SG46609A1 - Method of electrolytically treating in particular flat material and apparatus particularly for carrying out the method - Google Patents

Method of electrolytically treating in particular flat material and apparatus particularly for carrying out the method

Info

Publication number
SG46609A1
SG46609A1 SG1996006712A SG1996006712A SG46609A1 SG 46609 A1 SG46609 A1 SG 46609A1 SG 1996006712 A SG1996006712 A SG 1996006712A SG 1996006712 A SG1996006712 A SG 1996006712A SG 46609 A1 SG46609 A1 SG 46609A1
Authority
SG
Singapore
Prior art keywords
item
drillings
items
carrying
flat material
Prior art date
Application number
SG1996006712A
Inventor
Thomas Kosikowski
Reinhard Schneider
Rolf Schroder
Klaus Wolfer
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4324330A external-priority patent/DE4324330C2/en
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG46609A1 publication Critical patent/SG46609A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention relates to a process for the electrolytic processing of flat and perforated items, especially in the form of printed circuit boards with drillings, which are taken through a treatment bath or to a processing station by conveyor means, in which there are means for reducing the metal-ion-depleted diffusion region in front of the surface of the items to be processed. For this purpose, in the presence of an anode and a cathodic item (K) or a cathode and an anodic item, the surface (K1) of the item to be treated is continuously mechanically wiped and the electrolyte is moved in a component substantially perpendicular to the plane of the item to be processed and taken through its drillings (42). The description also relates to an arrangement for implementing the process which contains means (W) for wiping the surfaces of the items to be treated and means to move the electrolyte through its drillings.
SG1996006712A 1992-08-01 1993-08-02 Method of electrolytically treating in particular flat material and apparatus particularly for carrying out the method SG46609A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4225541 1992-08-01
DE4324330A DE4324330C2 (en) 1992-08-01 1993-07-20 Process for the electrolytic treatment of, in particular, flat items to be treated, and arrangement, in particular for carrying out this process

Publications (1)

Publication Number Publication Date
SG46609A1 true SG46609A1 (en) 1998-02-20

Family

ID=25917128

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996006712A SG46609A1 (en) 1992-08-01 1993-08-02 Method of electrolytically treating in particular flat material and apparatus particularly for carrying out the method

Country Status (8)

Country Link
EP (1) EP0652982B1 (en)
JP (1) JPH07509539A (en)
AT (1) ATE143422T1 (en)
CA (1) CA2141604C (en)
ES (1) ES2093524T3 (en)
HK (1) HK38697A (en)
SG (1) SG46609A1 (en)
WO (1) WO1994003655A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4418278C1 (en) * 1994-05-26 1995-04-20 Atotech Deutschland Gmbh Electrolytic process for treatment of printed circuit boards in horizontal continuous plants
DE102005024102A1 (en) 2005-05-25 2006-11-30 Atotech Deutschland Gmbh Method, clamp and device for transporting a material to be treated in an electrolysis plant
KR101284197B1 (en) 2009-05-13 2013-07-09 아토테크 도이칠란드 게엠베하 Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
DE102009032217A1 (en) * 2009-07-06 2011-01-13 Gebr. Schmid Gmbh & Co. Method and device for the treatment of substrates
JP5416005B2 (en) * 2009-08-27 2014-02-12 丸仲工業株式会社 Transport device for plate-like object in surface treatment device, and clamping chuck of this transport device
CN103813644B (en) * 2012-10-31 2016-07-06 四川虹视显示技术有限公司 OLED flexible PCB vacuum absorption device
US9765444B2 (en) * 2014-12-03 2017-09-19 Metal Industries Research & Development Centre Continuous electrochemical machining apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR667687A (en) * 1928-01-30 1929-10-19 Improvements to the apparatus of galvanostegic metallization tanks
GB942595A (en) * 1960-07-28 1963-11-27 Steel Improvement & Forge Co Method and apparatus for electroplating
CH421654A (en) * 1964-09-18 1966-09-30 Huguenin & Cie Installation for the deposition of metallic layers by electrolysis
AT305719B (en) * 1969-11-24 1973-03-12 Norton Co Method and device for the electrolytic deposition of metal
US3706650A (en) * 1971-03-26 1972-12-19 Norton Co Contour activating device
JPS57200591A (en) * 1981-06-02 1982-12-08 Electroplating Eng Of Japan Co Plating apparatus
GB2181743A (en) * 1985-07-16 1987-04-29 Kay Kazuo Metal plating of through holes in printed circuit boards
US4610772A (en) * 1985-07-22 1986-09-09 The Carolinch Company Electrolytic plating apparatus
JPS6274096A (en) * 1985-09-27 1987-04-04 Kawasaki Steel Corp High current density electrolytic treatment device
US4875982A (en) * 1987-02-06 1989-10-24 Velie Circuits, Inc. Plating high aspect ratio holes in circuit boards
US5211826A (en) * 1991-09-26 1993-05-18 Siemens Aktiengesellschaft Electroplating means for perforated printed circuit boards to be treated in a horizontal pass

Also Published As

Publication number Publication date
EP0652982B1 (en) 1996-09-25
ES2093524T3 (en) 1996-12-16
EP0652982A1 (en) 1995-05-17
JPH07509539A (en) 1995-10-19
CA2141604A1 (en) 1994-02-17
WO1994003655A1 (en) 1994-02-17
CA2141604C (en) 2005-05-24
HK38697A (en) 1997-04-04
ATE143422T1 (en) 1996-10-15

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