JP2010507228A5 - - Google Patents
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- Publication number
- JP2010507228A5 JP2010507228A5 JP2009532390A JP2009532390A JP2010507228A5 JP 2010507228 A5 JP2010507228 A5 JP 2010507228A5 JP 2009532390 A JP2009532390 A JP 2009532390A JP 2009532390 A JP2009532390 A JP 2009532390A JP 2010507228 A5 JP2010507228 A5 JP 2010507228A5
- Authority
- JP
- Japan
- Prior art keywords
- auxiliary member
- centering
- ring
- assembly
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85234406P | 2006-10-16 | 2006-10-16 | |
| US60/852,344 | 2006-10-16 | ||
| US11/701,507 | 2007-02-02 | ||
| US11/701,507 US7875824B2 (en) | 2006-10-16 | 2007-02-02 | Quartz guard ring centering features |
| PCT/US2007/021629 WO2008048444A1 (en) | 2006-10-16 | 2007-10-10 | Quartz guard ring centering features |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010507228A JP2010507228A (ja) | 2010-03-04 |
| JP2010507228A5 true JP2010507228A5 (enExample) | 2010-11-25 |
| JP5006401B2 JP5006401B2 (ja) | 2012-08-22 |
Family
ID=39314328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009532390A Active JP5006401B2 (ja) | 2006-10-16 | 2007-10-10 | 石英ガードリングセンタリング機構 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7875824B2 (enExample) |
| JP (1) | JP5006401B2 (enExample) |
| KR (1) | KR101411747B1 (enExample) |
| CN (1) | CN101529562B (enExample) |
| SG (1) | SG175649A1 (enExample) |
| TW (1) | TWI424492B (enExample) |
| WO (1) | WO2008048444A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7875824B2 (en) * | 2006-10-16 | 2011-01-25 | Lam Research Corporation | Quartz guard ring centering features |
| US8069817B2 (en) * | 2007-03-30 | 2011-12-06 | Lam Research Corporation | Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses |
| WO2009085163A1 (en) * | 2007-12-19 | 2009-07-09 | Lam Research Corporation | A composite showerhead electrode assembly for a plasma processing apparatus |
| US8206506B2 (en) * | 2008-07-07 | 2012-06-26 | Lam Research Corporation | Showerhead electrode |
| US8221582B2 (en) | 2008-07-07 | 2012-07-17 | Lam Research Corporation | Clamped monolithic showerhead electrode |
| US8161906B2 (en) * | 2008-07-07 | 2012-04-24 | Lam Research Corporation | Clamped showerhead electrode assembly |
| US8540844B2 (en) * | 2008-12-19 | 2013-09-24 | Lam Research Corporation | Plasma confinement structures in plasma processing systems |
| US8869741B2 (en) * | 2008-12-19 | 2014-10-28 | Lam Research Corporation | Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber |
| US8402918B2 (en) * | 2009-04-07 | 2013-03-26 | Lam Research Corporation | Showerhead electrode with centering feature |
| US8272346B2 (en) * | 2009-04-10 | 2012-09-25 | Lam Research Corporation | Gasket with positioning feature for clamped monolithic showerhead electrode |
| TWM412457U (en) * | 2009-09-18 | 2011-09-21 | Lam Res Corp | Showerhead electrode for use in a plasma reaction chamber and showerhead electrode assembly |
| SG178371A1 (en) * | 2009-09-28 | 2012-03-29 | Lam Res Corp | Unitized confinement ring arrangements and methods thereof |
| JP3160877U (ja) | 2009-10-13 | 2010-07-15 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | シャワーヘッド電極アセンブリの端部クランプ留めおよび機械固定される内側電極 |
| US8573152B2 (en) | 2010-09-03 | 2013-11-05 | Lam Research Corporation | Showerhead electrode |
| US8470127B2 (en) * | 2011-01-06 | 2013-06-25 | Lam Research Corporation | Cam-locked showerhead electrode and assembly |
| US9058960B2 (en) * | 2012-05-09 | 2015-06-16 | Lam Research Corporation | Compression member for use in showerhead electrode assembly |
| JP6375163B2 (ja) * | 2014-07-11 | 2018-08-15 | 東京エレクトロン株式会社 | プラズマ処理装置および上部電極アセンブリ |
| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| KR102182298B1 (ko) | 2017-11-21 | 2020-11-25 | 램 리써치 코포레이션 | 하단 링 및 중간 에지 링 |
| KR20230106754A (ko) | 2018-08-13 | 2023-07-13 | 램 리써치 코포레이션 | 에지 링 포지셔닝 및 센터링 피처들을 포함하는 플라즈마 시스 튜닝을 위한 교체가능한 에지 링 어셈블리 및/또는 접을 수 있는 에지 링 어셈블리 |
| WO2021194470A1 (en) | 2020-03-23 | 2021-09-30 | Lam Research Corporation | Mid-ring erosion compensation in substrate processing systems |
| CN114582691B (zh) * | 2020-11-18 | 2025-02-14 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理装置及其调节方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5074456A (en) * | 1990-09-18 | 1991-12-24 | Lam Research Corporation | Composite electrode for plasma processes |
| US5997962A (en) | 1995-06-30 | 1999-12-07 | Tokyo Electron Limited | Plasma process utilizing an electrostatic chuck |
| US5534751A (en) | 1995-07-10 | 1996-07-09 | Lam Research Corporation | Plasma etching apparatus utilizing plasma confinement |
| JPH11219935A (ja) * | 1998-01-30 | 1999-08-10 | Hitachi Chem Co Ltd | プラズマ処理装置用電極及びプラズマ処理装置 |
| JP2000012516A (ja) * | 1998-06-25 | 2000-01-14 | Hitachi Chem Co Ltd | プラズマエッチング用電極板及びプラズマエッチング装置 |
| JP3461120B2 (ja) * | 1998-06-29 | 2003-10-27 | 日立化成工業株式会社 | プラズマエッチング用電極板及びプラズマエッチング装置 |
| US6073577A (en) * | 1998-06-30 | 2000-06-13 | Lam Research Corporation | Electrode for plasma processes and method for manufacture and use thereof |
| US6890861B1 (en) | 2000-06-30 | 2005-05-10 | Lam Research Corporation | Semiconductor processing equipment having improved particle performance |
| JP2002164329A (ja) * | 2000-09-14 | 2002-06-07 | Tokyo Electron Ltd | プラズマ処理装置 |
| US6391787B1 (en) | 2000-10-13 | 2002-05-21 | Lam Research Corporation | Stepped upper electrode for plasma processing uniformity |
| US20020127853A1 (en) * | 2000-12-29 | 2002-09-12 | Hubacek Jerome S. | Electrode for plasma processes and method for manufacture and use thereof |
| AU2003233655A1 (en) * | 2002-05-23 | 2003-12-12 | Lam Research Corporation | Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a mutli-part electrode |
| US6841943B2 (en) * | 2002-06-27 | 2005-01-11 | Lam Research Corp. | Plasma processor with electrode simultaneously responsive to plural frequencies |
| US6838012B2 (en) * | 2002-10-31 | 2005-01-04 | Lam Research Corporation | Methods for etching dielectric materials |
| JP4220316B2 (ja) | 2003-06-24 | 2009-02-04 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| US7267741B2 (en) * | 2003-11-14 | 2007-09-11 | Lam Research Corporation | Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon |
| US7645341B2 (en) * | 2003-12-23 | 2010-01-12 | Lam Research Corporation | Showerhead electrode assembly for plasma processing apparatuses |
| JP4550507B2 (ja) * | 2004-07-26 | 2010-09-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| US7244311B2 (en) * | 2004-10-13 | 2007-07-17 | Lam Research Corporation | Heat transfer system for improved semiconductor processing uniformity |
| US7482550B2 (en) * | 2006-10-16 | 2009-01-27 | Lam Research Corporation | Quartz guard ring |
| US7875824B2 (en) * | 2006-10-16 | 2011-01-25 | Lam Research Corporation | Quartz guard ring centering features |
-
2007
- 2007-02-02 US US11/701,507 patent/US7875824B2/en active Active
- 2007-10-10 WO PCT/US2007/021629 patent/WO2008048444A1/en not_active Ceased
- 2007-10-10 KR KR1020097009706A patent/KR101411747B1/ko active Active
- 2007-10-10 CN CN2007800385017A patent/CN101529562B/zh active Active
- 2007-10-10 SG SG2011075975A patent/SG175649A1/en unknown
- 2007-10-10 JP JP2009532390A patent/JP5006401B2/ja active Active
- 2007-10-16 TW TW096138746A patent/TWI424492B/zh active
-
2010
- 2010-12-14 US US12/967,717 patent/US8084705B2/en not_active Expired - Fee Related
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