510263A5 (enExample)
JP2005538200A5 (enExample)
TW201202414A (en) Detergent composition for removing polyimide
JP2010516779A5 (enExample)
HRP20110093T1 (hr) Kristalna baza escitaloprama i orodisperzibilne tablete koje sadrže bazu escitaloprama
JP2012076932A5 (enExample)
CN103740485B (zh) 一种复合木地板及地板砖用清洗剂
JP2007527874A5 (enExample)
JP2010539146A5 (enExample)