JP2010222700A5 - - Google Patents
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- Publication number
- JP2010222700A5 JP2010222700A5 JP2010020734A JP2010020734A JP2010222700A5 JP 2010222700 A5 JP2010222700 A5 JP 2010222700A5 JP 2010020734 A JP2010020734 A JP 2010020734A JP 2010020734 A JP2010020734 A JP 2010020734A JP 2010222700 A5 JP2010222700 A5 JP 2010222700A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- connecting plate
- support member
- hole
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010020734A JP5457216B2 (ja) | 2009-02-27 | 2010-02-01 | 基板支持装置及び基板搬送装置、電気デバイスの製造方法 |
| US12/706,901 US8770906B2 (en) | 2009-02-27 | 2010-02-17 | Substrate support apparatus and substrate transport apparatus having shock absorption |
| CN201010126048.9A CN101901603A (zh) | 2009-02-27 | 2010-02-26 | 衬底支承设备、衬底传输设备以及电子装置制造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009045597 | 2009-02-27 | ||
| JP2009045597 | 2009-02-27 | ||
| JP2010020734A JP5457216B2 (ja) | 2009-02-27 | 2010-02-01 | 基板支持装置及び基板搬送装置、電気デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010222700A JP2010222700A (ja) | 2010-10-07 |
| JP2010222700A5 true JP2010222700A5 (enExample) | 2013-03-14 |
| JP5457216B2 JP5457216B2 (ja) | 2014-04-02 |
Family
ID=42667178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010020734A Active JP5457216B2 (ja) | 2009-02-27 | 2010-02-01 | 基板支持装置及び基板搬送装置、電気デバイスの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8770906B2 (enExample) |
| JP (1) | JP5457216B2 (enExample) |
| CN (1) | CN101901603A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9070730B2 (en) * | 2011-10-07 | 2015-06-30 | Varian Semiconductor Equipment Associates, Inc. | Method and apparatus for removing a vertically-oriented substrate from a cassette |
| JP5892783B2 (ja) * | 2011-12-21 | 2016-03-23 | キヤノンアネルバ株式会社 | 基板支持装置及び基板搬送装置 |
| CN113066742B (zh) * | 2021-03-18 | 2023-11-10 | 浙江芯能光伏科技股份有限公司 | 一种生产太阳能多晶硅片的自动传送设备 |
| USD1071886S1 (en) * | 2022-01-20 | 2025-04-22 | Applied Materials, Inc. | Substrate support for a substrate processing chamber |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4086870A (en) * | 1977-06-30 | 1978-05-02 | International Business Machines Corporation | Novel resist spinning head |
| US5457368A (en) * | 1993-03-09 | 1995-10-10 | University Of Utah Research Foundation | Mechanical/electrical displacement transducer |
| JPH07278820A (ja) * | 1994-04-13 | 1995-10-24 | Anelva Corp | 基板加熱ホルダー支持機構 |
| US5851041A (en) * | 1996-06-26 | 1998-12-22 | Ontrak Systems, Inc. | Wafer holder with spindle assembly and wafer holder actuator |
| TW484184B (en) * | 1998-11-06 | 2002-04-21 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
| JP4365920B2 (ja) * | 1999-02-02 | 2009-11-18 | キヤノン株式会社 | 分離方法及び半導体基板の製造方法 |
| JP4307653B2 (ja) * | 1999-09-17 | 2009-08-05 | キヤノンアネルバ株式会社 | 基板支持装置および基板搬送機構 |
| DE19962170A1 (de) * | 1999-12-22 | 2001-07-12 | Steag Micro Tech Gmbh | Substrahthalter |
| JP2001216689A (ja) * | 2000-01-31 | 2001-08-10 | Anelva Corp | 基板支持機構及び基板支持回転装置 |
| US20040177813A1 (en) * | 2003-03-12 | 2004-09-16 | Applied Materials, Inc. | Substrate support lift mechanism |
-
2010
- 2010-02-01 JP JP2010020734A patent/JP5457216B2/ja active Active
- 2010-02-17 US US12/706,901 patent/US8770906B2/en active Active
- 2010-02-26 CN CN201010126048.9A patent/CN101901603A/zh active Pending
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