CN201080507Y

CN201080507Y - Conveying systems for electroplating machine

Info

Publication number: CN201080507Y
Application number: CNU2007200021605U
Authority: CN
Inventors: 黄志荣; 李家立; 陈嘉文
Original assignee: YAZHOU ELECTROPLATING EQUIPMENT CO Ltd
Current assignee: YAZHOU ELECTROPLATING EQUIPMENT CO Ltd
Priority date: 2007-01-29
Filing date: 2007-01-29
Publication date: 2008-07-02
Anticipated expiration: 2017-01-29

Abstract

The utility model discloses a transporting system (10) used for an electroplating machine, comprising at least two rows of processing tanks (18a, 18b, 20a, 20b, 22a, 22b, 24a and 24b) which execute the same processing courses and are arranged in parallel; first shuttle units (26) which are arranged at the upper parts of the processing tanks (18a, 18b, 20a, 20b, 22a, 22b, 24a and 24b) and used for selectively transporting a lining to any one of the two rows of processing tanks; and second shuttle units (28) which are arranged at the lower parts of the processing tanks (18a, 18b, 20a, 20b, 22a, 22b, 24a and 24b) and used for selectively receiving the processed lining in any one of the two rows of the processing tanks (18a, 18b, 20a, 20b, 22a, 22b, 24a and 24b).

Description

The transfer system that is used for electroplating machine

Technical field

The utility model relates to a kind of transfer system that is used for electroplating machine, relates in particular to a kind of like this system, and it is suitable for many substrates are transmitted the individual multiprocessing groove that passes through electroplating machine.

Background technology

In electroplating process, many substrates for example printed circuit board (PCB) (PCB ' s) flatly or vertically are transmitted, and by many treatment troughs of arranging continuously as series system, thereby stand the various processing of water or chemical preparations in treatment trough.As time goes on, some grooves for example are used to carry out those grooves that electroless copper is handled, and possibility must be accepted thoroughly cleaning and/or additional so that keep satisfactory performance.Yet, the cleaning of groove and/or replenish and will cause whole plating line shut-down operation, this may have a strong impact on the product progress and increase product cost.

In addition, in some treatment steps for example removed photoresist slag and expansion, the PCB ' s of certain size may must stand the long treatment time, but the PCB ' s of a different size may only must stand than the short treatment time.Existing machine can not satisfy the requirement of this treatment time difference.

Thereby the purpose of this utility model provides a kind of transfer system that is used for electroplating machine of alleviating above-mentioned defective, and the replacement that perhaps being at least the market and the public provides usefulness is selected.

The utility model content

According to the utility model, a kind of transfer system that is used for electroplating machine is provided, comprising at least two treatment troughs, its layout parallel to each other and be suitable for carrying out same process; First delivery unit, it is in the upstream of described treatment trough and be suitable for optionally substrate being sent to any one of described at least two treatment troughs; With second delivery unit, it is in the downstream of described treatment trough and be suitable for optionally being received in processed substrate in any one of described at least two treatment troughs.

Pass through said structure, the utility model has been realized following useful technique effect: solved in the prior art when the problem that the electroplating processes groove is thoroughly cleaned and/or must make when additional a whole set of plating line shut-down operation, and required treatment time of different size product different problem in some treatment step on the production line.

Description of drawings

Referring now to accompanying drawing, the embodiment that is used for the transfer system of electroplating machine according to the utility model is described by way of example, wherein:

Fig. 1 is the schematic block diagram that comprises according to the part of the electroplating machine of transfer system of the present utility model;

Fig. 2 is the schematic block diagram that is illustrated in the travel direction of PCB ' s in the part of electroplating machine of dotted line internal labeling;

Fig. 3 and 4 has represented the move mode of the substrate support of the delivery unit in the transfer system shown in Figure 1; With

Fig. 5 is the enlarged view of the substrate support shown in Fig. 3 and Fig. 4.

Embodiment

Fig. 1 is the schematic block diagram that is designated as the part of 10 electroplating machine usually, and wherein many treatment troughs 12 are in series arranged.Also be used to carry out four treatment troughs, 16 layouts parallel to each other that electroless copper is handled as can be seen, and two row treatment troughs also are arranged parallel to each other, described treatment trough includes

expansion slot

18a, 18b, the

first cleaning slot

20a, 20b, the

second cleaning slot

22a, 22b and remove

photoresist slag chute

24a, 24b.

The upstreams of two

row treatment trough

18a, 18b, 20a, 20b, 22a, 22b, 24a, 24b are first unit 26 that shuttle back and forth, and the downstream of

treatment trough

18a, 18b, 20a, 20b, 22a, 22b, 24a, 24b is second unit 28 that shuttles back and forth.First the shuttle back and forth unit 26 receives substrate (for example PCB ' s) from upstream loading bin 30, and substrate is sent to two

expansion slot

18a, 18b, and second the shuttle back and forth unit 28 receives substrate from two remove

photoresist slag chute

24a, 24b, to be used to be fed forward to the cleaning slot 32 in downstream.For each specific substrate, the unit 26 that shuttles back and forth can optionally be sent to it expansion slot 18a or 18b.Similarly, the unit 28 that shuttles back and forth can optionally receive substrate from remove

photoresist slag chute

24a or 24b.

As can be seen, the PCB ' s's in the various treatment troughs in this part of electroplating machine flows mostly just along a direction, promptly to the right in Fig. 2.Yet, optionally be sent in the treatment trough of two parallel placements one or be received in order to make PCB ' s from it, the

unit

26,28 that shuttles back and forth can be transversely in treatment trough the direction of the travel direction of PCB ' s transmit PCB ' s.

The

unit

26,28 that shuttles back and forth is structurally basic identical, and the unit 26 that shuttles back and forth is shown in Fig. 3-Fig. 5.The unit 26 that shuttles back and forth has two framework legs 40, and described framework leg engages by connecting rod 42 in their upper end, and described connecting rod serves as the track that handling machinery 44 can slide thereon.Two finger 46 hang downwards from handling machinery 44, and each finger is fixing with the support 48 that is used to keep the PCB (not shown).Motor 50 is located on the connecting rod 42 to be used to drive handling machinery 44.By such layout, when being driven by motor 50, handling machinery 44 can move along track 42 with the PCB ' s that it is delivered.

Thereby, the handling machinery 44 of unit 26 of shuttling back and forth can be optionally moves between the second position of the direct upstream of the first location of the direct upstream of expansion slot 18a and expansion slot 18b, described first location is used for the PCB ' s of support 48 deliveries is sent to the transfer system of expansion slot 18a, and the described second position is used for the PCB ' s of support 48 deliveries is sent to the transfer system of expansion slot 18b.Similarly, the handling machinery 44 of unit 28 of shuttling back and forth can be optionally moves between the second position in the direct downstream of the first location in the direct downstream of the slag chute 24a that removes photoresist and the slag chute 24b that removes photoresist, described first location is used to receive the PCB ' s from transfer system 24a, and the described second position is used to receive the PCB ' s from transfer system 24b.

Use such layout, in the thorough cleaning of treatment trough and/or during replenishing, the unit 26 that shuttles back and forth can be arranged to PCB ' s is sent to the parallel processing groove, and the unit 28 that shuttles back and forth is arranged to receive the PCB ' s from the parallel processing groove, and need not interrupt whole plating line.

This layout also can be fit to for example PCB ' s of needs different treatment time in remove photoresist slag chute 24a, 24b.For managing the PCB ' s of time than weakness, all PCB ' s can only be sent to the treatment trough 18a of delegation, 20a, 22a, 24a or only be sent to 18b, 20b, 22b, 24b.For need for example being the twice of normal processing time than the PCB ' s of long process time, PCB ' s can alternately be sent to two row treatment troughs by the unit 26 that shuttles back and forth, promptly one is sent to expansion slot 18a, the next one is sent to expansion slot 18b, and the next one is sent to expansion slot 18a again, or the like.The unit 28 that shuttles back and forth also will alternately receive processed PCB ' s from remove photoresist slag chute 24a, 24b.So PCB ' s rests on the time among

treatment trough

18a, 18b, 20a, 20b, 22a, 22b, 24a, the 24b, the time that particularly rests among remove photoresist slag chute 24a, the 24b will be extended.

In a similar fashion, the upstream of four treatment troughs 16 is that the downstream that is used for optionally PCB ' s being sent to 60, four treatment troughs 16 in unit that shuttle back and forth of one of four grooves 16 is the unit 62 that shuttles back and forth that is used for optionally receiving from the PCB ' s of one of four grooves 16.

Should be understood that, more than only for example understand and can under the situation that does not break away from spirit of the present invention, can carry out various modifications and/or variation with to realize example of the present utility model to it.Also should be understood that,, can be suggested separately or be suggested in the mode of any suitable time combination for of the present utility model various features described in the context of an embodiment for simplicity.

Claims

1. transfer system that is used for electroplating machine is characterized in that comprising: at least two treatment troughs, its layout parallel to each other and be suitable for carrying out same process; First delivery unit, it is in the upstream of described treatment trough and be suitable for optionally substrate being sent to any one of described at least two treatment troughs; With second delivery unit, it is in the downstream of described treatment trough and be suitable for optionally being received in processed substrate in any one of described at least two treatment troughs.

2. transfer system according to claim 1, it is further characterized in that, each described delivery unit have be suitable for along with described treatment trough in the track that moves of the perpendicular direction of the travel direction of described at least one substrate.

3. transfer system according to claim 1, it is further characterized in that each described delivery unit is by electric motor driving.