IL198594A0 - Method and device for electrolytic coating - Google Patents

Method and device for electrolytic coating

Info

Publication number
IL198594A0
IL198594A0 IL198594A IL19859409A IL198594A0 IL 198594 A0 IL198594 A0 IL 198594A0 IL 198594 A IL198594 A IL 198594A IL 19859409 A IL19859409 A IL 19859409A IL 198594 A0 IL198594 A0 IL 198594A0
Authority
IL
Israel
Prior art keywords
electrolytic coating
electrolytic
coating
Prior art date
Application number
IL198594A
Other languages
English (en)
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL198594A0 publication Critical patent/IL198594A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)
IL198594A 2006-11-28 2009-05-06 Method and device for electrolytic coating IL198594A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06124862 2006-11-28
PCT/EP2007/062805 WO2008065069A1 (de) 2006-11-28 2007-11-26 Vorrichtung und verfahren zur galvanischen beschichtung

Publications (1)

Publication Number Publication Date
IL198594A0 true IL198594A0 (en) 2010-02-17

Family

ID=39047993

Family Applications (1)

Application Number Title Priority Date Filing Date
IL198594A IL198594A0 (en) 2006-11-28 2009-05-06 Method and device for electrolytic coating

Country Status (10)

Country Link
US (1) US20090301891A1 (enExample)
EP (1) EP2099954A1 (enExample)
JP (1) JP2010511103A (enExample)
KR (1) KR20090083489A (enExample)
CN (1) CN101542022A (enExample)
BR (1) BRPI0719665A2 (enExample)
IL (1) IL198594A0 (enExample)
RU (1) RU2009124293A (enExample)
TW (1) TW200829726A (enExample)
WO (1) WO2008065069A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
CA2724017C (en) * 2008-04-15 2017-03-14 Nonin Medical, Inc. Non-invasive optical sensor
EP2277194A1 (en) * 2008-05-08 2011-01-26 Basf Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
KR20120023832A (ko) * 2009-05-26 2012-03-13 우시 썬테크 파워 컴퍼니 리미티드 물품 이송용 이송 롤러
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
CN101827444B (zh) * 2010-03-31 2015-03-25 中兴通讯股份有限公司 一种测量参考信号的信令配置系统及方法
DE102010042642B4 (de) 2010-10-19 2013-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen
US20130255858A1 (en) * 2012-04-03 2013-10-03 Jun-Chung Hsu Method of manufacturing a laminate circuit board
US9970297B2 (en) * 2014-08-29 2018-05-15 Rolls-Royce Corporation Composite fan slider with nano-coating
KR20160140241A (ko) 2015-05-29 2016-12-07 전자부품연구원 플라즈마 전해 기반의 시료 코팅 방법
KR101578640B1 (ko) * 2015-08-25 2015-12-17 선호경 부분 강화된 이송롤러를 구비한 pcb 도금장치
SG11202005062SA (en) 2016-07-13 2020-06-29 Alligant Scientific Llc Electrochemical methods, devices and compositions
CN108430170A (zh) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 一种电路板基板的制作方法
KR20220017885A (ko) * 2019-03-20 2022-02-14 더 리젠츠 오브 더 유니버시티 오브 콜로라도, 어 바디 코포레이트 킬레이트화된 금속을 포함하는 전기화학 저장 장치
MX2023002015A (es) 2020-08-18 2023-04-11 Enviro Metals Llc Refinamiento metálico.
CN114481244B (zh) * 2022-02-24 2022-08-23 广东盈华电子科技有限公司 一种电解铜箔耐高温抗氧化的表面处理工艺
DE102022120646A1 (de) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019877A (en) * 1975-10-21 1977-04-26 Westinghouse Electric Corporation Method for coating of polyimide by electrodeposition
ATE100871T1 (de) * 1989-12-23 1994-02-15 Heraeus Elektrochemie Verfahren und vorrichtung zur kontinuierlichen elektrolytischen ausbringung von metall in form eines bandes aus einer loesung sowie verwendung der vorrichtung.
ATE125001T1 (de) * 1991-04-12 1995-07-15 Siemens Ag Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.
US5705219A (en) * 1991-04-22 1998-01-06 Atotech Deutschland Gmbh Method for coating surfaces with finely particulate materials
DE4212567A1 (de) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
DE19633796B4 (de) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
EP1541719A3 (en) * 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE10043817C2 (de) * 2000-09-06 2002-07-18 Egon Huebel Anordnung und Verfahren für elektrochemisch zu behandelndes Gut
DE10248965A1 (de) * 2002-10-15 2004-04-29 Simmerlein, Ewald Wilhelm Galvanisierungseinrichtung zum freien Beschichten von leitfähigen Strukturen und Flächen, mit und ohne Versorgungsbahnen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
DE102005033784A1 (de) * 2005-07-20 2007-01-25 Viktoria Händlmeier System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial
DE102005038450A1 (de) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
DE102005038449B4 (de) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren
CA2649786A1 (en) * 2006-04-18 2007-10-25 Basf Se Electroplating device and method
RU2008145105A (ru) * 2006-04-18 2010-05-27 Басф Се (De) Способ и устройство для гальванического покрытия

Also Published As

Publication number Publication date
BRPI0719665A2 (pt) 2013-12-17
WO2008065069A1 (de) 2008-06-05
KR20090083489A (ko) 2009-08-03
CN101542022A (zh) 2009-09-23
US20090301891A1 (en) 2009-12-10
RU2009124293A (ru) 2011-01-10
EP2099954A1 (de) 2009-09-16
JP2010511103A (ja) 2010-04-08
TW200829726A (en) 2008-07-16

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