CN116971019A - Automatic deplating device for electroplated cathode contact and continuous electroplating operation method - Google Patents
Automatic deplating device for electroplated cathode contact and continuous electroplating operation method Download PDFInfo
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- CN116971019A CN116971019A CN202311055054.3A CN202311055054A CN116971019A CN 116971019 A CN116971019 A CN 116971019A CN 202311055054 A CN202311055054 A CN 202311055054A CN 116971019 A CN116971019 A CN 116971019A
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- 238000009713 electroplating Methods 0.000 title claims abstract description 184
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000007747 plating Methods 0.000 claims description 31
- 229910021645 metal ion Inorganic materials 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 4
- 238000004065 wastewater treatment Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F5/00—Electrolytic stripping of metallic layers or coatings
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Abstract
The application provides an automatic electroplating cathode contact stripping device and a continuous electroplating operation method, wherein a conveying device is provided with at least 1 group of electroplating stripping switching components along the conveying direction of the conveying device, the electroplating stripping switching components comprise an A group anode and a B group anode which are arranged on the side edge of the conveying device up and down or left and right, the A group anode is correspondingly provided with an A group cathode, the B group anode is correspondingly provided with a B group cathode, the A group cathode and the B group cathode are respectively connected to a pushing device, and the pushing device drives the A group cathode and the B group cathode to be alternately switched and electrically contacted with an electroplating product; the device and the method can be used for electroplating in the process of conveying the plated piece in a conveying roller mode, and can realize automatic alternate operation of deplating of the other group of cathodes in the electroplating process by the two groups of electroplating cathodes, so that continuous automatic operation of electroplating is realized; the deplated metal can be reused, so that the wastewater treatment cost is reduced.
Description
Technical Field
The application relates to the field of electroplating, in particular to an automatic deplating device for an electroplating cathode contact and a continuous electroplating operation method.
Background
Electroplating is an electrolytic principle, and requires a low-voltage high-current power supply for supplying power to an electroplating tank and an electrolysis device consisting of an electroplating solution, a part to be plated (cathode) and an anode. The electroplating process is a process that metal ions in the plating solution are reduced into metal atoms through electrode reaction under the action of an external electric field and metal deposition is carried out on a cathode, so that plating layers are plated on cathode conductive points of a plated piece in the electroplating process, and the following problems exist:
1. the cathode contact point is not smooth any more, and the appearance surface and the plated surface of the plated piece are scratched, so that poor appearance and poor electroplating quality are caused;
2. plating materials on the cathode contact points reach a certain degree, if the plating materials cannot be removed in time, the area of the cathode contact points can be increased; accelerating the plating metal material on the cathode contact point, the conductivity is deteriorated, and the plated part is less plated or is not plated with the metal material, so that the plating quality of the plated part cannot be controlled.
At present, there are two modes of deplating: one is to remove the conductive cathode from the wire and deplate the other plating and deplating is done in the same place: the plating is performed during non-plating by using the plating work; the electroplating quality is unstable, the operation can not be continuously carried out for a long time, the productivity is lost, the labor is increased, and the metal plating material is wasted.
The production in the current-stage electroplating industry is continuous production operation, but most of the production is performed by electroless plating between adjacent electroplated parts, for example, the spacing between the front and rear parts of the electroplated parts is 0.5-2 cm, but the lengths and the areas of the electroplated parts are unequal, the small length is 10 cm, and the large length is more than 50 cm; according to Faraday's law, the deplating time of 0.5-2 cm interval can not completely deplate the plating layer with plating time more than 10-50 cm, if the deplating is to be realized, the front-back interval of the plated workpiece must be enlarged, thus the production efficiency will be affected.
Disclosure of Invention
In order to solve the above technical problems, the present application provides an automatic stripping device for a cathode contact of electroplating, comprising
The conveying device is provided with at least 1 group of electroplating and deplating switching components along the conveying direction of the conveying device,
the electroplating stripping switching assembly comprises an anode A group and an anode B group which are arranged on the side edge of the conveying device up and down or left and right, wherein the anode A group is correspondingly provided with an electroplating cathode A group and an stripping electrode A group, the anode B group is correspondingly provided with an electroplating cathode B group and a stripping electrode B group, the electroplating cathode A group and the electroplating cathode B group are respectively connected to the pushing device, and the pushing device drives the electroplating cathode A group and the electroplating cathode B group to alternately switch and be in conductive contact with an electroplating product;
the electroplating rectifier and the deplating rectifier, wherein the positive electrode of the electroplating rectifier is connected to the anode of the group A, and the negative electrode of the electroplating rectifier is connected to the electroplating cathode of the group A; meanwhile, the positive electrode of the deplating rectifier is connected to the B group electroplating negative electrode, and the negative electrode of the deplating rectifier is connected to the B group deplating electrode; or (b)
The positive electrode of the electroplating rectifier is connected to the B group positive electrode, and the negative electrode of the electroplating rectifier is connected to the B group electroplating negative electrode; meanwhile, the positive electrode of the deplating rectifier is connected to the A group electroplating negative electrode, and the negative electrode of the deplating rectifier is connected to the A group deplating electrode.
Preferably, the conveying device comprises a plurality of groups of rollers arranged up and down, and the rollers convey the plated products.
Preferably, the conveyor means comprises a conveyor belt which conveys the plated product.
Preferably, the pushing device comprises a pushing cylinder or an electromagnetic rod or a moving module.
Preferably, the electroplating and deplating switching components are 3 groups and are sequentially arranged on the conveying line.
Preferably, the group A plating cathode and the group B plating cathode are respectively connected with an extension conductive point.
A method of continuous electroplating operation comprising the steps of:
the electroplating product is placed on a conveying device for conveying and is positioned in the electroplating liquid,
the A-group electroplating cathode and the A-group anode are used as an electroplating working group, the A-group anode is electrically connected with the anode of the electroplating rectifier, the A-group electroplating cathode is electrically connected with the cathode of the electroplating rectifier, and the A-group electroplating cathode is pushed by a pushing device to contact the surface of an electroplating product; meanwhile, a B group electroplating cathode and a B group deplating electrode are used as a deplating working group, the B group electroplating cathode is electrically connected with the positive electrode of the deplating rectifier, the B group deplating electrode is electrically connected with the negative electrode of the deplating rectifier, the B group electroplating cathode is pulled by a pushing device to be separated from an electroplating product, and the B group electroplating cathode of the B group working group releases metal ions intercepted on the surface to realize deplating while the A group working group is electroplated;
after the electroplating working group reaches the set electroplating time, the electroplating cathode of the group A is pulled away from the electroplating product by the pushing device, meanwhile, the electroplating cathode of the group A is electrically connected with the anode of the electroplating rectifier, the deplating electrode of the group A is electrically connected with the cathode of the deplating rectifier to become a deplating working group, and metal ions intercepted on the electroplating cathode of the group A are released; the pushing device of the B group electroplating cathode pushes the B group electroplating cathode to contact an electroplating product, meanwhile, the B group anode is electrically connected with the anode of the electroplating rectifier, and the B group electroplating cathode is electrically connected with the cathode of the electroplating rectifier to become an electroplating working group.
Preferably, the group A stripping electrode and the group B stripping electrode are cleaned periodically.
Preferably, the A-group stripping electrode is electrically connected with the A-group anode during the A-group electroplating operation, and the B-group stripping electrode is electrically connected with the B-group anode during the B-group electroplating operation.
The automatic stripping device for the electroplated cathode contact and the continuous electroplating operation method provided by the application have the following beneficial effects: the device and the method can be used for electroplating in the process of conveying the plated piece in a conveying roller mode, and can realize automatic alternate operation of deplating of the other group of cathodes in the electroplating process by the two groups of electroplating cathodes, so that continuous automatic operation of electroplating is realized; the deplated metal can be reused, so that the wastewater treatment cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic diagram of the working states of the electroplating cathode of the group A and the electroplating anode of the group A;
FIG. 2 is a schematic diagram showing the stripping operation of the electroplating cathode of the group B and the anode of the group B according to the application;
FIG. 3 is a schematic diagram of a connection between group A plating and group B stripping according to the present application;
FIG. 4 is a schematic diagram of the wiring of the application for group A stripping and group B plating;
wherein, 1, plated product; 2. a conveying device; 3. an electroplating deplating switching component; 4. group a anodes; 5. a group A electroplating cathode; 6. a pushing device; 7. a B group electroplating cathode; 8. group B anodes; 9. electroplating a rectifier; 10. a deplating rectifier; 11. group A deplating electrode; 12. and B group deplating electrode.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.
Example 1
As shown in FIG. 1, the application provides an automatic stripping device for electroplated cathode contact, comprising
The conveying device 2, in this embodiment, the conveying device 2 may be rollers symmetrically disposed up and down, the plated product 11 may be conveyed between the upper and lower rollers, and of course, other forms, such as a conveying belt, may be used, without limiting the structure of the conveying device 2, at least one set of electroplating-stripping switching components 3 are disposed on two sides or up and down in the conveying direction of the conveying device 2, the number of the electroplating-stripping switching components 3 may be set according to the length of the conveying device 2, but in this embodiment, the number of the electroplating-stripping switching components 3 may be set to 3, but is not limited to 3, specifically, the electroplating-stripping switching components 3 include an anode 4 and an anode 8 set up and down or left and right disposed on the side of the conveying device 2, and most preferably, the anode disposed up and down may contact the surface of the plated product when conveying a flat product, and the plated two surfaces of the plated product may be uniformly plated.
The group A anode 4 is correspondingly provided with a group A electroplating cathode 5, the group B anode 8 is correspondingly provided with a group B electroplating cathode 7, the group A electroplating cathode 5 and the group B electroplating cathode 7 are respectively connected to the pushing device 6, the pushing device 6 drives the group A electroplating cathode 5 and the group B electroplating cathode 7 to be alternately switched and electrically contacted with an electroplating product, the pushing device 6 can be a pushing cylinder or an electromagnetic rod or a mobile module, but is not limited to the structure, the cathode group can be provided with an extension conductive point, and the group A electroplating cathode 5 or the group B electroplating cathode 7 can be pushed and contacted with the surface of a plated part by pushing the pushing device 6.
For the convenience of switching in the subsequent stripping operation, a group of stripping electrodes 11 and a group of stripping electrodes 12 are also provided, and the two groups of electrodes can be designed to be shared, and in this embodiment, for the sake of clearer explanation, the two groups of electrodes are named as a group of stripping electrodes 11 and a group of stripping electrodes 12, and the specific connection mode is as follows:
the positive pole of electroplating rectifier 9 is connected on group A positive pole 4, the negative pole of electroplating rectifier 9 is connected on group A electroplating negative pole 5, the positive pole of deplating rectifier 10 is connected on group B electroplating negative pole 7, the negative pole of deplating rectifier 10 is connected on group B deplating electrode 12, at this moment group A positive pole and group A electroplating negative pole electroplate the surface of the piece that receives, and group B electroplating negative pole 7 does not contact the product, namely when group A positive pole 4 and group A electroplating negative pole 5 electroplate the work, group B deplating electrode 12 and group B electroplating negative pole 7 carry out the deplating work, release the metal ion that the surface of group B electroplating negative pole 7 was intercepted, namely realize group B electroplating negative pole surface deplating.
The working states of the A group and the B group can be switched, when the switching is needed, the positive electrode of the electroplating rectifier 9 is connected to the B group anode 8, and when the negative electrode of the electroplating rectifier 9 is connected to the B group electroplating cathode 7, the positive electrode of the deplating rectifier 10 is connected to the A group electroplating cathode 5, and the negative electrode of the deplating rectifier 10 is connected to the A group deplating electrode 11, so that deplating of the surface of the A group electroplating cathode 5 can be realized.
For better contact with the surface of the plated product 1, the group A plating cathode 5 and the group B plating cathode 7 are respectively connected with extended conductive points, and are electrically contacted with the plated piece through the extended conductive points.
The specific process of the embodiment is as follows:
the A-group electroplating cathode and the A-group anode are used as an electroplating working group, the A-group anode is electrically connected with the anode of the electroplating rectifier, the A-group electroplating cathode is electrically connected with the cathode of the electroplating rectifier, and the A-group electroplating cathode is pushed by a pushing device to contact the surface of an electroplating product; meanwhile, a B-group electroplating cathode and a B-group deplating electrode 12 are used as deplating working groups, the B-group electroplating cathode 7 is electrically connected with the positive electrode of the deplating rectifier, the B-group deplating electrode 12 is electrically connected with the negative electrode of the deplating rectifier, the B-group electroplating cathode is pulled by a pushing device to be separated from an electroplating product, and the B-group electroplating cathode of the B-group working group releases metal ions intercepted on the surface to realize deplating while the A-group working group is electroplated;
after the electroplating working group reaches the set electroplating time, the electroplating cathode of the group A is pulled away from the electroplating product by the pushing device, meanwhile, the electroplating cathode of the group A is electrically connected with the positive electrode of the deplating rectifier, the deplating electrode 11 of the group A is electrically connected with the negative electrode of the deplating rectifier to become a deplating working group, and the metal ions intercepted on the electroplating cathode of the group A are released; the pushing device of the B group electroplating cathode pushes the B group electroplating cathode to contact an electroplating product, meanwhile, the B group anode is electrically connected with the anode of the electroplating rectifier, and the B group electroplating cathode 7 is electrically connected with the cathode of the electroplating rectifier to become an electroplating working group.
In the process, the surfaces of the group A stripping electrode 11 and the group B stripping electrode 12 are thickened continuously along with the time, and the two groups of stripping electrodes can be treated and cleaned regularly.
Example 2
In this embodiment, the difference from embodiment 1 is that, when the group a electroplating is performed, the group a stripping electrode 11 and the group B stripping electrode 12 are electrically connected to the group a anode, so that the group a stripping electrode 11 can be stripped while the group a anode and the group a electroplating cathode are performing the electroplating, preventing the surface of the group a stripping electrode 11 from intercepting excessive metal ions and reducing the process of uniformly maintaining the stripping electrode, improving the working efficiency.
It is noted that the contact mode of the electrode in the present application is not limited to this contact mode, and any such contact mode or modification of this contact mode is within the scope of the present application.
Claims (9)
1. An automatic deplating device for electroplated cathode contact, which is characterized by comprising
The conveying device is provided with at least 1 group of electroplating and deplating switching components along the conveying direction of the conveying device, the electroplating and deplating switching components comprise an A group anode and a B group anode which are arranged on the side edge of the conveying device up and down or left and right, the A group anode is correspondingly provided with an A group electroplating cathode and an A group deplating electrode, the B group anode is correspondingly provided with a B group electroplating cathode and a B group deplating electrode, the A group electroplating cathode and the B group electroplating cathode are respectively connected to a pushing device, and the pushing device drives the A group electroplating cathode and the B group electroplating cathode to be alternately switched and in conductive contact with an electroplating product;
the electroplating rectifier and the deplating rectifier, wherein the positive electrode of the electroplating rectifier is connected to the anode of the group A, and the negative electrode of the electroplating rectifier is connected to the electroplating cathode of the group A; meanwhile, the positive electrode of the deplating rectifier is connected to the B group electroplating negative electrode, and the negative electrode of the deplating rectifier is connected to the B group deplating electrode; or (b)
The positive electrode of the electroplating rectifier is connected to the B group positive electrode, and the negative electrode of the electroplating rectifier is connected to the B group electroplating negative electrode; meanwhile, the positive electrode of the deplating rectifier is connected to the A group electroplating negative electrode, and the negative electrode of the deplating rectifier is connected to the A group deplating electrode.
2. The automated plating apparatus according to claim 1, wherein the conveyor comprises a plurality of sets of rollers arranged up and down, the rollers conveying the plated product.
3. The automated plated cathode contact stripping apparatus of claim 1, wherein the conveyor comprises a conveyor belt that conveys the plated product.
4. The automated plating stripping apparatus of claim 1, wherein the pushing means comprises a pushing cylinder or a solenoid or a moving die set.
5. The automated plating stripping apparatus according to claim 1, wherein the plating stripping switching components are 3 groups and are sequentially disposed on the conveying line.
6. The automated plating stripping apparatus of claim 1, wherein the group a plating cathodes and the group B plating cathodes are each connected with an elongated conductive point.
7. A method of continuous electroplating operation comprising the steps of:
the electroplating product is placed on a conveying device for conveying and is positioned in the electroplating liquid,
the A-group electroplating cathode and the A-group anode are used as an electroplating working group, the A-group anode is electrically connected with the anode of the electroplating rectifier, the A-group electroplating cathode is electrically connected with the cathode of the electroplating rectifier, and the A-group electroplating cathode is pushed by a pushing device to contact the surface of an electroplating product; meanwhile, a B group electroplating cathode and a B group deplating electrode are used as a deplating working group, the B group electroplating cathode is electrically connected with the positive electrode of the deplating rectifier, the B group deplating electrode is electrically connected with the negative electrode of the deplating rectifier, the B group electroplating cathode is pulled by a pushing device to be separated from an electroplating product, and the B group electroplating cathode of the B group working group releases metal ions intercepted on the surface to realize deplating while the A group working group is electroplated;
after the electroplating working group reaches the set electroplating time, the electroplating cathode of the group A is pulled away from the electroplating product by the pushing device, meanwhile, the electroplating cathode of the group A is electrically connected with the positive electrode of the deplating rectifier, the deplating electrode of the group A is electrically connected with the negative electrode of the deplating rectifier, and the electroplating working group is changed into the deplating working group, so that metal ions intercepted on the electroplating cathode of the group A are released; the pushing device of the B group electroplating cathode pushes the B group electroplating cathode to contact an electroplating product, meanwhile, the B group anode is electrically connected with the anode of the electroplating rectifier, and the B group electroplating cathode is electrically connected with the cathode of the electroplating rectifier to become an electroplating working group.
8. The continuous plating operation method according to claim 7, wherein the group a plating electrodes and the group B plating electrodes are cleaned periodically.
9. The method of claim 7, wherein the group a stripping electrode is electrically connected to the group a anode during a group a plating operation and the group B stripping electrode is electrically connected to the group B anode during a group B plating operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311055054.3A CN116971019A (en) | 2023-08-22 | 2023-08-22 | Automatic deplating device for electroplated cathode contact and continuous electroplating operation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311055054.3A CN116971019A (en) | 2023-08-22 | 2023-08-22 | Automatic deplating device for electroplated cathode contact and continuous electroplating operation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116971019A true CN116971019A (en) | 2023-10-31 |
Family
ID=88476659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311055054.3A Pending CN116971019A (en) | 2023-08-22 | 2023-08-22 | Automatic deplating device for electroplated cathode contact and continuous electroplating operation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116971019A (en) |
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2023
- 2023-08-22 CN CN202311055054.3A patent/CN116971019A/en active Pending
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