DE59202882D1 - Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten. - Google Patents
Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.Info
- Publication number
- DE59202882D1 DE59202882D1 DE59202882T DE59202882T DE59202882D1 DE 59202882 D1 DE59202882 D1 DE 59202882D1 DE 59202882 T DE59202882 T DE 59202882T DE 59202882 T DE59202882 T DE 59202882T DE 59202882 D1 DE59202882 D1 DE 59202882D1
- Authority
- DE
- Germany
- Prior art keywords
- contact members
- panel
- contact
- shaped workpieces
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP91105887 | 1991-04-12 | ||
DE4131377 | 1991-09-20 | ||
DE4131379 | 1991-09-20 | ||
DE4132144 | 1991-09-26 | ||
DE19924211253 DE4211253A1 (de) | 1992-04-03 | 1992-04-03 | Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten |
PCT/DE1992/000288 WO1992018669A1 (de) | 1991-04-12 | 1992-04-09 | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59202882D1 true DE59202882D1 (de) | 1995-08-17 |
Family
ID=27511541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE59202882T Expired - Lifetime DE59202882D1 (de) | 1991-04-12 | 1992-04-09 | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten. |
Country Status (3)
Country | Link |
---|---|
AT (1) | ATE125001T1 (de) |
DE (1) | DE59202882D1 (de) |
WO (1) | WO1992018669A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19628784A1 (de) * | 1996-07-17 | 1998-01-22 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten |
DE19633797B4 (de) * | 1996-08-22 | 2005-08-04 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen |
DE19835332A1 (de) * | 1998-08-05 | 2000-02-10 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten |
DE10019713C2 (de) | 2000-04-20 | 2003-11-13 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen |
DE102005031948B3 (de) * | 2005-07-08 | 2006-06-14 | Höllmüller Maschinenbau GmbH | Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle |
TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
DE102009023763A1 (de) * | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten |
CN112663119B (zh) * | 2020-12-04 | 2022-05-31 | 重庆金美新材料科技有限公司 | 一种防止导电辊镀铜的装置及方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729390A (en) * | 1967-11-24 | 1973-04-24 | Du Pont | Electrotinning process to prevent plating on the cathode contact roll |
DE3929728A1 (de) * | 1989-09-07 | 1991-03-14 | Werner M Kraemer | Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage |
-
1992
- 1992-04-09 AT AT92907748T patent/ATE125001T1/de not_active IP Right Cessation
- 1992-04-09 DE DE59202882T patent/DE59202882D1/de not_active Expired - Lifetime
- 1992-04-09 WO PCT/DE1992/000288 patent/WO1992018669A1/de active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
ATE125001T1 (de) | 1995-07-15 |
WO1992018669A1 (de) | 1992-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG, 33106 PADE |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: HöLLMüLLER MASCHINENBAU GMBH, 71083 HERRENBERG, DE |