BRPI0719665A2 - "dispositivo e método para o revestimento eletrolítico de uma camada de base estruturada ou de superfície inteira sobre uma superfície de um substrato, e, uso do dispositivo." - Google Patents
"dispositivo e método para o revestimento eletrolítico de uma camada de base estruturada ou de superfície inteira sobre uma superfície de um substrato, e, uso do dispositivo." Download PDFInfo
- Publication number
- BRPI0719665A2 BRPI0719665A2 BRPI0719665-2A BRPI0719665A BRPI0719665A2 BR PI0719665 A2 BRPI0719665 A2 BR PI0719665A2 BR PI0719665 A BRPI0719665 A BR PI0719665A BR PI0719665 A2 BRPI0719665 A2 BR PI0719665A2
- Authority
- BR
- Brazil
- Prior art keywords
- substrate
- base layer
- rollers
- connectable
- roll
- Prior art date
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- JEHCHYAKAXDFKV-UHFFFAOYSA-J lead tetraacetate Chemical compound CC(=O)O[Pb](OC(C)=O)(OC(C)=O)OC(C)=O JEHCHYAKAXDFKV-UHFFFAOYSA-J 0.000 description 1
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
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- 229930003658 monoterpene Natural products 0.000 description 1
- 150000002773 monoterpene derivatives Chemical class 0.000 description 1
- 235000002577 monoterpenes Nutrition 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 239000002929 natural lacquer Substances 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
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- 229910000489 osmium tetroxide Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 125000005385 peroxodisulfate group Chemical group 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
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- UMPKMCDVBZFQOK-UHFFFAOYSA-N potassium;iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[K+].[Fe+3] UMPKMCDVBZFQOK-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
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- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
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- 150000004040 pyrrolidinones Chemical class 0.000 description 1
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- 239000003507 refrigerant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- BPEVHDGLPIIAGH-UHFFFAOYSA-N ruthenium(3+) Chemical compound [Ru+3] BPEVHDGLPIIAGH-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
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- 239000003352 sequestering agent Substances 0.000 description 1
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- 150000004760 silicates Chemical class 0.000 description 1
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- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229960001922 sodium perborate Drugs 0.000 description 1
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 description 1
- YKLJGMBLPUQQOI-UHFFFAOYSA-M sodium;oxidooxy(oxo)borane Chemical compound [Na+].[O-]OB=O YKLJGMBLPUQQOI-UHFFFAOYSA-M 0.000 description 1
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- 229920001909 styrene-acrylic polymer Polymers 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- WTEHZLSBCPFRHB-UHFFFAOYSA-L sulfonatooxy sulfate;tetrabutylazanium Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC.CCCC[N+](CCCC)(CCCC)CCCC WTEHZLSBCPFRHB-UHFFFAOYSA-L 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
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- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
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- 239000002562 thickening agent Substances 0.000 description 1
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06124862 | 2006-11-28 | ||
| EP06124862.1 | 2006-11-28 | ||
| PCT/EP2007/062805 WO2008065069A1 (de) | 2006-11-28 | 2007-11-26 | Vorrichtung und verfahren zur galvanischen beschichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0719665A2 true BRPI0719665A2 (pt) | 2013-12-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0719665-2A BRPI0719665A2 (pt) | 2006-11-28 | 2007-11-26 | "dispositivo e método para o revestimento eletrolítico de uma camada de base estruturada ou de superfície inteira sobre uma superfície de um substrato, e, uso do dispositivo." |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20090301891A1 (enExample) |
| EP (1) | EP2099954A1 (enExample) |
| JP (1) | JP2010511103A (enExample) |
| KR (1) | KR20090083489A (enExample) |
| CN (1) | CN101542022A (enExample) |
| BR (1) | BRPI0719665A2 (enExample) |
| IL (1) | IL198594A0 (enExample) |
| RU (1) | RU2009124293A (enExample) |
| TW (1) | TW200829726A (enExample) |
| WO (1) | WO2008065069A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100126505A (ko) * | 2008-03-13 | 2010-12-01 | 바스프 에스이 | 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물 |
| CA2724017C (en) * | 2008-04-15 | 2017-03-14 | Nonin Medical, Inc. | Non-invasive optical sensor |
| EP2277194A1 (en) * | 2008-05-08 | 2011-01-26 | Basf Se | Layered structures comprising silicon carbide layers, a process for their manufacture and their use |
| KR20120023832A (ko) * | 2009-05-26 | 2012-03-13 | 우시 썬테크 파워 컴퍼니 리미티드 | 물품 이송용 이송 롤러 |
| DE102010000211A1 (de) * | 2010-01-26 | 2011-07-28 | Atotech Deutschland GmbH, 90537 | Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung |
| CN101827444B (zh) * | 2010-03-31 | 2015-03-25 | 中兴通讯股份有限公司 | 一种测量参考信号的信令配置系统及方法 |
| DE102010042642B4 (de) | 2010-10-19 | 2013-12-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen |
| US20130255858A1 (en) * | 2012-04-03 | 2013-10-03 | Jun-Chung Hsu | Method of manufacturing a laminate circuit board |
| US9970297B2 (en) * | 2014-08-29 | 2018-05-15 | Rolls-Royce Corporation | Composite fan slider with nano-coating |
| KR20160140241A (ko) | 2015-05-29 | 2016-12-07 | 전자부품연구원 | 플라즈마 전해 기반의 시료 코팅 방법 |
| KR101578640B1 (ko) * | 2015-08-25 | 2015-12-17 | 선호경 | 부분 강화된 이송롤러를 구비한 pcb 도금장치 |
| SG11202005062SA (en) | 2016-07-13 | 2020-06-29 | Alligant Scientific Llc | Electrochemical methods, devices and compositions |
| CN108430170A (zh) * | 2018-01-29 | 2018-08-21 | 昆山群安电子贸易有限公司 | 一种电路板基板的制作方法 |
| KR20220017885A (ko) * | 2019-03-20 | 2022-02-14 | 더 리젠츠 오브 더 유니버시티 오브 콜로라도, 어 바디 코포레이트 | 킬레이트화된 금속을 포함하는 전기화학 저장 장치 |
| MX2023002015A (es) | 2020-08-18 | 2023-04-11 | Enviro Metals Llc | Refinamiento metálico. |
| CN114481244B (zh) * | 2022-02-24 | 2022-08-23 | 广东盈华电子科技有限公司 | 一种电解铜箔耐高温抗氧化的表面处理工艺 |
| DE102022120646A1 (de) | 2022-08-16 | 2024-02-22 | Audi Aktiengesellschaft | Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4019877A (en) * | 1975-10-21 | 1977-04-26 | Westinghouse Electric Corporation | Method for coating of polyimide by electrodeposition |
| ATE100871T1 (de) * | 1989-12-23 | 1994-02-15 | Heraeus Elektrochemie | Verfahren und vorrichtung zur kontinuierlichen elektrolytischen ausbringung von metall in form eines bandes aus einer loesung sowie verwendung der vorrichtung. |
| ATE125001T1 (de) * | 1991-04-12 | 1995-07-15 | Siemens Ag | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten. |
| US5705219A (en) * | 1991-04-22 | 1998-01-06 | Atotech Deutschland Gmbh | Method for coating surfaces with finely particulate materials |
| DE4212567A1 (de) * | 1992-03-14 | 1993-09-16 | Schmid Gmbh & Co Geb | Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten |
| US6599412B1 (en) * | 1997-09-30 | 2003-07-29 | Semitool, Inc. | In-situ cleaning processes for semiconductor electroplating electrodes |
| DE19633796B4 (de) * | 1996-08-22 | 2012-02-02 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten |
| EP1541719A3 (en) * | 1998-05-20 | 2006-05-31 | Process Automation International Limited | An electroplating machine |
| US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
| DE10043817C2 (de) * | 2000-09-06 | 2002-07-18 | Egon Huebel | Anordnung und Verfahren für elektrochemisch zu behandelndes Gut |
| DE10248965A1 (de) * | 2002-10-15 | 2004-04-29 | Simmerlein, Ewald Wilhelm | Galvanisierungseinrichtung zum freien Beschichten von leitfähigen Strukturen und Flächen, mit und ohne Versorgungsbahnen |
| DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
| NL1025446C2 (nl) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager. |
| DE102005033784A1 (de) * | 2005-07-20 | 2007-01-25 | Viktoria Händlmeier | System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial |
| DE102005038450A1 (de) * | 2005-08-03 | 2007-02-08 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten |
| DE102005038449B4 (de) * | 2005-08-03 | 2010-03-25 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren |
| CA2649786A1 (en) * | 2006-04-18 | 2007-10-25 | Basf Se | Electroplating device and method |
| RU2008145105A (ru) * | 2006-04-18 | 2010-05-27 | Басф Се (De) | Способ и устройство для гальванического покрытия |
-
2007
- 2007-10-24 TW TW096139950A patent/TW200829726A/zh unknown
- 2007-11-26 EP EP07847339A patent/EP2099954A1/de not_active Withdrawn
- 2007-11-26 BR BRPI0719665-2A patent/BRPI0719665A2/pt not_active IP Right Cessation
- 2007-11-26 US US12/515,289 patent/US20090301891A1/en not_active Abandoned
- 2007-11-26 WO PCT/EP2007/062805 patent/WO2008065069A1/de not_active Ceased
- 2007-11-26 KR KR1020097013503A patent/KR20090083489A/ko not_active Withdrawn
- 2007-11-26 CN CNA2007800439981A patent/CN101542022A/zh active Pending
- 2007-11-26 RU RU2009124293/02A patent/RU2009124293A/ru not_active Application Discontinuation
- 2007-11-26 JP JP2009538691A patent/JP2010511103A/ja not_active Withdrawn
-
2009
- 2009-05-06 IL IL198594A patent/IL198594A0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008065069A1 (de) | 2008-06-05 |
| KR20090083489A (ko) | 2009-08-03 |
| CN101542022A (zh) | 2009-09-23 |
| IL198594A0 (en) | 2010-02-17 |
| US20090301891A1 (en) | 2009-12-10 |
| RU2009124293A (ru) | 2011-01-10 |
| EP2099954A1 (de) | 2009-09-16 |
| JP2010511103A (ja) | 2010-04-08 |
| TW200829726A (en) | 2008-07-16 |
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