JP2009534525A - 電解コーティング装置及び電解コーティング方法 - Google Patents

電解コーティング装置及び電解コーティング方法 Download PDF

Info

Publication number
JP2009534525A
JP2009534525A JP2009505839A JP2009505839A JP2009534525A JP 2009534525 A JP2009534525 A JP 2009534525A JP 2009505839 A JP2009505839 A JP 2009505839A JP 2009505839 A JP2009505839 A JP 2009505839A JP 2009534525 A JP2009534525 A JP 2009534525A
Authority
JP
Japan
Prior art keywords
support
conductive
disk
shaft
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009505839A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009534525A5 (enExample
Inventor
ロホトマン，レネ
カクツン，ユルゲン
シュナイダー，ノルベルト
プフィスター，ユルゲン
ポール，ゲルト
ヴァーグナー，ノルベルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of JP2009534525A publication Critical patent/JP2009534525A/ja
Publication of JP2009534525A5 publication Critical patent/JP2009534525A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2009505839A 2006-04-18 2007-04-05 電解コーティング装置及び電解コーティング方法 Withdrawn JP2009534525A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112724 2006-04-18
PCT/EP2007/053401 WO2007118810A2 (de) 2006-04-18 2007-04-05 Vorrichtung und verfahren zur galvanischen beschichtung

Publications (2)

Publication Number Publication Date
JP2009534525A true JP2009534525A (ja) 2009-09-24
JP2009534525A5 JP2009534525A5 (enExample) 2010-05-06

Family

ID=38236501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009505839A Withdrawn JP2009534525A (ja) 2006-04-18 2007-04-05 電解コーティング装置及び電解コーティング方法

Country Status (13)

Country Link
US (1) US20090178930A1 (enExample)
EP (1) EP2010700B1 (enExample)
JP (1) JP2009534525A (enExample)
KR (1) KR20080110658A (enExample)
CN (1) CN101426962A (enExample)
AT (1) ATE455879T1 (enExample)
BR (1) BRPI0710662A2 (enExample)
CA (1) CA2647969A1 (enExample)
DE (1) DE502007002680D1 (enExample)
IL (1) IL194505A0 (enExample)
RU (1) RU2008145105A (enExample)
TW (1) TW200813263A (enExample)
WO (1) WO2007118810A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
EP2799939A1 (fr) * 2013-04-30 2014-11-05 Universo S.A. Support pour le traitement de pièces de micromécanique
CN103343371A (zh) * 2013-07-09 2013-10-09 中国铝业股份有限公司 一种聚合物薄膜的连续电沉积方法
JP5967034B2 (ja) * 2013-08-20 2016-08-10 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
US9847576B2 (en) 2013-11-11 2017-12-19 Nxp B.V. UHF-RFID antenna for point of sales application
JP6197813B2 (ja) * 2015-03-11 2017-09-20 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
RU2643050C2 (ru) * 2015-11-09 2018-01-30 Фарит Фазитович Мухамедьянов Кислотный поверхностно-активный состав для обработки призабойной зоны нефтяных и газовых скважин
CN113166967A (zh) * 2018-11-22 2021-07-23 A-Plas通用汽车产品工贸股份公司 用于获得均匀镀层的镀覆挂架
CN114790565B (zh) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Also Published As

Publication number Publication date
TW200813263A (en) 2008-03-16
CA2647969A1 (en) 2007-10-25
EP2010700B1 (de) 2010-01-20
WO2007118810A2 (de) 2007-10-25
DE502007002680D1 (de) 2010-03-11
IL194505A0 (en) 2009-08-03
US20090178930A1 (en) 2009-07-16
WO2007118810A3 (de) 2008-05-22
RU2008145105A (ru) 2010-05-27
ATE455879T1 (de) 2010-02-15
CN101426962A (zh) 2009-05-06
KR20080110658A (ko) 2008-12-18
EP2010700A2 (de) 2009-01-07
BRPI0710662A2 (pt) 2011-08-16

Similar Documents

Publication Publication Date Title
JP2009534525A (ja) 電解コーティング装置及び電解コーティング方法
US20090101511A1 (en) Electroplating device and method
JP2009534527A5 (enExample)
US20090301891A1 (en) Device and method for electroplating
JP2010511103A5 (enExample)
US5804052A (en) Method and device for continuous uniform electrolytic metallizing or etching
KR20090068670A (ko) 롤투롤 기판 이송 장치, 이를 포함하는 습식 식각 장치 및회로 기판 제조 장치
KR20150016217A (ko) 작업편 상에 성막 금속을 전해 성막하는 방법 및 장치
US6939455B1 (en) Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
TW574437B (en) Electrodeposition device and electrodeposition system for coating structures which have already been made conductive
CN1969065B (zh) 电解处理平坦工件的装置及方法
JP4793720B2 (ja) めっき法２層回路基材の製造方法
CN102439202A (zh) 用于控制电化学表面过程的方法和装置
KR100665481B1 (ko) 필름 연속 도금 장치 및 방법
CN211079399U (zh) 用于退锡设备的导电刷及包含其的退锡设备
CN212247266U (zh) 一种用于退锡设备的导电刷及退锡设备
JP3043318B2 (ja) 連続メッキ装置の給電方法及びその装置
CN110725001A (zh) 用于退锡设备的导电刷及包含其的退锡设备
CN207933522U (zh) 电子部件的制造装置以及成膜装置
CN110725000A (zh) 用于退锡设备的导电刷及包含其的退锡设备
HK1102970B (en) Device and method for electrolytically treating flat work pieces

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100319

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100319

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20110210