ATE125001T1 - Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten. - Google Patents

Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.

Info

Publication number
ATE125001T1
ATE125001T1 AT92907748T AT92907748T ATE125001T1 AT E125001 T1 ATE125001 T1 AT E125001T1 AT 92907748 T AT92907748 T AT 92907748T AT 92907748 T AT92907748 T AT 92907748T AT E125001 T1 ATE125001 T1 AT E125001T1
Authority
AT
Austria
Prior art keywords
contact members
plate
circuit boards
particular circuit
shaped workpieces
Prior art date
Application number
AT92907748T
Other languages
English (en)
Inventor
Daniel Hosten
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19924211253 external-priority patent/DE4211253A1/de
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of ATE125001T1 publication Critical patent/ATE125001T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
AT92907748T 1991-04-12 1992-04-09 Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten. ATE125001T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP91105887 1991-04-12
DE4131379 1991-09-20
DE4131377 1991-09-20
DE4132144 1991-09-26
DE19924211253 DE4211253A1 (de) 1992-04-03 1992-04-03 Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten

Publications (1)

Publication Number Publication Date
ATE125001T1 true ATE125001T1 (de) 1995-07-15

Family

ID=27511541

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92907748T ATE125001T1 (de) 1991-04-12 1992-04-09 Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.

Country Status (3)

Country Link
AT (1) ATE125001T1 (de)
DE (1) DE59202882D1 (de)
WO (1) WO1992018669A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19628784A1 (de) * 1996-07-17 1998-01-22 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE19633797B4 (de) * 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19835332A1 (de) * 1998-08-05 2000-02-10 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE10019713C2 (de) * 2000-04-20 2003-11-13 Atotech Deutschland Gmbh Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen
DE102005031948B3 (de) * 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
DE102009023763A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
CN112663119B (zh) * 2020-12-04 2022-05-31 重庆金美新材料科技有限公司 一种防止导电辊镀铜的装置及方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729390A (en) * 1967-11-24 1973-04-24 Du Pont Electrotinning process to prevent plating on the cathode contact roll
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage

Also Published As

Publication number Publication date
WO1992018669A1 (de) 1992-10-29
DE59202882D1 (de) 1995-08-17

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