HK38697A - Process for the electrolytic processing especially of flat items and arrangement for implementing the process - Google Patents
Process for the electrolytic processing especially of flat items and arrangement for implementing the processInfo
- Publication number
- HK38697A HK38697A HK38697A HK38697A HK38697A HK 38697 A HK38697 A HK 38697A HK 38697 A HK38697 A HK 38697A HK 38697 A HK38697 A HK 38697A HK 38697 A HK38697 A HK 38697A
- Authority
- HK
- Hong Kong
- Prior art keywords
- item
- items
- implementing
- arrangement
- drillings
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Metals (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention relates to a process for the electrolytic processing of flat and perforated items, especially in the form of printed circuit boards with drillings, which are taken through a treatment bath or to a processing station by conveyor means, in which there are means for reducing the metal-ion-depleted diffusion region in front of the surface of the items to be processed. For this purpose, in the presence of an anode and a cathodic item (K) or a cathode and an anodic item, the surface (K1) of the item to be treated is continuously mechanically wiped and the electrolyte is moved in a component substantially perpendicular to the plane of the item to be processed and taken through its drillings (42). The description also relates to an arrangement for implementing the process which contains means (W) for wiping the surfaces of the items to be treated and means to move the electrolyte through its drillings.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4225541 | 1992-08-01 | ||
DE4324330A DE4324330C2 (en) | 1992-08-01 | 1993-07-20 | Process for the electrolytic treatment of, in particular, flat items to be treated, and arrangement, in particular for carrying out this process |
PCT/DE1993/000684 WO1994003655A1 (en) | 1992-08-01 | 1993-08-02 | Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
Publications (1)
Publication Number | Publication Date |
---|---|
HK38697A true HK38697A (en) | 1997-04-04 |
Family
ID=25917128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK38697A HK38697A (en) | 1992-08-01 | 1997-03-27 | Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0652982B1 (en) |
JP (1) | JPH07509539A (en) |
AT (1) | ATE143422T1 (en) |
CA (1) | CA2141604C (en) |
ES (1) | ES2093524T3 (en) |
HK (1) | HK38697A (en) |
SG (1) | SG46609A1 (en) |
WO (1) | WO1994003655A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4418278C1 (en) * | 1994-05-26 | 1995-04-20 | Atotech Deutschland Gmbh | Electrolytic process for treatment of printed circuit boards in horizontal continuous plants |
DE102005024102A1 (en) | 2005-05-25 | 2006-11-30 | Atotech Deutschland Gmbh | Method, clamp and device for transporting a material to be treated in an electrolysis plant |
WO2010130445A1 (en) | 2009-05-13 | 2010-11-18 | Atotech Deutschland Gmbh | Method and system for the treatment of flat feedstock, and device for removing or keeping away treatment liquid |
DE102009032217A1 (en) * | 2009-07-06 | 2011-01-13 | Gebr. Schmid Gmbh & Co. | Method and device for the treatment of substrates |
JP5416005B2 (en) * | 2009-08-27 | 2014-02-12 | 丸仲工業株式会社 | Transport device for plate-like object in surface treatment device, and clamping chuck of this transport device |
CN103813644B (en) * | 2012-10-31 | 2016-07-06 | 四川虹视显示技术有限公司 | OLED flexible PCB vacuum absorption device |
US9765444B2 (en) * | 2014-12-03 | 2017-09-19 | Metal Industries Research & Development Centre | Continuous electrochemical machining apparatus |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR667687A (en) * | 1928-01-30 | 1929-10-19 | Improvements to the apparatus of galvanostegic metallization tanks | |
GB942595A (en) * | 1960-07-28 | 1963-11-27 | Steel Improvement & Forge Co | Method and apparatus for electroplating |
CH421654A (en) * | 1964-09-18 | 1966-09-30 | Huguenin & Cie | Installation for the deposition of metallic layers by electrolysis |
AT305719B (en) * | 1969-11-24 | 1973-03-12 | Norton Co | Method and device for the electrolytic deposition of metal |
US3706650A (en) * | 1971-03-26 | 1972-12-19 | Norton Co | Contour activating device |
JPS57200591A (en) * | 1981-06-02 | 1982-12-08 | Electroplating Eng Of Japan Co | Plating apparatus |
GB2181743A (en) * | 1985-07-16 | 1987-04-29 | Kay Kazuo | Metal plating of through holes in printed circuit boards |
US4610772A (en) * | 1985-07-22 | 1986-09-09 | The Carolinch Company | Electrolytic plating apparatus |
JPS6274096A (en) * | 1985-09-27 | 1987-04-04 | Kawasaki Steel Corp | High current density electrolytic treatment device |
US4875982A (en) * | 1987-02-06 | 1989-10-24 | Velie Circuits, Inc. | Plating high aspect ratio holes in circuit boards |
US5211826A (en) * | 1991-09-26 | 1993-05-18 | Siemens Aktiengesellschaft | Electroplating means for perforated printed circuit boards to be treated in a horizontal pass |
-
1993
- 1993-08-02 SG SG1996006712A patent/SG46609A1/en unknown
- 1993-08-02 ES ES94906783T patent/ES2093524T3/en not_active Expired - Lifetime
- 1993-08-02 EP EP94906783A patent/EP0652982B1/en not_active Expired - Lifetime
- 1993-08-02 AT AT94906783T patent/ATE143422T1/en not_active IP Right Cessation
- 1993-08-02 CA CA002141604A patent/CA2141604C/en not_active Expired - Fee Related
- 1993-08-02 WO PCT/DE1993/000684 patent/WO1994003655A1/en active IP Right Grant
- 1993-08-02 JP JP6504898A patent/JPH07509539A/en active Pending
-
1997
- 1997-03-27 HK HK38697A patent/HK38697A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE143422T1 (en) | 1996-10-15 |
CA2141604A1 (en) | 1994-02-17 |
JPH07509539A (en) | 1995-10-19 |
ES2093524T3 (en) | 1996-12-16 |
EP0652982B1 (en) | 1996-09-25 |
SG46609A1 (en) | 1998-02-20 |
WO1994003655A1 (en) | 1994-02-17 |
EP0652982A1 (en) | 1995-05-17 |
CA2141604C (en) | 2005-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20090802 |