CN107881540A - The printed circuit board (PCB) plater of two or more coating can be performed simultaneously in a system - Google Patents
The printed circuit board (PCB) plater of two or more coating can be performed simultaneously in a system Download PDFInfo
- Publication number
- CN107881540A CN107881540A CN201610917146.1A CN201610917146A CN107881540A CN 107881540 A CN107881540 A CN 107881540A CN 201610917146 A CN201610917146 A CN 201610917146A CN 107881540 A CN107881540 A CN 107881540A
- Authority
- CN
- China
- Prior art keywords
- coating
- mentioned
- treat
- cross bar
- coating portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
Nickel plating, silver-plated and gold-plated printed circuit board (PCB) plater can be all performed in a system the present invention relates to a kind of.It includes, pre-treatment portion；First coating portion, coating object first time nickel plating will be treated by above-mentioned pre-treatment step；Second coating portion, its be arranged on the above-mentioned continuous main line in first coating portion, and will treat that coating object second carries out the second coating by above-mentioned first coating portion；3rd coating portion, it is arranged on the auxiliary production line being set up in parallel with above-mentioned main line, for by by above-mentioned first coating portion treat coating object second carry out the 3rd coating and with above-mentioned second coating portion and setting；Branch's transport unit, it will treat that coating object carries out branch's transmission towards above-mentioned auxiliary production line by above-mentioned first coating portion；Post processing portion, treat that coating object is post-processed by complete coating by above-mentioned second coating portion and the 3rd coating portion；Unloading part, it will treat that coating object is sent out by post processing portion.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB) plater, more particularly to one kind can perform plating simultaneously in a system
Nickel, copper facing, it is silver-plated and gold-plated in two or more coating printed circuit board (PCB) plater.
Background technology
Generally, it is multiple to substrate surface during being made when making includes the various substrates of printed circuit board (PCB)
Carry out coating.Coating be divided into a variety of its be respectively copper facing, it is nickel plating, silver-plated and gold-plated.This difference why be present, be because
It is different to the confidence level needed for wanted coated article.
Being additionally useful for the plater of substrate has vertical continuous electroplanting device.This is developed to improve production efficiency,
It is on suspender member in the state of hanging base board, while by the progress coating on one side of the long coating bath movement provided with electrode.Vertical continuous
Electroplanting device is that its galvanization process is carried out continuously so as to improve the system of production efficiency to greatest extent.Vertical continuous electricity in the past
Plating appts have the system that one piece of substrate is moved along a production line and is processed.If carry out nickel plating way in need into
, it is necessary to rearrange system when row is silver-plated or gold-plated.I.e., former system is not few according to product purpose compliance, multi items
Expense needed for amount production greatly improves, and is difficult the unexpected demand for tackling client.
【Citation】
【Patent document】
Korean patent application the 10-2012-0029921st
Korean patent application the 10-2013-0014725th
The content of the invention
In order to solve the above problems, it is an object of the present invention to provide a kind of as by the same to be plated of printed circuit board (PCB)
Layer object vertically hold up and carry out the vertical continuous electroplating device of coating along coating production line continuous moving, needed in way into
During other species coating of row, without rearranging system, so as to carry out a small amount of production of multi items and production efficiency can be improved
Method of coating and the plater for it.
Above-mentioned purpose is realized that a kind of printing that two or more coating can be all performed in a system is electric by following apparatus
Road plate plater, it is characterised in that including：One pre-treatment portion, the table for treating coating object that will be formed by various substrate forms
Face carries out degreasing and cleaning；
One first coating portion, it will treat that coating object carries out nickel plating for the first time by above-mentioned pre-treatment step；
One second coating portion, its be arranged on the above-mentioned continuous main line in first coating portion, and will pass through above-mentioned first
Coating portion treats second of the second coating of progress of coating object；One the 3rd coating portion, it is arranged on arranged side by side with above-mentioned main line
The auxiliary production line set, for by by above-mentioned first coating portion treat coating object second carry out the 3rd coating and with above-mentioned the
Two coating portions are set up in parallel；One branch's transport unit, by above-mentioned first coating portion coating object will be treated towards above-mentioned auxiliary production line
Carry out branch's transmission；One post processing portion, coating will be completed by above-mentioned second coating portion and the 3rd coating portion treats coating thing
Body is post-processed；One unloading part, it will treat that coating object is sent out by post processing portion.This coating species can be nickel plating,
Copper facing, it is silver-plated and gold-plated in any one.
According to another feature of the present invention, the coating species in above-mentioned second coating portion and the 3rd coating portion can be different.
According to further feature of the present invention, the first coating portion carries out nickel plating；The coating kind in the second coating portion and the 3rd coating portion
Class is different, one of them be it is silver-plated, it is another, be gold-plated.
According to further feature of the present invention, it is above-mentioned treat coating object be by under the vertical clamp position of suspender member along main line
And auxiliary production line movement, above-mentioned suspender member includes：
One top cross bar；One lower section cross bar, it is parallel with above-mentioned top cross bar；A pair of montants, it is by above-mentioned top cross bar
It is connected with lower section cross bar and forms the framework of window shape；One fixture, it is separately positioned on above-mentioned top cross bar and lower section cross bar
On,
Above-mentioned fixture by two pieces in order to treat that parallel be spaced of coating object is fixed respectively, and with above-mentioned top cross bar and lower section
Cross bar is defined is provided with two groups to front-rear direction.
Above-mentioned one group of fixture may be designed to four to by the upper and lower and left and right for treating coating object clamp respectively herein
More than.
Structure as described above, there is provided two kinds of different operatings can be performed simultaneously in a plating systems so as to which more product can be realized
The vertical continuous electroplanting device for the production purpose that kind produces on a small quantity.For being not necessarily to carry out gold-plated part, optionally
Into Silver Electroplating Production Line, so as to significantly save the disbursement that material is consumed needed for coating.
Suspender member according to another embodiment of the present invention, two pieces are clamped on a suspender member and treats that coating object carries out coating
Work, if therefore single-face plating, production efficiency can be improved about twice.
Brief description of the drawings
Fig. 1 is the plane structure chart of plater according to an embodiment of the invention.
Fig. 2 is the plane structure chart of plater according to another embodiment of the present invention.
Fig. 3 is the plane structure chart according to the plater of further embodiment of this invention.
Fig. 4 is the oblique view of plater suspender member according to an embodiment of the invention.
Fig. 5 is the side view of plater suspender member according to an embodiment of the invention.
Fig. 6 is the side view of the use state of plater suspender member according to an embodiment of the invention.
Fig. 7 and Fig. 8 is the oblique view of plater suspender member according to another embodiment of the present invention.
Fig. 9 is the plane structure chart of branch's transport unit according to embodiments of the present invention.
Reference
1：Pre-treatment portion 3：First coating portion
5：Second coating portion 7：3rd coating portion
9：Post processing portion 11：Unloading part
13：Branch's transport unit 15：Recoverer
17：Suspender member 19：Top cross bar
21：Lower section cross bar 23：Montant
27、29：Fixture
Embodiment
Below, the particular content of the present invention is described in detail referring concurrently to accompanying drawing Fig. 1 to Fig. 3.
The present invention relates to a kind of vertical continuous electroplanting device.As described above, vertical continuous electroplanting device is used as in printing electricity
Plate the same thin plate one or both sides in road carry out the device of all or part of coating, are with what continuous moving treated coating object
System.
As treating that substrate that coating object uses can have a many kinds, thus interest field of the present invention be not limited to it is any one
Kind substrate.
Therefore apparatus of the present invention substantially comply with galvanization process usually used in the past.Carried out hence in galvanization process
The detailed descriptions of multiple detailed process omitted.
Pre-treatment portion 1 treats that coating body surface carries out degreasing and cleaning (rinsing) by what various substrate forms formed.Before
Processing unit 1 may include drying process and Soft lithograph process, and cleaning can also be divided into multiple progress.
First coating portion 3 will treat that coating object carries out coating for the first time by pre-treatment step.Plated as one first
Layer portion 3 can carry out nickel plating.
Second coating portion 5 with it is set on 3 continuous main line ML of the first coating portion, the first coating portion 3 will be passed through
Treat that coating object carries out second second coating.According to diagram, main line ML is linear, if but continuity, it can adopt
WithFont or U-shaped.
The plater of the present invention will be while will treat that coating object transmits one along continuous main line ML (main line)
Side carries out coating processing, is further equipped with the auxiliary production line SL of subsidiary production line (sub line) herein.
Auxiliary production line SL is to be set up in parallel with main line ML and will treat that coating object carries out the by the first coating portion 3
The production line of secondary 3rd coating.The 3rd coating portion 7 is set up in parallel with the second coating portion 5 on auxiliary production line SL.
Branch's transport unit 13 is will to treat that coating object branch is sent to the component of auxiliary production line by the first coating portion 1.
Post processing portion 9 be by by the second coating portion 5 and the 3rd coating portion 7 complete coating after coating object progress after
The engineering of processing, it may include pickling, cleaning and drying process.
Unloading part 11 is by by the engineering treated coating object and sent out in post processing portion 9.Sent out by unloading part 9
Treat coating object and load the state in place surely to be loaded in and be transplanted on successive projects.
According to the present invention can in a system by nickel plating, it is silver-plated and it is gold-plated all carry out.
According to embodiments of the present invention, the first coating portion 3 can perform nickel plating as described above.Second coating portion 5 and the 3rd coating
The coating species in portion 7 is different.Such as, one of them can be it is silver-plated, it is another, can be gold-plated.As another example, its
One of can be the soft gold of plating, it is another, can be the hard gold of plating.
First, second, third coating portion 3,5,7 uses respectively as the concept including incidental work beyond coating.Assuming that
(rinse) engineering is cleaned, dries the incidental works such as engineering.
According to embodiments of the present invention, can be as shown in figure 1, the post processing portion 9 set behind second, third coating portion 5,7
Each cladding portion does not set 9a, 9b, and available one merges setting as shown in Figure 2.It should also include recoverer 15 as shown in Figure 2.Return
Receipts portion 15 enters to be about to treat that coating object revert to main line ML work again by the 3rd coating portion 7, and plays and divide
The similar function of branch transport unit 13.
In addition, according to another embodiment of the present invention, as shown in Figure 3 can be by two auxiliary production line SL, SL ' form.Each auxiliary
Production line can perform variety classes coating.3rd coating portion 7 can be also made up of 3-1 coating portion 7 and 3-2 coating portion 7 ".Knot
Fruit treats that coating object can carry out the coating of three kinds of different modes in a system.
Illustrate branch's transport unit 13 referring to Fig. 9.
Branch's transport unit 13 by control unit instruction will treat coating object i.e., suspender member 17 be supplied to the 3rd supply department 7.By
One coating portion 3 treats that coating object 17 is located at branch part, and sensor senses enter treating coating object and opening for branch part 35
Dynamic branch's transmission motor 39, so as to treat that coating object branch is sent to the 3rd supply department 7.Branch's transport unit 13 includes guide rail
37, it is suspended on as shown in Figures 4 to 6 on suspender member and treats that coating object transmits along guide rail 37.If without the branch of control unit
Instruction, the continuous motor 41 that transmits will treat coating object along main line linear transmission to the second coating portion 5.
Below, reference picture 4 illustrates the suspender member that coating object is treated for clamping to Fig. 6.
Suspender member 17 moves in the state of layer object P to be plated is vertically clamped along main line and auxiliary production line.Hanging
Part 17 and straight line or is moved up and down by determined guide rail drive device.For by suspender member 17 clamp or move horizontally or on move down
Dynamic structure is known technology, therefore detailed description will be omitted and diagram.
Suspender member 17 consists essentially of：One top cross bar 19；One lower section cross bar 21, it is parallel with above-mentioned top cross bar 19；
A pair of montants 23,25, above-mentioned top cross bar 19 is connected with lower section cross bar 21 and forms window shape framework；One fixture 27,29,
It is respectively provided at above-mentioned top cross bar 19 and lower section cross bar 21.The quantity and set-up mode of fixture 27,29 can according to treating coating object P and
It is fixed.If when coating object P is substrate (such as, below 0.1mm) of the ultra-thin shape of very thin thickness, it is necessary to fixed substrate up and down
And need up and lower section etc. is clamped everywhere.
Suspender member according to embodiments of the present invention have can clamp two pieces of structures for treating coating object P.I.e., fore-and-aft direction is set
Each fixture 27,29 put by two pieces in order to treat that parallel are spaced of coating object P is fixed respectively as shown in Figure 6, with top cross bar 19
It is defined with lower section cross bar 21 and is provided with two groups to front-rear direction.
Here, one group of fixture will be in order to will treat above and below coating object P and left and right is clamped formed by more than four respectively.As schemed
Show that eight fixtures form one group.
As described above, the quantity and arrangement of fixture 27,29 can be according to treating coating object P, P ' it is adjusted.
The support 31 for being used for transmitting suspender member is provided with the upper end of suspender member 17, is provided with support and is used to lift suspender member 17
And shift position or suspender member is hung over to hook 33 on guide rail.The hook is settable in suspender member upper and lower side, and quantity is not
It is limited to shown in accompanying drawing, can be formed by four.
According to constituted above, treating coating object P, P ' lateral surface i.e., on the face that is exposed on the external carry out coating respectively.
Treat coating object P, P ' medial surface there is no electroplate liquid supply, therefore coating can not be normally carried out.Therefore the present embodiment is suitable
The suspender member used when performing single-face plating to substrate.According to the suspender member of the present invention, if single-face plating, there is provided hung than in the past
Suspension member is up to twice of production efficiency.
In addition, the interest field of the present invention is not limited to the clamping shape of suspender member.Such as, suspender member 17 can possess as figure
Structure shown in 7 and Fig. 8.Fig. 7 is can only to clamp one piece of suspender member for treating coating object 17, and Fig. 8, which illustrates to clamp, treats coating
The suspender member 17 of the upper end of object.Embodiment before unaccounted reference can refer in Fig. 7 and Fig. 8.Suspender member in Fig. 8
17 be adapted to the thicker substrate shape of clamping treat coating object P, P ' structure.
As above the structure for illustrating and illustrating is the preferred embodiments according to the technology of the present invention thought.It is total well known, ability
Domain worker can be based on usual common technical knowledge and carry out varied change implementation, but these can be included in protection scope of the present invention
It is interior.Embodiments of the disclosure can be combined and implement, and this combination is included in interest field of the present invention.Especially specifically refer to
The example of coating species, simply coating, interest field of the invention, which should not necessarily be limited by, uses certain coating.
Claims (4)
- A kind of 1. printed circuit board (PCB) plater that can perform two or more coating simultaneously in a system, it is characterised in that Including：One pre-treatment portion, the surface for treating coating object formed by various substrate forms is subjected to degreasing and cleaning；One first coating portion, it will treat that coating object carries out nickel plating for the first time by above-mentioned pre-treatment step；One second coating portion, its be arranged on the above-mentioned continuous main line in first coating portion, and above-mentioned first coating will be passed through Portion treats second of the second coating of progress of coating object；One the 3rd coating portion, it is arranged on is set up in parallel with above-mentioned main line Auxiliary production line, for will by above-mentioned first coating portion treat coating object second carry out the 3rd coating and with the above-mentioned second plating Layer portion is set up in parallel；One branch's transport unit, it will treat that coating object is carried out towards above-mentioned auxiliary production line by above-mentioned first coating portion Branch transmits；One post processing portion, treat that coating object enters by complete coating by above-mentioned second coating portion and the 3rd coating portion Row post processing；One unloading part, it will treat that coating object is sent out by post processing portion.
- 2. the printed circuit board (PCB) coating dress according to claim 1 that two or more coating can be performed simultaneously in a system Put, it is characterised in thatThe coating species in above-mentioned second coating portion and the 3rd coating portion is different.
- 3. the printed circuit board (PCB) coating dress according to claim 1 that two or more coating can be performed simultaneously in a system Put, it is characterised in thatAbove-mentioned first coating portion carries out nickel plating；The coating species in the second coating portion and the 3rd coating portion is different, one of them Be it is silver-plated, it is another, be gold-plated.
- 4. the printed circuit board (PCB) coating dress according to claim 1 that two or more coating can be performed simultaneously in a system Put, it is characterised in thatIt is above-mentioned to treat that coating object is moved under the vertical clamp position of suspender member along main line and auxiliary production line, it is above-mentioned to hang Suspension member includes：One top cross bar；One lower section cross bar, it is parallel with above-mentioned top cross bar；A pair of montants, it is by above-mentioned top cross bar It is connected with lower section cross bar and forms the framework of window shape；One fixture, it is separately positioned on above-mentioned top cross bar and lower section cross bar On,Above-mentioned fixture by two pieces in order to treat that parallel be spaced of coating object is fixed respectively, and with above-mentioned top cross bar and lower section cross bar It is defined and is provided with two groups to front-rear direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160125556A KR101729769B1 (en) | 2016-09-29 | 2016-09-29 | Apparatus For Plating PCB Can Plate More Than Two Kinds Of Plating in One System |
| KR10-2016-0125556 | 2016-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107881540A true CN107881540A (en) | 2018-04-06 |
Family
ID=58704207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610917146.1A Pending CN107881540A (en) | 2016-09-29 | 2016-10-20 | The printed circuit board (PCB) plater of two or more coating can be performed simultaneously in a system |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101729769B1 (en) |
| CN (1) | CN107881540A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111167638A (en) * | 2018-11-12 | 2020-05-19 | 群翊工业股份有限公司 | Electrostatic spraying method for manual feeding and manual feeding device for electrostatic spraying process |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY196500A (en) * | 2017-06-05 | 2023-04-17 | Almex Pe Inc | Transfer Jig And Surface Treatment Apparatus Using Same |
| CN107190289A (en) * | 2017-06-14 | 2017-09-22 | 深圳市呈永鑫精密电路有限公司 | A kind of pcb board of the high environment resistance of low magnetic and preparation method thereof |
| KR102406772B1 (en) * | 2018-06-12 | 2022-06-10 | 주식회사 지씨이 | Roll-to-roll electroplating equipment with plating peeling function for clamp |
| KR101943403B1 (en) * | 2018-06-12 | 2019-01-29 | 주식회사 지씨이 | Roll-to-roll electroplating equipment with plating peeling function for clamp |
| KR102035236B1 (en) * | 2019-08-12 | 2019-10-22 | 김문식 | Plating system |
| KR102035233B1 (en) * | 2019-08-12 | 2019-10-22 | 김문식 | Plating system |
| KR102057507B1 (en) | 2019-08-12 | 2019-12-19 | 김문식 | Plating system |
| KR102514055B1 (en) * | 2022-10-06 | 2023-03-27 | (주)선우하이테크 | Wafer wet type treating system |
| KR102539090B1 (en) * | 2023-01-09 | 2023-06-02 | (주)티피에스일렉콤 | Vertical continuous electroplating device capable of adjusting the arrangement angle and moving distance of the object to be plated |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005089799A (en) * | 2003-09-16 | 2005-04-07 | Toppan Printing Co Ltd | Plating device |
| CN1234919C (en) * | 2000-03-27 | 2006-01-04 | 三洋电机株式会社 | Electroplating apparatus |
| CN2890093Y (en) * | 2005-12-06 | 2007-04-18 | 比亚迪股份有限公司 | Electroplating rack |
| CN201080507Y (en) * | 2007-01-29 | 2008-07-02 | 亚洲电镀器材有限公司 | Conveying systems for electroplating machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002234432A (en) | 2001-02-07 | 2002-08-20 | Nippon Light Metal Co Ltd | Mobile body track device |
-
2016
- 2016-09-29 KR KR1020160125556A patent/KR101729769B1/en active IP Right Grant
- 2016-10-20 CN CN201610917146.1A patent/CN107881540A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1234919C (en) * | 2000-03-27 | 2006-01-04 | 三洋电机株式会社 | Electroplating apparatus |
| JP2005089799A (en) * | 2003-09-16 | 2005-04-07 | Toppan Printing Co Ltd | Plating device |
| CN2890093Y (en) * | 2005-12-06 | 2007-04-18 | 比亚迪股份有限公司 | Electroplating rack |
| CN201080507Y (en) * | 2007-01-29 | 2008-07-02 | 亚洲电镀器材有限公司 | Conveying systems for electroplating machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111167638A (en) * | 2018-11-12 | 2020-05-19 | 群翊工业股份有限公司 | Electrostatic spraying method for manual feeding and manual feeding device for electrostatic spraying process |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101729769B1 (en) | 2017-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107881540A (en) | The printed circuit board (PCB) plater of two or more coating can be performed simultaneously in a system | |
| JP6448494B2 (en) | Suction plating equipment | |
| JPH0571665B2 (en) | ||
| KR20140010262A (en) | Insulating base material plated with metal layer, plating method thereof, and transparent electrode using the same | |
| EP1438446B1 (en) | System and method for electrolytic plating | |
| ATE211602T1 (en) | DEVICE FOR THE ELECTROLYTICAL TREATMENT OF PLATE-SHAPED ITEMS TO BE TREATED AND METHOD FOR ELECTRICALLY SHIELDING THE EDGE AREAS OF THE ITEMS TO BE TREATED DURING ELECTROLYTIC TREATMENT | |
| JP2017008346A (en) | Substrate conveyance apparatus and holding part | |
| CN110719700A (en) | Horizontal line PCB board frame | |
| CN200955075Y (en) | Shallow-tank hange of printed circuit board | |
| ATE180622T1 (en) | METHOD AND DEVICE FOR THE CHEMICAL AND ELECTROLYTICAL TREATMENT OF CIRCUIT BOARDS AND CONDUCTOR FILMS | |
| CN201598342U (en) | Circuit board plating rack | |
| JP2015063717A (en) | Workpiece holding frame body and plating treatment apparatus using the same | |
| CN106011954B (en) | Cyanideless electro-plating copper solution and preparation method thereof and application method | |
| CA2141604A1 (en) | Process for the electrolytic processing especially of flat items and arrangement for implementing the process | |
| TWM613607U (en) | Carrier with deviation angle | |
| CN108617103B (en) | Jigsaw structure | |
| TWI615510B (en) | Suction plating apparatus | |
| TW200831714A (en) | Guide device used for electroplating treatment system | |
| TWI767561B (en) | Vehicle with Offset Angle | |
| JPH04217387A (en) | Electroless plating method for conductor pattern and electroless plating jig | |
| KR200180025Y1 (en) | A thin electric gilding multipurpose rack | |
| KR102514055B1 (en) | Wafer wet type treating system | |
| CN213266750U (en) | Plating apparatus | |
| KR20050042628A (en) | Guard apparatus for metal sheet in plating system | |
| JP2007107061A (en) | Hanger for transportation and transporting method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180406 |
|
| WD01 | Invention patent application deemed withdrawn after publication |