CN101542022A - 电镀装置和方法 - Google Patents

电镀装置和方法 Download PDF

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Publication number
CN101542022A
CN101542022A CNA2007800439981A CN200780043998A CN101542022A CN 101542022 A CN101542022 A CN 101542022A CN A2007800439981 A CNA2007800439981 A CN A2007800439981A CN 200780043998 A CN200780043998 A CN 200780043998A CN 101542022 A CN101542022 A CN 101542022A
Authority
CN
China
Prior art keywords
base layer
roller
substrate
connectable
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800439981A
Other languages
English (en)
Chinese (zh)
Inventor
R·洛赫特曼
J·卡祖恩
N·瓦格纳
J·普菲斯特
G·波尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of CN101542022A publication Critical patent/CN101542022A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)
CNA2007800439981A 2006-11-28 2007-11-26 电镀装置和方法 Pending CN101542022A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06124862 2006-11-28
EP06124862.1 2006-11-28

Publications (1)

Publication Number Publication Date
CN101542022A true CN101542022A (zh) 2009-09-23

Family

ID=39047993

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800439981A Pending CN101542022A (zh) 2006-11-28 2007-11-26 电镀装置和方法

Country Status (10)

Country Link
US (1) US20090301891A1 (enExample)
EP (1) EP2099954A1 (enExample)
JP (1) JP2010511103A (enExample)
KR (1) KR20090083489A (enExample)
CN (1) CN101542022A (enExample)
BR (1) BRPI0719665A2 (enExample)
IL (1) IL198594A0 (enExample)
RU (1) RU2009124293A (enExample)
TW (1) TW200829726A (enExample)
WO (1) WO2008065069A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102844470A (zh) * 2010-01-26 2012-12-26 安美特德国有限公司 用于在化学和/或电化学处理系统中输送类板状基板的装置
RU2536345C2 (ru) * 2010-03-31 2014-12-20 ЗетТиИ Корпорейшн Устройство и способ конфигурации сигнализации зондирующих опорных сигналов
CN106488661A (zh) * 2015-08-25 2017-03-08 宣浩卿 具有部分加强的移送辊的印刷电路板镀敷装置
CN108430170A (zh) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 一种电路板基板的制作方法
CN113853523A (zh) * 2019-03-20 2021-12-28 科罗拉多大学董事会 包括螯合金属的电化学储存装置

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* Cited by examiner, † Cited by third party
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WO2009112573A2 (de) * 2008-03-13 2009-09-17 Basf Se Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse
CA2724017C (en) * 2008-04-15 2017-03-14 Nonin Medical, Inc. Non-invasive optical sensor
CN102318044A (zh) * 2008-05-08 2012-01-11 巴斯夫欧洲公司 包含碳化硅层的层型结构、其制备方法及其用途
KR20120023832A (ko) * 2009-05-26 2012-03-13 우시 썬테크 파워 컴퍼니 리미티드 물품 이송용 이송 롤러
DE102010042642B4 (de) 2010-10-19 2013-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen
US20130255858A1 (en) * 2012-04-03 2013-10-03 Jun-Chung Hsu Method of manufacturing a laminate circuit board
US9970297B2 (en) * 2014-08-29 2018-05-15 Rolls-Royce Corporation Composite fan slider with nano-coating
KR20160140241A (ko) 2015-05-29 2016-12-07 전자부품연구원 플라즈마 전해 기반의 시료 코팅 방법
WO2018013874A1 (en) 2016-07-13 2018-01-18 Alligant Scientific, LLC Electrochemical methods, devices and compositions
EP4200452A4 (en) 2020-08-18 2024-10-09 Enviro Metals, LLC METAL REFINING
CN114481244B (zh) * 2022-02-24 2022-08-23 广东盈华电子科技有限公司 一种电解铜箔耐高温抗氧化的表面处理工艺
DE102022120646A1 (de) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung

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US4019877A (en) * 1975-10-21 1977-04-26 Westinghouse Electric Corporation Method for coating of polyimide by electrodeposition
EP0437705B1 (de) * 1989-12-23 1994-01-26 Heraeus Elektrochemie GmbH Verfahren und Vorrichtung zur kontinuierlichen elektrolytischen Ausbringung von Metall in Form eines Bandes aus einer Lösung sowie Verwendung der Vorrichtung
ATE125001T1 (de) * 1991-04-12 1995-07-15 Siemens Ag Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.
US5705219A (en) * 1991-04-22 1998-01-06 Atotech Deutschland Gmbh Method for coating surfaces with finely particulate materials
DE4212567A1 (de) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
DE19633796B4 (de) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
EP1541719A3 (en) * 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE10043817C2 (de) * 2000-09-06 2002-07-18 Egon Huebel Anordnung und Verfahren für elektrochemisch zu behandelndes Gut
DE10248965A1 (de) * 2002-10-15 2004-04-29 Simmerlein, Ewald Wilhelm Galvanisierungseinrichtung zum freien Beschichten von leitfähigen Strukturen und Flächen, mit und ohne Versorgungsbahnen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
DE102005033784A1 (de) * 2005-07-20 2007-01-25 Viktoria Händlmeier System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial
DE102005038450A1 (de) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
DE102005038449B4 (de) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren
WO2007118875A2 (de) * 2006-04-18 2007-10-25 Basf Se Vorrichtung und verfahren zur galvanischen beschichtung
WO2007118810A2 (de) * 2006-04-18 2007-10-25 Basf Se Vorrichtung und verfahren zur galvanischen beschichtung

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102844470A (zh) * 2010-01-26 2012-12-26 安美特德国有限公司 用于在化学和/或电化学处理系统中输送类板状基板的装置
RU2536345C2 (ru) * 2010-03-31 2014-12-20 ЗетТиИ Корпорейшн Устройство и способ конфигурации сигнализации зондирующих опорных сигналов
CN106488661A (zh) * 2015-08-25 2017-03-08 宣浩卿 具有部分加强的移送辊的印刷电路板镀敷装置
CN106488661B (zh) * 2015-08-25 2019-03-01 Lg伊诺特有限公司 具有部分加强的移送辊的印刷电路板镀敷装置
CN108430170A (zh) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 一种电路板基板的制作方法
CN113853523A (zh) * 2019-03-20 2021-12-28 科罗拉多大学董事会 包括螯合金属的电化学储存装置
CN113853523B (zh) * 2019-03-20 2024-06-07 科罗拉多大学董事会 包括螯合金属的电化学储存装置

Also Published As

Publication number Publication date
EP2099954A1 (de) 2009-09-16
TW200829726A (en) 2008-07-16
RU2009124293A (ru) 2011-01-10
BRPI0719665A2 (pt) 2013-12-17
IL198594A0 (en) 2010-02-17
KR20090083489A (ko) 2009-08-03
US20090301891A1 (en) 2009-12-10
JP2010511103A (ja) 2010-04-08
WO2008065069A1 (de) 2008-06-05

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090923