CN101529562B - 石英保护环定中心结构 - Google Patents

石英保护环定中心结构 Download PDF

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Publication number
CN101529562B
CN101529562B CN2007800385017A CN200780038501A CN101529562B CN 101529562 B CN101529562 B CN 101529562B CN 2007800385017 A CN2007800385017 A CN 2007800385017A CN 200780038501 A CN200780038501 A CN 200780038501A CN 101529562 B CN101529562 B CN 101529562B
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China
Prior art keywords
backing member
guard ring
electrode
assembly
centring
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CN2007800385017A
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English (en)
Chinese (zh)
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CN101529562A (zh
Inventor
迪安·J·拉松
丹尼尔·布朗
基思·科门丹特
维克托·王
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
CN2007800385017A 2006-10-16 2007-10-10 石英保护环定中心结构 Active CN101529562B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US85234406P 2006-10-16 2006-10-16
US60/852,344 2006-10-16
US11/701,507 2007-02-02
US11/701,507 US7875824B2 (en) 2006-10-16 2007-02-02 Quartz guard ring centering features
PCT/US2007/021629 WO2008048444A1 (en) 2006-10-16 2007-10-10 Quartz guard ring centering features

Publications (2)

Publication Number Publication Date
CN101529562A CN101529562A (zh) 2009-09-09
CN101529562B true CN101529562B (zh) 2011-09-14

Family

ID=39314328

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800385017A Active CN101529562B (zh) 2006-10-16 2007-10-10 石英保护环定中心结构

Country Status (7)

Country Link
US (2) US7875824B2 (enExample)
JP (1) JP5006401B2 (enExample)
KR (1) KR101411747B1 (enExample)
CN (1) CN101529562B (enExample)
SG (1) SG175649A1 (enExample)
TW (1) TWI424492B (enExample)
WO (1) WO2008048444A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7875824B2 (en) * 2006-10-16 2011-01-25 Lam Research Corporation Quartz guard ring centering features
US8069817B2 (en) * 2007-03-30 2011-12-06 Lam Research Corporation Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses
KR101553422B1 (ko) * 2007-12-19 2015-09-15 램 리써치 코포레이션 플라즈마 처리 장치를 위한 복합 샤워헤드 전극 어셈블리
US8206506B2 (en) * 2008-07-07 2012-06-26 Lam Research Corporation Showerhead electrode
US8161906B2 (en) * 2008-07-07 2012-04-24 Lam Research Corporation Clamped showerhead electrode assembly
US8221582B2 (en) 2008-07-07 2012-07-17 Lam Research Corporation Clamped monolithic showerhead electrode
US8869741B2 (en) * 2008-12-19 2014-10-28 Lam Research Corporation Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber
US8540844B2 (en) * 2008-12-19 2013-09-24 Lam Research Corporation Plasma confinement structures in plasma processing systems
US8402918B2 (en) * 2009-04-07 2013-03-26 Lam Research Corporation Showerhead electrode with centering feature
US8272346B2 (en) * 2009-04-10 2012-09-25 Lam Research Corporation Gasket with positioning feature for clamped monolithic showerhead electrode
SG169960A1 (en) * 2009-09-18 2011-04-29 Lam Res Corp Clamped monolithic showerhead electrode
KR101711687B1 (ko) * 2009-09-28 2017-03-02 램 리써치 코포레이션 일체형 한정 링 배열 및 그 방법
JP3160877U (ja) * 2009-10-13 2010-07-15 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ シャワーヘッド電極アセンブリの端部クランプ留めおよび機械固定される内側電極
US8573152B2 (en) 2010-09-03 2013-11-05 Lam Research Corporation Showerhead electrode
US8470127B2 (en) * 2011-01-06 2013-06-25 Lam Research Corporation Cam-locked showerhead electrode and assembly
US9058960B2 (en) * 2012-05-09 2015-06-16 Lam Research Corporation Compression member for use in showerhead electrode assembly
JP6375163B2 (ja) * 2014-07-11 2018-08-15 東京エレクトロン株式会社 プラズマ処理装置および上部電極アセンブリ
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
KR102617972B1 (ko) 2017-11-21 2023-12-22 램 리써치 코포레이션 하단 링 및 중간 에지 링
US11798789B2 (en) 2018-08-13 2023-10-24 Lam Research Corporation Replaceable and/or collapsible edge ring assemblies for plasma sheath tuning incorporating edge ring positioning and centering features
WO2021194470A1 (en) 2020-03-23 2021-09-30 Lam Research Corporation Mid-ring erosion compensation in substrate processing systems
CN114582691B (zh) * 2020-11-18 2025-02-14 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及其调节方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997962A (en) * 1995-06-30 1999-12-07 Tokyo Electron Limited Plasma process utilizing an electrostatic chuck
CN1440563A (zh) * 2000-06-30 2003-09-03 兰姆研究公司 具有改善的颗粒污染性能的半导体处理设备
CN1488161A (zh) * 2000-12-29 2004-04-07 兰姆研究公司 用于等离子工艺的电极以及制造和使用此电极的方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5074456A (en) * 1990-09-18 1991-12-24 Lam Research Corporation Composite electrode for plasma processes
US5534751A (en) 1995-07-10 1996-07-09 Lam Research Corporation Plasma etching apparatus utilizing plasma confinement
JPH11219935A (ja) * 1998-01-30 1999-08-10 Hitachi Chem Co Ltd プラズマ処理装置用電極及びプラズマ処理装置
JP2000012516A (ja) * 1998-06-25 2000-01-14 Hitachi Chem Co Ltd プラズマエッチング用電極板及びプラズマエッチング装置
JP3461120B2 (ja) * 1998-06-29 2003-10-27 日立化成工業株式会社 プラズマエッチング用電極板及びプラズマエッチング装置
US6073577A (en) 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
JP2002164329A (ja) * 2000-09-14 2002-06-07 Tokyo Electron Ltd プラズマ処理装置
US6391787B1 (en) 2000-10-13 2002-05-21 Lam Research Corporation Stepped upper electrode for plasma processing uniformity
WO2003100817A1 (en) * 2002-05-23 2003-12-04 Lam Research Corporation Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a mutli-part electrode
US6841943B2 (en) * 2002-06-27 2005-01-11 Lam Research Corp. Plasma processor with electrode simultaneously responsive to plural frequencies
US6838012B2 (en) * 2002-10-31 2005-01-04 Lam Research Corporation Methods for etching dielectric materials
JP4220316B2 (ja) 2003-06-24 2009-02-04 株式会社日立ハイテクノロジーズ プラズマ処理装置
US7267741B2 (en) * 2003-11-14 2007-09-11 Lam Research Corporation Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
US7645341B2 (en) * 2003-12-23 2010-01-12 Lam Research Corporation Showerhead electrode assembly for plasma processing apparatuses
JP4550507B2 (ja) * 2004-07-26 2010-09-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
US7244311B2 (en) * 2004-10-13 2007-07-17 Lam Research Corporation Heat transfer system for improved semiconductor processing uniformity
US7875824B2 (en) * 2006-10-16 2011-01-25 Lam Research Corporation Quartz guard ring centering features
US7482550B2 (en) * 2006-10-16 2009-01-27 Lam Research Corporation Quartz guard ring

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997962A (en) * 1995-06-30 1999-12-07 Tokyo Electron Limited Plasma process utilizing an electrostatic chuck
CN1440563A (zh) * 2000-06-30 2003-09-03 兰姆研究公司 具有改善的颗粒污染性能的半导体处理设备
CN1488161A (zh) * 2000-12-29 2004-04-07 兰姆研究公司 用于等离子工艺的电极以及制造和使用此电极的方法

Also Published As

Publication number Publication date
US8084705B2 (en) 2011-12-27
US20080099120A1 (en) 2008-05-01
SG175649A1 (en) 2011-11-28
TWI424492B (zh) 2014-01-21
JP2010507228A (ja) 2010-03-04
KR20090080520A (ko) 2009-07-24
CN101529562A (zh) 2009-09-09
JP5006401B2 (ja) 2012-08-22
WO2008048444A1 (en) 2008-04-24
TW200841390A (en) 2008-10-16
US7875824B2 (en) 2011-01-25
KR101411747B1 (ko) 2014-06-27
US20110083318A1 (en) 2011-04-14

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