KR102514055B1 - Wafer wet type treating system - Google Patents

Abstract

The present invention provides a substrate wet treatment system. The disclosed substrate wet treatment system comprises: a substrate loading treatment line in which a plurality of cleaning tanks are arranged in a row to degrease and clean contaminants on a substrate in order to load the substrate; a substrate surface treatment line arranged in parallel with the substrate loading treatment line to treat the substrate transferred from the substrate loading treatment line, and having a plurality of surface treatment tanks arranged in a row for surface treatment of the substrate; a substrate plating treatment line arranged in parallel with the substrate surface treatment line so that the substrate transferred from the substrate surface treatment line can be plated, and having a plurality of plating treatment tanks arranged in a row; a substrate cleaning treatment line arranged in parallel with the substrate plating treatment line to clean the substrate transferred from the substrate plating treatment line, and having a plurality of cleaning treatment tanks arranged in a row; a substrate unloading treatment line arranged in parallel with the substrate cleaning treatment line to unload the substrate transferred from the substrate cleaning treatment line; and substrate processing transport lines respectively provided on both sides of the treatment line to transport the substrates to respective treatment lines. Therefore, the present invention arranges the plurality of plating treatment tank lines and the cleaning tank line in parallel for treating the substrate, so that the treatment process can be varied and easily changed depending on the plating method of the substrate.

Description

Substrate wet treatment system {WAFER　WET TYPE TREATING SYSTEM}

The present invention relates to a substrate wet processing system, and more particularly, to a substrate surface processing line for processing a substrate and a plurality of plating processing lines arranged side by side in a parallel form, each processing line for processing the substrate By accepting different plating solutions, the board can be processed in a variety of complex plating methods, and the electroplating and chemical plating can be performed individually or in combination according to the plating method of the board, so the board treatment process can be varied and easily changed. Therefore, the present invention relates to a substrate wet treatment system capable of reducing substrate treatment process efficiency and substrate treatment time, and improving space efficiency.

In general, surface treatment (plating, plating, coloring, coating, etc.) is to coat a thin film of another material on the surface of a material for the purpose of improving the surface state of the material. There are several purposes of this surface treatment, but the first is a method of coating a metal thin film that can withstand a specific environment in order to compensate for the lack of corrosion resistance of the raw material, and the second is surface hardening that coats a metal thin film that is harder than the raw material to withstand abrasion. Thirdly, it is used for surface beautification by attaching a thin film of precious metal or metal alloy with beautiful color to the surface of raw materials, fourth to increase the reflectance of light or heat, or to smooth and improve the reflectance of the surface to which a thin metal film is attached for a smooth surface and gloss. .

In addition, surface treatment methods are largely classified into wet surface treatment and dry surface treatment. , treat the surface using heated steam.

Here, the wet surface treatment refers to a technique of treating the surface of a substrate in a wet treatment environment, for example, using various acid alkali organic substances and inorganic substances as a liquid. Surface treatment technologies belonging to wet surface treatment include plating, painting, anodization, chemical conversion coating, chemical polishing (including electrolysis), chemical etching (including electrolysis), molten salt treatment, and degreasing. use a treatment solution.

As such, the substrate treatment process using the wet surface treatment uses a process solution in liquid form necessary for the process in each unit process for substrate treatment, and proceeds through a process of passing the substrate through a treatment tank in which each process solution is stored.

However, in the wet surface treatment apparatus of the prior art as described above, the treatment tank or plating tank for substrate surface treatment is arranged in a row, and the space efficiency is significantly reduced, and the substrate treatment It takes a lot of time to process the substrate because it is not possible to process the substrate in various orders according to conditions and environments, and process efficiency is also reduced because various types of processes cannot be implemented.

Therefore, there is a need to improve this.

Meanwhile, Korean Patent Publication No. 10-2021-0070890 (published date: 2017.06.01) discloses a "substrate transfer module, substrate processing device, and substrate processing system including the same", and Patent Publication No. 10-2009-0055422 No. (published date: 2009.06.02) discloses "wet cleaning device and substrate processing method".

The present invention was created by the above needs, and arranges a substrate surface treatment line and a plurality of plating treatment lines side by side in parallel to treat the substrate, and accommodates different plating solutions for the treatment of the substrate. An object of the present invention is to provide a substrate wet treatment system capable of increasing productivity because a treatment process can be varied and easily changed according to a treatment method.

In addition, since the present invention can perform surface treatment while moving the substrate in parallel along the substrate surface treatment line and the plurality of plating treatment lines arranged in parallel, it is possible to minimize the movement distance between processes for processing the substrate. Another object is to provide a substrate wet processing system capable of improving production efficiency by reducing the processing time of the substrate by reducing the moving distance and time of the substrate.

In addition, the present invention allows selective application of electricity to a substrate surface treatment line accommodating different plating solutions and a plurality of plating treatment lines, so that electroplating as well as electroplating and chemical plating are simultaneously performed. Another object is to provide a substrate wet processing system capable of further improving compatibility.

In order to achieve the above object, a substrate wet treatment system according to an aspect of the present invention includes a substrate loading treatment line in which a plurality of cleaning tanks for degreasing and cleaning contaminants of the substrate are disposed in a row in order to input the substrate; A substrate surface treatment line disposed in parallel with the substrate loading treatment line to treat the substrate transferred from the substrate loading treatment line, and having a plurality of surface treatment tanks arranged in a row to treat the surface of the substrate; A substrate plating processing line disposed in parallel with the substrate surface processing line so that the substrate transferred from the substrate surface processing line can be plated, and a plurality of plating processing tanks are arranged in a row; A substrate cleaning processing line disposed in parallel with the substrate plating processing line to clean the substrate and having a plurality of cleaning processing tanks arranged in a row; and unloading the substrate transferred from the substrate cleaning processing line. It is characterized in that it includes a substrate unloading processing line disposed in parallel with the cleaning processing line, and substrate process transport lines provided on both sides of the processing line to transfer the substrate to each processing line.

Further, in the present invention, the substrate loading processing line and the substrate surface processing line are characterized in that the substrate is transferred in different directions.

In addition, in the present invention, the substrate surface treatment line and the substrate plating treatment line are characterized in that current for plating treatment is selectively supplied to enable electroplating treatment.

In the present invention, the substrate surface treatment line is characterized in that the substrate is processed by supplying current in an alternating current method.

In the present invention, in the substrate plating processing line, the first plating processing line, the second plating processing line, and the third plating processing line are arranged in parallel, and the substrate is processed by supplying current in a direct current method. do.

In the present invention, the substrate process transport line includes a first transport line unit for transporting the substrate of the substrate loading processing line to the substrate surface processing line or the substrate plating processing line, and the substrate plating processing line or the substrate plating processing line. A second transport line unit for transporting the substrate of the substrate cleaning processing line to the substrate unloading processing line, and selectively transporting the substrate of the substrate surface processing line and the substrate plating processing line, or the substrate plating processing line A third transport line unit for transporting the substrate to the substrate cleaning processing line, and a fourth transport line unit for transporting the hanger from which the substrate is unloaded in the substrate process transport line to the substrate loading processing line. characterized by

In addition, in the present invention, the second plating line is disposed between the first plating process line and the third plating process line, and the substrate transfer direction of the second plating process line is different from the first plating process line. It is characterized in that it is opposite to the substrate transfer direction of the third plating line.

In addition, in the present invention, the substrate surface treatment line, the first plating treatment line, the second plating treatment line, and the third plating treatment line are characterized by accommodating different plating solutions to treat the surface of the substrate. do.

As described above, in the substrate wet treatment system according to one aspect of the present invention, unlike the prior art, a substrate surface treatment line and a plurality of plating treatment lines are arranged in parallel to accommodate different substrate treatment plating solutions. Therefore, the processing process can be varied and easily changed according to the processing method of the substrate, thereby increasing the productivity of the substrate.

In addition, according to the substrate wet treatment system according to the present invention, an alternating current is applied to the plating solution of the substrate surface treatment line, and a direct current is applied to the plating solution of the substrate surface treatment line disposed in parallel with the substrate surface treatment line to treat the substrate Therefore, by reducing the moving distance and processing time of the substrate, it has an effect of improving production efficiency by reducing the processing time of the substrate.

In addition, since the substrate wet treatment system according to the present invention can selectively apply electricity to a substrate surface treatment line and a plurality of plating treatment lines accommodating different plating solutions, electroplating can be performed in the treatment line supplied with electricity, Chemical plating can be performed in processing lines where electricity is not supplied. Therefore, since the substrate can be treated by a composite plating method of electroplating and chemical plating, the compatibility of substrate processing can be further improved.

1 is a schematic diagram for explaining a substrate wet treatment system according to an embodiment of the present invention.
2 is an enlarged view illustrating a main part of a substrate wet processing system according to an embodiment of the present invention.
3 is a block diagram for explaining a substrate processing process of a wet substrate processing system according to an embodiment of the present invention.
4 is a block diagram for explaining another substrate processing process of the wet substrate processing system according to an embodiment of the present invention.
5 is a block diagram for explaining yet another substrate processing process of the substrate wet processing system according to an embodiment of the present invention.
6 is a block diagram illustrating another substrate processing process of the substrate wet processing system according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of a substrate wet treatment system according to the present invention will be described with reference to the accompanying drawings. In this process, the thickness of lines or the size of components shown in the drawings may be exaggerated for clarity and convenience of explanation.

In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of a user or operator. Therefore, definitions of these terms will have to be made based on the content throughout this specification.

1 is a schematic diagram for explaining a substrate wet processing system according to an embodiment of the present invention, FIG. 2 is an enlarged view of a main part for explaining a substrate wet processing system according to an embodiment of the present invention, and FIG. It is a block diagram for explaining a substrate treatment process of a substrate wet treatment system according to an embodiment of the present invention.

4 is a block diagram illustrating another substrate processing process of the substrate wet processing system according to an embodiment of the present invention, and FIG. 5 is another substrate processing of the substrate wet processing system according to an embodiment of the present invention. 6 is a block diagram for explaining another substrate processing process of the wet substrate processing system according to an embodiment of the present invention.

1 to 6, the substrate wet processing system according to an embodiment of the present invention largely includes a substrate loading processing line 10, a substrate surface processing line 20, a substrate plating processing line 30, and , a substrate cleaning processing line 40, a substrate unloading processing line 50, and a substrate process transfer line 60.

In the substrate wet processing system according to the present embodiment, the substrate transferred through the substrate loading processing line 10 is transferred to the selected processing line 10, 20, 30, 40, 50), the processing process of the substrate P can be changed in various ways, and the change can be conveniently performed.

In the substrate loading processing line 10, a plurality of cleaning tanks 11 for degreasing and cleaning contaminants of the substrate P are disposed in a row in order to input the substrate P. In the substrate loading processing line 10, a substrate supply unit 13 for mounting the substrate P to the hanger H is provided at one side of the cleaning tank. When the substrate P is gripped by the hanger H in the substrate supply unit 13, the substrate P passes through the plurality of cleaning tanks 11 while the hanger H is transported along the guide rail, and cleaning is performed. .

The substrate P and the hanger H, which are cleaned while being transported along the substrate loading processing line 10, are transported to the substrate surface treatment line 20 by the substrate process transport line 60 and subjected to surface treatment.

The substrate surface processing line 20 is arranged in a parallel structure parallel to the substrate loading processing line 10, and processes the substrate P by lowering the current in a method different from that of the substrate cleaning processing line 40. For example, the substrate surface treatment line 20 processes the substrate P by applying an alternating current (PULSE) method.

In such a substrate surface treatment line 20, a plurality of surface treatment tanks 21 are arranged in a row so as to surface treat the substrate P transferred from the substrate loading treatment line 10, and a plurality of surface treatment tanks 21 are arranged on one side of the substrate P ) is provided with a separate washing tank for washing the substrate P before and after surface treatment. In addition, the substrate surface treatment line 20 is provided with a guide rail for the transfer of the hanger (H), and the transfer direction of the hanger (H) for processing the substrate (P) is the transfer of the hanger of the substrate loading processing line (10). opposite to the direction

In addition, the substrate P whose surface treatment is completed in the AC method in the substrate surface treatment line 20 is transported to the substrate plating treatment line 30 by the substrate process transport line 60 and subjected to plating.

The substrate plating processing line 30 applies current to the substrate P transferred from the substrate surface processing line 20 in a different way from the substrate surface processing line 20 to plate the surface of the substrate P. The substrate plating treatment line 30 is arranged in parallel with the substrate surface treatment line 20, and a plurality of plating treatment baths 30a for processing the substrate P are arranged in a row, and the input section and the discharge section are separately arranged. A substrate cleaning bath is provided.

In particular, in the substrate plating processing line 30 according to the present embodiment, a plurality of processing lines are installed in parallel so that the surface treatment and plating processing of the substrate P can be performed in a variety of ways. Specifically, in the substrate plating processing line 30, a first plating processing line 31, a second plating processing line 33, and a third plating processing line 35 are arranged in parallel, and the first plating processing line 31 ), the second plating line 33 and the third plating line 35 are installed in the substrate surface treatment line 20 and the substrate cleaning line 40 . At this time, each of the first plating line 31, the second plating line 33, and the third plating line 35 may contain different plating solutions for substrate processing.

Each of the first plating line 31, the second plating line 33, and the third plating line 35 processes the substrate P by supplying current to the substrate in a direct current (DC) method. In addition, the first plating processing line 31, the second plating processing line 33, and the third plating processing line 35 each have a guide rail for the transfer of the hanger H, and the hanger H is input. And a separate washing tank is provided at both ends of the discharge.

In addition, a second plating line 33 is disposed between the first plating process line 31 and the third plating line 35, and the substrate transfer direction of the third plating line 35 is the first plating line. It is transferred in a direction opposite to the substrate transfer direction of the line 31 and the third plating line 35 . And the transfer of the hanger H from the first plating line 31 to the second plating line 33 and from the second plating line 33 to the third plating line 35 is carried out by the substrate process transfer line ( 60) is carried out.

The hanger H passing through the third plating processing line 35 is transported to the substrate cleaning processing line 40 through the substrate process transport line 60, and cleaning is performed.

The substrate cleaning processing line 40 is disposed in parallel with the second plating processing line 33 of the substrate plating processing line 30 to clean the substrate P transferred from the substrate plating processing line 30, and the substrate A plurality of cleaning processing tanks 41 for cleaning (P) are arranged in a row. At this time, the substrate plating processing line 30 is provided with a guide rail for the transfer of the hanger H, and the substrate P to be surface-treated in the substrate surface processing line 20 does not pass through the substrate plating processing line 30. It can also be transported and put in immediately.

The substrate P, which is cleaned while passing through the substrate cleaning processing line 40, is transported to the substrate unloading processing line 50 by the substrate process transport line 60 and separated from the hanger H. The empty hanger H from which the substrate P is separated is transported from the substrate unloading processing line 50 to the substrate loading processing line 10 and put therein.

The substrate process transport line 60 is installed on both sides of each of the process lines 10, 20, 30, 40, and 50 so that the substrate P on which a specific process is completed can be transported through another process. Specifically, the substrate process transport line 60 is a first transport line unit 61 for transporting the substrate P of the substrate loading processing line 10 to the substrate surface processing line 20 or the substrate plating processing line 30. ), a second transport line unit 63 for transporting the substrate P of the substrate plating processing line 30 or the substrate cleaning processing line 40 to the substrate unloading processing line 50, and the substrate surface processing line 20 and a third transport line for selectively transporting the substrate P of the substrate plating processing line 30 or transporting the substrate P of the substrate plating processing line 30 to the substrate cleaning processing line 40 It includes a unit 65 and a fourth transport line unit 67 for transporting the substrate P unloaded hanger H from the substrate process transport line 60 to the substrate loading processing line. Here, the substrate P is transported by transporting the hanger H to which the substrate P is attached.

At this time, in the substrate process transport line 60, the first transport line unit 61 and the second transport line unit 63 are installed on one side of the substrate wet processing system, the third transport line unit 65 and the fourth transport line unit 65 A line unit 67 is installed on the other side of the substrate wet processing system.

In addition, the substrate process transport line 60 has hangers H on the first transport line unit 61, the second transport line unit 63, the third transport line unit 65, and the fourth transport line unit 67. A robot device for gripping and transporting may be installed.

The substrate wet treatment system according to an embodiment of the present invention configured as described above may treat the substrate P in various processes. This will be described with reference to FIGS. 3 to 6 .

For example, referring to FIG. 3 , when processing a substrate P by only performing alternating current plating, the substrate P of the substrate loading processing line 10 is transferred to the substrate surface processing line by using the first transport line unit 61. 20, the substrate P discharged through the substrate surface treatment line 20 is put into the substrate cleaning processing line 40 using the third transport line unit 65, and the substrate cleaning processing line The substrate P discharged through 40 is put into the substrate unloading processing line 50 using the second transport line unit 63 . The hanger H from which the substrate P is separated from the substrate unloading processing line 50 is transported to the substrate loading processing line 10 using the fourth transport line unit 67 .

In addition, referring to FIG. 4 , when the substrate P is continuously subjected to alternating current plating and direct current plating, the substrate P of the substrate loading processing line 10 is moved to the substrate surface by using the first transport line unit 61. The substrate P, which is put into the processing line 20 and discharged through the substrate surface processing line 20, is put into the third plating processing line 35 using the third transport line unit 65, 3 The substrate P discharged through the plating processing line 35 is put into the substrate unloading processing line 50 using the second transport line unit 63 . The hanger H from which the substrate P is separated from the substrate unloading processing line 50 is transported to the substrate loading processing line 10 using the fourth transport line unit 67 .

In addition, referring to FIG. 5 , when the substrate P is continuously subjected to alternating current plating and two direct current plating, the substrate P of the substrate loading processing line 10 is moved by using the first transport line unit 61. The substrate P, which is put into the substrate surface treatment line 20 and discharged through the substrate surface treatment line 20, is put into the first plating treatment line 31 using the third transport line unit 65, , The substrate P discharged through the first plating processing line 31 is put into the second plating processing line 33 using the first transport line unit 61 . Then, the substrate P discharged through the second plating processing line 33 is transported to the substrate cleaning processing line 40 using the third transport line unit 65, and discharged from the substrate cleaning processing line 40. The substrate P to be transported to the substrate unloading processing line 50 using the second transport line unit 63, and the hanger H from which the substrate P is separated from the substrate unloading processing line 50 It is transported to the substrate loading processing line 10 using the fourth transport line unit 67 .

In addition, referring to FIG. 6 , when the substrate P is continuously subjected to direct current plating twice, the substrate P of the substrate loading processing line 10 is subjected to second plating using the first transport line unit 61. To the processing line 33, the substrate P discharged through the second plating processing line 33 is put into the third plating processing line 35 using the third transport line unit 65, and the third The substrate P discharged through the plating processing line 35 is put into the substrate unloading processing line 50 using the second transport line unit 63 . The hanger H from which the substrate P is separated from the substrate unloading processing line 50 is transported to the substrate loading processing line 10 using the fourth transport line unit 67 .

On the other hand, in the present embodiment, although the substrate surface treatment line 20 and the substrate plating treatment line 30 are supplied with current to electroplat the substrate (P) as an example, the description is made, but the substrate surface treatment line 20 and If the supply of current to the substrate plating processing line 30 is cut off, only the chemical plating process is possible in the substrate surface processing line 20 and the substrate plating processing line 30 .

In addition, when supplying electricity for electroplating to only one of the substrate surface treatment line 20 and the substrate plating treatment line 30, for example, the substrate surface treatment line 20, the electroplating treatment of the substrate P and the chemical Plating treatment may be performed in a complex manner. That is, since electroplating and chemical plating may be performed individually or in combination according to the plating method of the substrate P, the compatibility of surface treatment of the substrate P may be further improved.

In the substrate wet treatment system according to the present invention, the plating treatment line for substrate treatment is installed in parallel, so that the treatment process can be varied and easily changed according to the substrate treatment method. Therefore, it is possible to increase the productivity of the substrate, and by reducing the moving distance and time of the substrate for substrate processing, it is possible to improve the production efficiency by reducing the processing time of the substrate.

The present invention has been described with reference to the embodiments shown in the drawings, but this is only exemplary, and those skilled in the art can make various modifications and equivalent other embodiments. will understand

Therefore, the true technical protection scope of the present invention should be determined by the claims.

10: substrate loading processing line 11: cleaning tank
20: substrate surface treatment line 21: surface treatment tank
13: substrate supply unit 30: substrate plating processing line
31: first plating line 33: second plating line
35: third plating processing line 40: substrate cleaning processing line
50: substrate on-loading processing line 60: substrate process transport line
61: first transport line unit 63: second transport line unit
65: third transport line unit 67: fourth transport line unit
P: Substrate H: Hanger

Claims (5)

a substrate loading processing line in which a plurality of cleaning tanks for degreasing and cleaning contaminants of the substrate are disposed in a row in order to input the substrate; a substrate surface treatment line arranged in parallel with the substrate loading treatment line to treat the substrate transferred from the substrate loading treatment line, and having a plurality of surface treatment tanks arranged in a row to treat the surface of the substrate; a substrate plating processing line arranged in parallel with the substrate surface processing line to process the substrate transported from the substrate surface processing line, and having a plurality of plating processing tanks arranged in a row; a substrate cleaning processing line arranged in parallel with the substrate plating processing line to clean the substrate transported from the substrate plating processing line, and having a plurality of cleaning processing tanks arranged in a row; a substrate unloading processing line arranged in parallel with the substrate cleaning processing line to unload the substrate transferred from the substrate cleaning processing line; And a substrate process transport line provided on both sides of the processing line to transfer the substrate to each of the processing lines;
The substrate surface treatment line supplies current in an alternating current method to process the substrate,
In the substrate plating processing line, a first plating processing line, a second plating processing line, and a third plating processing line are disposed in parallel, and supply current in a direct current method to process the substrate;
The substrate process transport line includes: a first transport line unit for transporting the substrate of the substrate loading processing line to the substrate surface processing line or the substrate plating processing line; a second transport line unit for transporting the substrate in the substrate plating processing line or the substrate cleaning processing line to the substrate unloading processing line; a third transport line unit for selectively transporting the substrate in the substrate surface processing line and the substrate plating processing line, or transporting the substrate in the substrate plating processing line to the substrate cleaning processing line; And a fourth transport line unit for transporting the hanger from which the substrate is unloaded from the substrate process transport line to the substrate loading processing line; includes,
In the substrate loading processing line and the substrate surface processing line, the substrate is transferred in different directions,
The second plating line is disposed between the first plating line and the third plating line, and the substrate transfer direction of the second plating line is the first plating line and the third plating line. Substrate wet processing system, characterized in that opposite to the substrate transport direction of the.
delete delete delete According to claim 1,
Wherein the substrate surface treatment line, the first plating treatment line, the second plating treatment line, and the third plating treatment line accommodate different plating solutions so as to differently treat the surface of the substrate Substrate wetting processing system.

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