JP2009534525A5 - - Google Patents

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Publication number
JP2009534525A5
JP2009534525A5 JP2009505839A JP2009505839A JP2009534525A5 JP 2009534525 A5 JP2009534525 A5 JP 2009534525A5 JP 2009505839 A JP2009505839 A JP 2009505839A JP 2009505839 A JP2009505839 A JP 2009505839A JP 2009534525 A5 JP2009534525 A5 JP 2009534525A5
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JP
Japan
Prior art keywords
support
conductive
disk
shaft
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009505839A
Other languages
English (en)
Japanese (ja)
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JP2009534525A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2007/053401 external-priority patent/WO2007118810A2/de
Publication of JP2009534525A publication Critical patent/JP2009534525A/ja
Publication of JP2009534525A5 publication Critical patent/JP2009534525A5/ja
Withdrawn legal-status Critical Current

Links

JP2009505839A 2006-04-18 2007-04-05 電解コーティング装置及び電解コーティング方法 Withdrawn JP2009534525A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112724 2006-04-18
PCT/EP2007/053401 WO2007118810A2 (de) 2006-04-18 2007-04-05 Vorrichtung und verfahren zur galvanischen beschichtung

Publications (2)

Publication Number Publication Date
JP2009534525A JP2009534525A (ja) 2009-09-24
JP2009534525A5 true JP2009534525A5 (enExample) 2010-05-06

Family

ID=38236501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009505839A Withdrawn JP2009534525A (ja) 2006-04-18 2007-04-05 電解コーティング装置及び電解コーティング方法

Country Status (13)

Country Link
US (1) US20090178930A1 (enExample)
EP (1) EP2010700B1 (enExample)
JP (1) JP2009534525A (enExample)
KR (1) KR20080110658A (enExample)
CN (1) CN101426962A (enExample)
AT (1) ATE455879T1 (enExample)
BR (1) BRPI0710662A2 (enExample)
CA (1) CA2647969A1 (enExample)
DE (1) DE502007002680D1 (enExample)
IL (1) IL194505A0 (enExample)
RU (1) RU2008145105A (enExample)
TW (1) TW200813263A (enExample)
WO (1) WO2007118810A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
EP2799939A1 (fr) * 2013-04-30 2014-11-05 Universo S.A. Support pour le traitement de pièces de micromécanique
CN103343371A (zh) * 2013-07-09 2013-10-09 中国铝业股份有限公司 一种聚合物薄膜的连续电沉积方法
JP5967034B2 (ja) * 2013-08-20 2016-08-10 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
US9847576B2 (en) 2013-11-11 2017-12-19 Nxp B.V. UHF-RFID antenna for point of sales application
JP6197813B2 (ja) * 2015-03-11 2017-09-20 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
RU2643050C2 (ru) * 2015-11-09 2018-01-30 Фарит Фазитович Мухамедьянов Кислотный поверхностно-активный состав для обработки призабойной зоны нефтяных и газовых скважин
CN113166967A (zh) * 2018-11-22 2021-07-23 A-Plas通用汽车产品工贸股份公司 用于获得均匀镀层的镀覆挂架
CN114790565B (zh) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

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