JP2010511103A5 - - Google Patents

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Publication number
JP2010511103A5
JP2010511103A5 JP2009538691A JP2009538691A JP2010511103A5 JP 2010511103 A5 JP2010511103 A5 JP 2010511103A5 JP 2009538691 A JP2009538691 A JP 2009538691A JP 2009538691 A JP2009538691 A JP 2009538691A JP 2010511103 A5 JP2010511103 A5 JP 2010511103A5
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JP
Japan
Prior art keywords
roller
substrate
cathode
base layer
connectable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009538691A
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English (en)
Japanese (ja)
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JP2010511103A (ja
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Publication date
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Priority claimed from PCT/EP2007/062805 external-priority patent/WO2008065069A1/de
Publication of JP2010511103A publication Critical patent/JP2010511103A/ja
Publication of JP2010511103A5 publication Critical patent/JP2010511103A5/ja
Withdrawn legal-status Critical Current

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JP2009538691A 2006-11-28 2007-11-26 電着塗装方法および装置 Withdrawn JP2010511103A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06124862 2006-11-28
PCT/EP2007/062805 WO2008065069A1 (de) 2006-11-28 2007-11-26 Vorrichtung und verfahren zur galvanischen beschichtung

Publications (2)

Publication Number Publication Date
JP2010511103A JP2010511103A (ja) 2010-04-08
JP2010511103A5 true JP2010511103A5 (enExample) 2011-01-27

Family

ID=39047993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009538691A Withdrawn JP2010511103A (ja) 2006-11-28 2007-11-26 電着塗装方法および装置

Country Status (10)

Country Link
US (1) US20090301891A1 (enExample)
EP (1) EP2099954A1 (enExample)
JP (1) JP2010511103A (enExample)
KR (1) KR20090083489A (enExample)
CN (1) CN101542022A (enExample)
BR (1) BRPI0719665A2 (enExample)
IL (1) IL198594A0 (enExample)
RU (1) RU2009124293A (enExample)
TW (1) TW200829726A (enExample)
WO (1) WO2008065069A1 (enExample)

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KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
CA2724017C (en) * 2008-04-15 2017-03-14 Nonin Medical, Inc. Non-invasive optical sensor
EP2277194A1 (en) * 2008-05-08 2011-01-26 Basf Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
KR20120023832A (ko) * 2009-05-26 2012-03-13 우시 썬테크 파워 컴퍼니 리미티드 물품 이송용 이송 롤러
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
CN101827444B (zh) * 2010-03-31 2015-03-25 中兴通讯股份有限公司 一种测量参考信号的信令配置系统及方法
DE102010042642B4 (de) 2010-10-19 2013-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen
US20130255858A1 (en) * 2012-04-03 2013-10-03 Jun-Chung Hsu Method of manufacturing a laminate circuit board
US9970297B2 (en) * 2014-08-29 2018-05-15 Rolls-Royce Corporation Composite fan slider with nano-coating
KR20160140241A (ko) 2015-05-29 2016-12-07 전자부품연구원 플라즈마 전해 기반의 시료 코팅 방법
KR101578640B1 (ko) * 2015-08-25 2015-12-17 선호경 부분 강화된 이송롤러를 구비한 pcb 도금장치
SG11202005062SA (en) 2016-07-13 2020-06-29 Alligant Scientific Llc Electrochemical methods, devices and compositions
CN108430170A (zh) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 一种电路板基板的制作方法
KR20220017885A (ko) * 2019-03-20 2022-02-14 더 리젠츠 오브 더 유니버시티 오브 콜로라도, 어 바디 코포레이트 킬레이트화된 금속을 포함하는 전기화학 저장 장치
MX2023002015A (es) 2020-08-18 2023-04-11 Enviro Metals Llc Refinamiento metálico.
CN114481244B (zh) * 2022-02-24 2022-08-23 广东盈华电子科技有限公司 一种电解铜箔耐高温抗氧化的表面处理工艺
DE102022120646A1 (de) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung

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US4019877A (en) * 1975-10-21 1977-04-26 Westinghouse Electric Corporation Method for coating of polyimide by electrodeposition
ATE100871T1 (de) * 1989-12-23 1994-02-15 Heraeus Elektrochemie Verfahren und vorrichtung zur kontinuierlichen elektrolytischen ausbringung von metall in form eines bandes aus einer loesung sowie verwendung der vorrichtung.
ATE125001T1 (de) * 1991-04-12 1995-07-15 Siemens Ag Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.
US5705219A (en) * 1991-04-22 1998-01-06 Atotech Deutschland Gmbh Method for coating surfaces with finely particulate materials
DE4212567A1 (de) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
DE19633796B4 (de) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
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DE10043817C2 (de) * 2000-09-06 2002-07-18 Egon Huebel Anordnung und Verfahren für elektrochemisch zu behandelndes Gut
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DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
DE102005033784A1 (de) * 2005-07-20 2007-01-25 Viktoria Händlmeier System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial
DE102005038450A1 (de) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
DE102005038449B4 (de) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren
CA2649786A1 (en) * 2006-04-18 2007-10-25 Basf Se Electroplating device and method
RU2008145105A (ru) * 2006-04-18 2010-05-27 Басф Се (De) Способ и устройство для гальванического покрытия

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