CN101522844A - 特别用于电子元件和导线通道的结合的可热活化胶带 - Google Patents
特别用于电子元件和导线通道的结合的可热活化胶带 Download PDFInfo
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- CN101522844A CN101522844A CNA2007800374281A CN200780037428A CN101522844A CN 101522844 A CN101522844 A CN 101522844A CN A2007800374281 A CNA2007800374281 A CN A2007800374281A CN 200780037428 A CN200780037428 A CN 200780037428A CN 101522844 A CN101522844 A CN 101522844A
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 50
- 239000004020 conductor Substances 0.000 title abstract description 4
- 239000002253 acid Substances 0.000 claims abstract description 12
- 229920001400 block copolymer Polymers 0.000 claims abstract description 12
- 239000013522 chelant Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- -1 epoxide compound Chemical class 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 28
- 239000004593 Epoxy Substances 0.000 claims description 27
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 claims description 22
- 239000004642 Polyimide Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 230000004048 modification Effects 0.000 claims description 14
- 238000012986 modification Methods 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 150000008064 anhydrides Chemical group 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 9
- 150000008065 acid anhydrides Chemical class 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- KILURZWTCGSYRE-LNTINUHCSA-K (z)-4-bis[[(z)-4-oxopent-2-en-2-yl]oxy]alumanyloxypent-3-en-2-one Chemical group CC(=O)\C=C(\C)O[Al](O\C(C)=C/C(C)=O)O\C(C)=C/C(C)=O KILURZWTCGSYRE-LNTINUHCSA-K 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000001118 alkylidene group Chemical group 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 125000005842 heteroatom Chemical group 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 229910052723 transition metal Inorganic materials 0.000 claims description 3
- 150000003624 transition metals Chemical class 0.000 claims description 3
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229920006132 styrene block copolymer Polymers 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims 2
- 239000004033 plastic Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 229920001577 copolymer Polymers 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 229920001342 Bakelite® Polymers 0.000 description 7
- 239000004637 bakelite Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229920002633 Kraton (polymer) Polymers 0.000 description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000003352 sequestering agent Substances 0.000 description 3
- 239000003351 stiffener Substances 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical group CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000007518 monoprotic acids Chemical class 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229940123457 Free radical scavenger Drugs 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical group CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- UPBDXRPQPOWRKR-UHFFFAOYSA-N furan-2,5-dione;methoxyethene Chemical compound COC=C.O=C1OC(=O)C=C1 UPBDXRPQPOWRKR-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000007725 thermal activation Methods 0.000 description 1
- 150000007970 thio esters Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Substances C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
- C08J5/128—Adhesives without diluent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
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Abstract
可热活化胶带,其特别用于电子元件和导线通道的结合,具有至少由以下组分构成的粘合剂:a)酸改性或酸酐改性的乙烯基芳族嵌段共聚物,b)环氧化合物,和c)金属螯合物。
Description
本发明涉及特别用于结合柔性印刷导线通道(conductor tracks)(柔性印刷电路板,FPCB)的在高温具有低流动性的可热活化粘合剂。
当今,柔性印刷电路板用于大量诸如手机、收音机、计算机、打印机等等电子设备。柔性印刷电路板由同铜和高耐熔的热塑性材料(大多数为聚酰亚胺,较少的为聚酯)的层构成。这些FPCB往往使用要求特别严格的胶带制备。一方面,为了制备FPCB,将铜箔与聚酰亚胺片结合在一起;另一方面,还将单个的FPCB彼此相结合,此时将聚酰亚胺和聚酰亚胺结合。除了这些应用之外,FPCB还与其他基底结合。
对于用于这些结合任务的胶带有非常严格的要求。因为,必须获得非常高的结合性能,所用的胶带通常为在高温下处理的可热活化胶带。这些胶带在结合FPCB期间的高温载荷中(常常在约200℃的温度进行)必须不释放出挥发性组分。为了获得高水平的内聚力,胶带必须在此温度荷载期间交联。结合操作期间的高压使得在高温下胶带的流动性必须很低。这通过未交联胶带的高粘度或非常快速的交联来实现。而且,胶带还必须耐焊料浴(solder bath resistance),换言之,必须短时间耐受288℃的温度荷载。
为此使用纯的热塑性材料不合理,虽然它们熔融得非常快,确保结合基底有效润湿并在几秒内产生非常快速的结合。但是,在高温下,它们如此柔软使得它们往往在结合过程的压力下胀出粘合层外。因此,也不耐焊料浴。
对于可交联的胶带,通常使用环氧树脂或酚醛树脂,这些树脂与特定的硬化剂反应形成聚合物网络。在此特定情形中,不能使用酚醛树脂,因为在交联过程中它们产生消除反应产物(elimination product),该产物释放出来,在固化过程或者最迟在焊料浴中引起起泡。
在结构粘结中主要使用环氧树脂,并且在用合适的交联剂固化之后产生非常脆的粘合剂,这确实获得了高的结合强度,但实际不具有柔韧性。
增加柔韧性对于在FPCB中使用至关重要。一方面,使用理想地卷绕成卷筒的胶带进行结合;另一方面,所研究的导线通道是柔性的且必须还可以弯曲,例如在膝上型电脑的导线通道中方便看到的,其中可折叠的显示屏经由FPCB与其他电路连接。
可以两种方式使这些环氧树脂粘合剂柔韧化。首先,存在用弹性体链柔韧化的环氧树脂,但它们产生的柔韧性是有限的,因为弹性体链非常短。另一种可行方式是通过添加弹性体(将其加入粘合剂)获得柔韧性。该方案的缺点是弹性体不能化学交联,意味着可以使用的弹性体仅仅是那些在高温下仍保持高粘度的弹性体。
由于胶带通常由溶液制备,往往难以找到如下弹性体,其具有足够长的链特性,从而不在高温下流动,同时还具有可以溶于溶液的足够的短链特性。
可以经由热熔体操作进行制备,但在交联体系中非常困难,因为必须防止在制备操作过程中过早交联。
在许多应用中,在FPCB的制造和加工领域,将胶带从通常保护胶带的防粘介质中取下,然后定位在欲结合的基底上。此时需要确保在此操作之前已经模切的胶带在除去防粘介质时或在定位时不变形。因为防粘介质的去除需要消耗一些力,因此胶带的弹性模量必须足够高,从而不会因为该力产生任何拉伸或其他变形。考虑到所用的产品必须尽可能地薄,则难以将载体和胶带合并在一起;而通常胶带仅由一层粘合剂构成。因此粘合剂必须具有足够高的弹性模量,从而不被伸长。
在US 5,369,167A中可以知道基于酸酐改性的嵌段共聚物和环氧树脂的粘合剂。描述了制备这些混配制剂的方法。而且,使用固化剂交联该环氧树脂。它没有提到胶带。
在JP 57/149369 A1中也描述了类似的粘合剂。再次,需要固化剂用于环氧树脂。它没有披露胶带。
在EP 1 311 559 A2可以知道马来酸酐改性嵌段共聚物和螯合剂的交联,其中描述了该嵌段共聚物混合物的内聚力增加。没有提到制备可热活化胶带的方法,虽然螯合剂在高温参与和环氧树脂的交联。
另外,例如,从US 4,005,247 A或US 3,769,254 A中可以知道螯合剂与酸改性丙烯酸酯粘合剂进行交联。
DE 10 2004 031 188 A1公开了用于电子元件和柔性导线通道的结合的胶带,包括至少由酸改性或酸酐改性的乙烯基芳族嵌段共聚物和环氧树脂构成的粘合剂。没有提到金属螯合物。
DE 10 2004 007 258 A公开了用于粘合剂片带的粘合剂,由以下物质的混合物构成:
·酸改性或酸酐改性的乙烯基芳族嵌段共聚物,
·下式的金属螯合物:
(R1O)n M(XR2Y)m,
其中
M为2、3、4或5主族的金属或过渡金属;
R1为烷基或芳基;
n为0或更大的整数,
X和Y为氧或氮,在每种情况下还可以通过双键与R2连接;
R2为连接X和Y的亚烷基,可以是支化的,或者在链中可以含有氧或其他杂原子;
m为整数,但至少为1,
·增粘树脂,
该粘合剂片带通过在粘合层方向上扩展拉伸可以分开。没有提到添加含环氧基的化合物。
因此,本发明的目的是提供一种胶带,其是可热活化的,在热状态下交联,在热状态下具有低粘度,显示与聚酰亚胺的有效粘合,以及其未交联态在有机溶剂中是可溶的,并且在室温下具有高的弹性模量。
令人惊讶的是,通过具有如第一独立权利要求详细描述的特征的胶带实现了该目的。从属权利要求提供了本发明主题的有利方案,还有该胶带应用的可能性。
一种可热活化胶带,其特别用于电子元件和导线通道的结合,具有至少由以下组分构成的粘合剂:
a)酸改性或酸酐改性的乙烯基芳族嵌段共聚物,
b)含环氧基的化合物,和
c)金属螯合物。
用于本发明目的的通用表述“胶带”包括所有片状结构,如二维延展的片材或片段,具有延伸长度和有限宽度的带状物,带段,冲切片等。
所用的粘合剂优选是基于嵌段共聚物的那些,包括主要由乙烯基芳族化合物(优选苯乙烯)形成的聚合物嵌段(A嵌段)和主要由1,3-二烯(优选丁二烯和异戊二烯)的聚合反应形成的聚合物嵌段(B嵌段)。根据本发明,既可以使用均聚物嵌段也可以使用共聚物嵌段。所得的嵌段共聚物可包含相同或相异的B嵌段,其可以是部分、选择性或完全氢化的。嵌段共聚物可具有线型A-B-A结构。还可以使用的有放射状类型的嵌段共聚物及星形和线型多嵌段共聚物。其他存在的组分可包括A-B二嵌段共聚物。根据本发明也可以使用乙烯基芳族化合物和异丁烯的嵌段共聚物。所有上述聚合物可以单独使用或以彼此间的混合物的形式使用。
至少一些所用的嵌段共聚物必须是酸改性或酸酐改性的,该改性主要通过不饱和一元酸和多元酸或酸酐的自由基接枝共聚进行的,该不饱和一元酸和多元酸或酸酐例如为,富马酸、衣康酸、柠康酸、丙烯酸、马来酸酐、衣康酸酐、柠康酸酐,优选马来酸酐,酸或酸酐的含量优选为0.5~4wt%,基于全部嵌段共聚物。
这类嵌段共聚物可以购买,例如,得自Shell,商品名为KratonTM FG 190l和KratonTM FG 1924;或得自Asahi,商品名为TuftecTM M 1913和TuftecTM M1943。
环氧树脂通常理解为每分子含有多于一个环氧基团的单体化合物和低聚化合物。它们可以是缩水甘油基酯或表氯醇与双酚A或双酚F或两者的混合物的反应产物。同样适合使用的是线型酚醛环氧树脂,得自酚类和甲醛的反应产物与表氯醇的反应。也可以使用含有两个或更多个环氧端基的单体化合物,其充当环氧树脂的稀释剂。同样适合使用的是弹性改性的环氧树脂或环氧改性的弹性体,例如环氧化的苯乙烯嵌段共聚物,实例为得自Daicel的Epofriend。
环氧树脂的实例为得自Ciba Geigy的AralditeTM 6010,CY-281TM,ECNTM 1273,ECNTM 1280,MY 720,RD-2;得自Dow Chemicals的DERTM 331,732,736,DENTM 432;得自Shell Chemicals的EponTM 812,825,826,828,830等;同样得自Shell Chemicals的HPTTM 1071,1079;以及得自Bakelite AG的BakeliteTM EPR 161,166,172,191,194等。
市售的脂族环氧树脂例如为乙烯基环己烷二氧化物,如得自UnionCarbide Corp.的ERL-4206,4221,4201,4289或0400。
经弹性处理的弹性体可得自Noveon,商品名为Hycar。
环氧稀释剂,即含有两个或更多个环氧基团的单体化合物例如为得自Bakelite AG的BakeliteTM EPD KR,EPD Z8,EPD HD,EPD WF等,或者得自UCCP的PolypoxTM R 9,R12,R 15,R 19,R 20等。
如上所述,尽管添加交联剂是不需要的,但也可以添加其他固化剂。本文所用的固化剂应该仅为具有酸基团或酸酐基团的物质,因为主要用于环氧交联的胺和胍与酸酐反应,由此减少反应性基团的数量。
除了已经提到的酸改性或酸酐改性的乙烯基芳族嵌段共聚物,还可以添加其他酸或酸酐以获得更高交联程度,由此获得进一步改进的内聚力。本申请中,可以使用单体的酸酐和酸(如US 3,970,608 A中描述的那些),酸改性或酸酐改性的聚合物,以及酸酐共聚物如聚乙烯基甲基醚-马来酸酐共聚物,可购买的例如有ISP出售的,商品名为GantrezTM。
金属螯合物的金属可以是2、3、4和5主族的金属或过渡金属。特别合适的例如为铝、锡、钛、锆、铪、钒、铌、铬、锰、铁、钴和铈。特别优选铝和钛。
可以使用各种金属螯合物用于该螯合物交联,且可以由下式表示:
(R1O)nM(XR2Y)m,
其中
M为上述金属,
R1为烷基或芳基,例如甲基、乙基、丁基、异丙基或苄基,
n为0或更大的整数,
X和Y为氧或氮,其中在每种情况下还可以通过双键与R2连接,
R2为连接X和Y的亚烷基,可以是支化的,或者在链中可以含有氧或其他杂原子,
m为整数,但至少为1。
优选的螯合物配体是得自以下化合物的反应的那些:三乙醇胺、2,4-戊二酮、2-乙基-1,3-己二醇或乳酸。特别优选的交联剂为乙酰丙酮铝和乙酰丙酮络钛。
所选择的酸和/或酸酐基团与乙酰基丙酮基团之比应该大致相等,以实现最佳交联,发现少许过量的交联剂是有利的。
然而,酸酐基团和乙酰基丙酮基团之比可以变化,但为了充分交联,这两个基团的任何一个存在的摩尔量都不应超出五倍过量。
环氧树脂和弹性体的化学交联在粘合剂膜内产生非常高的强度。然而,与聚酰亚胺的结合强度也确实无疑很高。
为了增加粘附性,还可以添加与嵌段共聚物的弹性体嵌段相容的增粘树脂。
在本发明的压敏粘合剂中可以使用的增粘剂为,例如,基于松香和松香衍生物的部分氢化或全部氢化的树脂,二环戊二烯聚合物的氢化聚合物,基于C5、C5/C9或C9单体流的未氢化、部分氢化、选择性或全部氢化的烃树脂,基于α-萜烯和/或β-萜烯和/或δ-柠檬烯的聚萜烯树脂,优选纯C8和C9芳族化合物的氢化聚合物。可以单独使用或以混合物的形式使用前述增粘剂树脂。
可以使用的其他添加剂通常包括:
—主抗氧化剂,如位阻酚
—辅助抗氧化剂,如亚磷酸酯或硫酯
—过程稳定剂(in-process stabilizer),如C-自由基清除剂
—光稳定剂,如UV吸收剂或位阻胺
—加工助剂
—封端增强树脂(endblock reinforcer resins)
—填料,如二氧化硅、玻璃(粉状或珠的形式)、氧化铝、氧化锌、碳酸钙、二氧化钛、炭黑、金属粉,等等
—有色颜料和染料,以及光学增亮剂
—任选的其他聚合物,优选本身具有弹性的聚合物。
本发明体系的优势是非常低的软化温度,这是因为嵌段共聚物的封端中聚苯乙烯的软化点的结果。由于交联反应期间,弹性体结合到聚合物网络中,该反应在通常用于结合FPCB的高达200℃的高温下相对较快,因此没有粘合剂从粘合层露出的情形。通过添加称为促进剂的物质,可以进一步加快反应速度。
可行的促进剂的实例包括以下:
—叔胺,如苄基二甲基胺、二甲基氨基甲基苯酚、三(二甲基氨基甲基)苯酚
—三卤化硼-胺络化物
—取代的咪唑
—三苯基膦
理想地,酸改性和/或酸酐改性的弹性体与环氧树脂的使用比例使得环氧基团和酸酐基团的摩尔分数恰好相等。当仅使用稍微改性的弹性体时和使用具有低环氧当量的低分子量环氧树脂时,结果仅仅是非常少的量—基于改性苯乙烯嵌段共聚物-使用的环氧树脂的低于10wt.%。
然而,酸酐基团和环氧基团之间的比例可以在宽范围内变化,但对于充分交联而言,这两个基团的任何一个存在的摩尔当量都不应超出四倍过量。
为了制备胶带,优选将粘合剂的组分溶于合适的溶剂,例如甲苯或石脑油70/90和丙酮的混合物中,然后将溶液涂布在配置有防粘层如防粘纸或防粘膜的柔性基底上,干燥涂层,使得组合物可以容易地再次从基底上除去。在适当转变之后,可以在室温制得冲切片、卷筒或其他形状。然后将相应的形状优选在高温下粘附到欲结合的基底,如聚酰亚胺上。
还可以将粘合剂直接涂布到聚酰亚胺背衬上。然后可以将这种类型的粘合剂片用于遮蔽FPCB的铜导线通道。
不需要该结合操作是一步过程。相反,可以首先通过进行热层合将胶带粘附在两个基底之一。然后在与第二基底(第二聚酰亚胺片或铜箔)的实际热结合操作过程中,将树脂全部或部分固化,粘合层获得高结合强度。
混合的环氧树脂优选在层合温度下还没有参与任何化学反应,而应仅在热结合时与酸或酸酐基团反应。
本发明的粘合剂的优势在于,弹性体实际上与树脂化学交联,没有任何必要添加用于环氧树脂的硬化剂,因为弹性体本身充当硬化剂。
由于与金属螯合物的交联发生在作为制备方法一部分的干燥过程,本发明的粘合剂充分变硬,并且弹性模量增加。
令人惊讶的是,尽管该交联在室温进行,但热活化通常在大于150℃以上的温度进行,导致改性弹性体和环氧树脂在弹性体的酸和/或酸酐基团和金属螯合之间发生交联。产生高水平的内聚力和高的结合强度。金属螯合物不影响此第二交联步骤。
实施例
下面通过多个实施例更详细地描述本发明,而不以任何方式限制本发明。
实施例1
将92.5g KratonTM FG 1901(马来酸酐改性苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物,含有30wt.%嵌段聚苯乙烯和约2wt.%马来酸酐),7.5g BakeliteTMEPR 191(环氧树脂)和2g乙酰丙酮铝的混合物溶于甲苯并从溶液中涂布到1.5g/m3硅化防粘纸上,在110℃干燥涂层15分钟。粘合剂层的厚度为25μm。
实施例2
将87.4g KratonTM FG 1901,2.6g BakeliteTM EPR 161(环氧树脂),10gRegaliteTM R 1100(氢化的烃树脂,软化点为约100℃,得自Eastman)和1.5g乙酰丙酮铝的混合物溶于甲苯并从溶液中涂布到1.5g/m3硅化防粘纸上,在110℃干燥涂层15分钟。粘合剂层的厚度为25μm。
对比实施例3
将92.5g KratonTM FG 1901(马来酸酐改性苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物,含有30wt.%聚苯乙烯嵌段和约2wt.%马来酸酐)和7.5g BakeliteTMEPR 191(环氧树脂)的混合物溶于甲苯中,并从溶液中涂布到1.5g/m3硅化防粘纸上,在110℃干燥涂层15分钟。粘合剂层的厚度为25μm。
用制备的胶带结合FPCB
在每种情况使用实施例1-3制得的胶带之一结合两个FPCB。为此,将胶带在100℃层合到聚酰亚胺/铜箔FPCB层合体的聚酰亚胺片上。随后,将另一FPCB的第二聚酰亚胺片和胶带结合,在可加热的Bürkle压机中在180℃和1.3Mpa的压力下将整个组件压制30分钟。
测试方法
通过以下测试方法考察上述实施例制备的粘合剂片的性质。
和FPCB的T-剥离测试
使用Zwick的拉伸测试机、将根据上述方法制备的FPCB/胶带/FPCB组件以180°的角度和50mm/min的速率彼此剥离开,测量需要的力,以N/cm计。在20℃和50%相对湿度下进行测量。每个测量值测定三次。
在5%伸长率时的力
由于使用如此薄的高柔性材料常常难以确定弹性模量,因而代之为测量在5%伸长率时的力。这通过从粘合剂冲压出1cm宽和10cm长的粘合剂条而进行,将该粘合剂条夹在拉伸测试机中。然后将粘合剂条以300mm/min的速度拉伸,记录在5%伸长率时的力。以N/cm为单位记录结果。
耐焊料浴
将根据上述方法结合的FPCB组件在288℃的焊料浴上搁置10秒。如果没有形成导致FPCB的聚酰亚胺片膨胀的气泡,则该结合定级为耐焊料浴。如果形成了甚至是微小的气泡,则该测试定级为失效。
温度稳定性
类似于所述的T-剥离测试,将根据上述方法制备的FPCB组件的一侧悬挂起来,而在另一侧附着500g重物。在70℃进行静态T-剥离测试。测量的参数是以mm/h为单位的静态剥离位移(static peel travel)。
结果
对于上述实施例的粘合剂组件,首先进行T-剥离测试。
在表1示出了结果。
表1
T-剥离测试[N/cm]
实施例1 8.6
实施例2 14.8
实施例3 9.7
可以看到,实施例1和3获得了同样高的结合强度。
使用静态剥离测试测量胶带的温度稳定性,其数值可以在表2中找到。
表2
在70℃的静态T-剥离测试[mm/h]
实施例1 4
实施例2 11
实施例3 5
另外在此处,实施例1和3之间没有大的差异,仅仅是实施例2的树脂共混产物显示稍大一些的剥离位移。
从表3可以获得在5%伸长率时的力。
表3
在5%伸长率时的力[N/cm]
实施例1 1.4
实施例2 1.2
实施例3 0.6
与螯合物交联显著增加了拉伸胶带所需的力。
三个实施例全部通过了焊料浴测试。
Claims (12)
1.可热活化胶带,其特别用于电子元件和导线通道的结合,具有至少由以下组分构成的粘合剂:
a)酸改性或酸酐改性的乙烯基芳族嵌段共聚物,
b)含环氧基的化合物,和
c)金属螯合物。
2.权利要求1的可热活化胶带,其特征在于,所述乙烯基芳族嵌段共聚物为苯乙烯嵌段共聚物。
3.权利要求1或2的可热活化胶带,其特征在于,所述含环氧基的化合物是环氧树脂和/或环氧化聚合物。
4.权利要求1-3至少一项的可热活化胶带,其特征在于,所述环氧基团与弹性体的酸和/或酸酐基团在高于150℃的温度交联。
5.前述权利要求至少一项的可热活化胶带,其特征在于,所述金属螯合物可以由下式表示
(R1O)nM(XR2Y)m,
其中
M是2、3、4或5主族金属,或过渡金属,
R1是烷基或芳基,如甲基、乙基、丁基、异丙基或苄基,
n为0或更大的整数,
X和Y为氧或氮,其中在每种情况下还可以通过双键与R2连接,
R2为连接X和Y的亚烷基,可以是支化的,或者在链中可以含有氧或其他杂原子,
m为整数,但至少为1。
6.前述权利要求至少一项的可热活化胶带,其特征在于,所述金属螯合物是乙酰丙酮铝或乙酰丙酮络钛。
7.前述权利要求至少一项的可热活化胶带,其特征在于,所述胶带包括其他酸酐、其他弹性体、增粘树脂、促进剂、染料、炭黑和/或金属粉。
8.前述权利要求至少一项的可热活化胶带,其特征在于,所述环氧树脂的含量不大于10wt.%,优选不大于5wt.%,基于酸改性和/或酸酐改性弹性体的含量。
9.粘结塑料部件的方法,其中使用前述权利要求至少一项的可热活化胶带,该胶带至少由酸改性或酸酐改性的乙烯基芳族嵌段共聚物和环氧树脂组成。
10.前述权利要求至少一项的可热活化胶带用于结合塑料部件的用途。
11.前述权利要求至少一项的可热活化胶带用于电子元件和/或柔性印刷电路(FPCB)的结合的用途。
12.前述权利要求至少一项的可热活化胶带用于结合聚酰亚胺的用途。
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-
2006
- 2006-10-06 DE DE102006047738A patent/DE102006047738A1/de not_active Withdrawn
-
2007
- 2007-08-20 TW TW096130652A patent/TWI453266B/zh not_active IP Right Cessation
- 2007-09-24 AT AT07820503T patent/ATE481459T1/de active
- 2007-09-24 JP JP2009530845A patent/JP2010505978A/ja active Pending
- 2007-09-24 WO PCT/EP2007/060096 patent/WO2008043660A1/de active Application Filing
- 2007-09-24 CN CNA2007800374281A patent/CN101522844A/zh active Pending
- 2007-09-24 DE DE502007005081T patent/DE502007005081D1/de active Active
- 2007-09-24 US US12/440,276 patent/US9273231B2/en not_active Expired - Fee Related
- 2007-09-24 EP EP07820503A patent/EP2079815B1/de not_active Not-in-force
- 2007-09-24 KR KR1020097009340A patent/KR101496787B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103348465A (zh) * | 2010-11-12 | 2013-10-09 | 德莎欧洲公司 | 封装电子装置的粘合剂和方法 |
CN103348465B (zh) * | 2010-11-12 | 2017-02-08 | 德莎欧洲公司 | 封装电子装置的粘合剂和方法 |
CN108291076A (zh) * | 2015-12-24 | 2018-07-17 | 株式会社钟化 | 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片 |
Also Published As
Publication number | Publication date |
---|---|
WO2008043660A1 (de) | 2008-04-17 |
TWI453266B (zh) | 2014-09-21 |
TW200817489A (en) | 2008-04-16 |
US9273231B2 (en) | 2016-03-01 |
DE102006047738A1 (de) | 2008-04-10 |
KR20090088873A (ko) | 2009-08-20 |
EP2079815A1 (de) | 2009-07-22 |
DE502007005081D1 (de) | 2010-10-28 |
JP2010505978A (ja) | 2010-02-25 |
EP2079815B1 (de) | 2010-09-15 |
ATE481459T1 (de) | 2010-10-15 |
KR101496787B1 (ko) | 2015-02-27 |
US20100012271A1 (en) | 2010-01-21 |
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