JP2010505978A - 特に電子部品及び導体通路を貼り付け用の熱活性化可能な接着テープ - Google Patents
特に電子部品及び導体通路を貼り付け用の熱活性化可能な接着テープ Download PDFInfo
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- JP2010505978A JP2010505978A JP2009530845A JP2009530845A JP2010505978A JP 2010505978 A JP2010505978 A JP 2010505978A JP 2009530845 A JP2009530845 A JP 2009530845A JP 2009530845 A JP2009530845 A JP 2009530845A JP 2010505978 A JP2010505978 A JP 2010505978A
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- Prior art keywords
- adhesive tape
- heat
- acid
- epoxy
- activatable adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
- C08J5/128—Adhesives without diluent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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Landscapes
- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Traffic Control Systems (AREA)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013502027A (ja) * | 2009-08-12 | 2013-01-17 | テーザ・ソシエタス・ヨーロピア | 電子的装置のカプセル化方法 |
| DE102012206265A1 (de) * | 2012-04-17 | 2013-10-17 | Tesa Se | Temperaturstabile vernetzbare Klebemasse mit Hart- und Weichblöcken |
| DE102012206273A1 (de) * | 2012-04-17 | 2013-10-17 | Tesa Se | Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere |
| KR20130119940A (ko) * | 2010-11-12 | 2013-11-01 | 테사 소시에타스 유로파에아 | 전자 장치를 캡슐화하기 위한 접착제 및 방법 |
| JP2014040498A (ja) * | 2012-08-21 | 2014-03-06 | Panac Co Ltd | 自己粘着性フィルム、これを用いた飛散防止ガラスの製造方法 |
| JP2014040497A (ja) * | 2012-08-21 | 2014-03-06 | Panac Co Ltd | 自己粘着性フィルム、これを用いた飛散防止ガラスの製造方法、及び自己粘着性熱可塑性エラストマー組成物 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
| US8851356B1 (en) * | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
| DE102008032568A1 (de) * | 2008-07-11 | 2010-01-14 | Tesa Se | Verwendung einer Klebfolie mit einer einseitig mit einer Klebmasse ausgerüsteten Trägerfolie zur Abdeckung von Mikrotiterplatten |
| DE102008061840A1 (de) * | 2008-12-15 | 2010-06-17 | Tesa Se | Haftklebemasse |
| DE102008062130A1 (de) * | 2008-12-16 | 2010-06-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| DE102009036970A1 (de) * | 2009-08-12 | 2011-02-17 | Tesa Se | Verfahren zur Kapselung einer elektronischen Anordnung |
| EP2477738B1 (en) | 2009-09-15 | 2019-01-23 | Basf Se | Photo-latent titanium-chelate catalysts |
| KR101752516B1 (ko) | 2009-09-15 | 2017-06-29 | 바스프 에스이 | 광-잠재성 티타늄 촉매 |
| JP5742346B2 (ja) * | 2010-03-25 | 2015-07-01 | ヤマハ株式会社 | エポキシ樹脂系接着剤用硬化剤組成物および多孔質体用接着剤 |
| DE102010043871A1 (de) * | 2010-11-12 | 2012-05-16 | Tesa Se | Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung |
| JP6184401B2 (ja) | 2011-04-05 | 2017-08-23 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 光潜在性チタン−オキソ−キレート触媒 |
| DE102011085354A1 (de) * | 2011-10-27 | 2013-05-02 | Tesa Se | Haftklebmasse mit erhöhter Temperaturstabilität und Verwendung derselben für ein Klebeband |
| KR101797723B1 (ko) * | 2014-12-08 | 2017-11-14 | 셍기 테크놀로지 코. 엘티디. | 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체 |
| JP6740254B2 (ja) * | 2015-12-24 | 2020-08-12 | 株式会社カネカ | 樹脂組成物およびそれを用いた半硬化性熱伝導フィルムおよび回路基板および接着シート |
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| JP2003535189A (ja) * | 2000-06-01 | 2003-11-25 | クレイトン・ポリマーズ・リサーチ・ベー・ベー | アルミニウムアセチルアセトナートで架橋された官能化ブロック共重合体を含む組成物 |
| JP2006009015A (ja) * | 2004-06-28 | 2006-01-12 | Tesa Ag | 電子部品とコンダクタ・トラックを接合するための熱活性化できる接着テープ |
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| US3970608A (en) | 1974-04-05 | 1976-07-20 | Bridgestone Tire Company Limited | Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same |
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| DE10036802A1 (de) * | 2000-07-28 | 2002-02-07 | Tesa Ag | Haftklebemassen auf Basis von Blockcopolymeren der Struktur P(A)-P(B)-P(A) |
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| US20040161564A1 (en) * | 2003-02-14 | 2004-08-19 | Truog Keith L. | Dry paint transfer laminate |
| DE102004007258A1 (de) | 2003-12-22 | 2005-07-28 | Tesa Ag | Chemisch vernetzbare, durch Zug in Richtung der Verklebungsebene lösbare Klebestreifen |
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| DE102004031190A1 (de) | 2004-06-28 | 2006-01-19 | Tesa Ag | Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
| DE102004031189A1 (de) | 2004-06-28 | 2006-01-19 | Tesa Ag | Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
| ES2375498T3 (es) * | 2005-08-24 | 2012-03-01 | Henkel Ag & Co. Kgaa | Resinas epoxi que tienen una resistencia al impacto mejorada. |
| DE102005055769A1 (de) * | 2005-11-21 | 2007-05-24 | Tesa Ag | Verfahren zur temporären Fixierung eines polymeren Schichtmaterials auf rauen Oberflächen |
| JP5085145B2 (ja) * | 2006-03-15 | 2012-11-28 | 日東電工株式会社 | 両面粘着テープ又はシート、および液晶表示装置 |
| DE102006023936A1 (de) * | 2006-05-19 | 2007-11-22 | Tesa Ag | Maskierung von Fensterflanschen mit einem Klebeband mit einer Selbstklebemasse auf Basis vernetzter Vinylaromatenblockcopolymere |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003535189A (ja) * | 2000-06-01 | 2003-11-25 | クレイトン・ポリマーズ・リサーチ・ベー・ベー | アルミニウムアセチルアセトナートで架橋された官能化ブロック共重合体を含む組成物 |
| JP2006009015A (ja) * | 2004-06-28 | 2006-01-12 | Tesa Ag | 電子部品とコンダクタ・トラックを接合するための熱活性化できる接着テープ |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013502027A (ja) * | 2009-08-12 | 2013-01-17 | テーザ・ソシエタス・ヨーロピア | 電子的装置のカプセル化方法 |
| KR101769930B1 (ko) | 2009-08-12 | 2017-08-21 | 테사 소시에타스 유로파에아 | 전자 장치를 캡슐화하는 방법 |
| KR20130119940A (ko) * | 2010-11-12 | 2013-11-01 | 테사 소시에타스 유로파에아 | 전자 장치를 캡슐화하기 위한 접착제 및 방법 |
| KR101939134B1 (ko) * | 2010-11-12 | 2019-01-16 | 테사 소시에타스 유로파에아 | 전자 장치를 캡슐화하기 위한 접착제 및 방법 |
| DE102012206265A1 (de) * | 2012-04-17 | 2013-10-17 | Tesa Se | Temperaturstabile vernetzbare Klebemasse mit Hart- und Weichblöcken |
| DE102012206273A1 (de) * | 2012-04-17 | 2013-10-17 | Tesa Se | Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere |
| US9422466B2 (en) | 2012-04-17 | 2016-08-23 | Tesa Se | Temperature-stable cross-linkable adhesive compound with hard and soft blocks |
| US9487684B2 (en) | 2012-04-17 | 2016-11-08 | Tesa Se | Cross-linkable adhesive compound with hard and soft blocks as a permeant barrier |
| JP2014040498A (ja) * | 2012-08-21 | 2014-03-06 | Panac Co Ltd | 自己粘着性フィルム、これを用いた飛散防止ガラスの製造方法 |
| JP2014040497A (ja) * | 2012-08-21 | 2014-03-06 | Panac Co Ltd | 自己粘着性フィルム、これを用いた飛散防止ガラスの製造方法、及び自己粘着性熱可塑性エラストマー組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090088873A (ko) | 2009-08-20 |
| KR101496787B1 (ko) | 2015-02-27 |
| TWI453266B (zh) | 2014-09-21 |
| ATE481459T1 (de) | 2010-10-15 |
| TW200817489A (en) | 2008-04-16 |
| EP2079815B1 (de) | 2010-09-15 |
| US9273231B2 (en) | 2016-03-01 |
| DE102006047738A1 (de) | 2008-04-10 |
| DE502007005081D1 (de) | 2010-10-28 |
| US20100012271A1 (en) | 2010-01-21 |
| EP2079815A1 (de) | 2009-07-22 |
| CN101522844A (zh) | 2009-09-02 |
| WO2008043660A1 (de) | 2008-04-17 |
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