JP5457216B2 - 基板支持装置及び基板搬送装置、電気デバイスの製造方法 - Google Patents

基板支持装置及び基板搬送装置、電気デバイスの製造方法 Download PDF

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Publication number
JP5457216B2
JP5457216B2 JP2010020734A JP2010020734A JP5457216B2 JP 5457216 B2 JP5457216 B2 JP 5457216B2 JP 2010020734 A JP2010020734 A JP 2010020734A JP 2010020734 A JP2010020734 A JP 2010020734A JP 5457216 B2 JP5457216 B2 JP 5457216B2
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Japan
Prior art keywords
substrate
connecting plate
hole
support member
chamber
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JP2010020734A
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English (en)
Japanese (ja)
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JP2010222700A (ja
JP2010222700A5 (enExample
Inventor
正浩 厚見
昌昭 石田
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Canon Anelva Corp
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Canon Anelva Corp
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Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Priority to JP2010020734A priority Critical patent/JP5457216B2/ja
Priority to US12/706,901 priority patent/US8770906B2/en
Priority to CN201010126048.9A priority patent/CN101901603A/zh
Publication of JP2010222700A publication Critical patent/JP2010222700A/ja
Publication of JP2010222700A5 publication Critical patent/JP2010222700A5/ja
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Publication of JP5457216B2 publication Critical patent/JP5457216B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2010020734A 2009-02-27 2010-02-01 基板支持装置及び基板搬送装置、電気デバイスの製造方法 Active JP5457216B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010020734A JP5457216B2 (ja) 2009-02-27 2010-02-01 基板支持装置及び基板搬送装置、電気デバイスの製造方法
US12/706,901 US8770906B2 (en) 2009-02-27 2010-02-17 Substrate support apparatus and substrate transport apparatus having shock absorption
CN201010126048.9A CN101901603A (zh) 2009-02-27 2010-02-26 衬底支承设备、衬底传输设备以及电子装置制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009045597 2009-02-27
JP2009045597 2009-02-27
JP2010020734A JP5457216B2 (ja) 2009-02-27 2010-02-01 基板支持装置及び基板搬送装置、電気デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2010222700A JP2010222700A (ja) 2010-10-07
JP2010222700A5 JP2010222700A5 (enExample) 2013-03-14
JP5457216B2 true JP5457216B2 (ja) 2014-04-02

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JP2010020734A Active JP5457216B2 (ja) 2009-02-27 2010-02-01 基板支持装置及び基板搬送装置、電気デバイスの製造方法

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Country Link
US (1) US8770906B2 (enExample)
JP (1) JP5457216B2 (enExample)
CN (1) CN101901603A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070730B2 (en) * 2011-10-07 2015-06-30 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for removing a vertically-oriented substrate from a cassette
JP5892783B2 (ja) * 2011-12-21 2016-03-23 キヤノンアネルバ株式会社 基板支持装置及び基板搬送装置
CN113066742B (zh) * 2021-03-18 2023-11-10 浙江芯能光伏科技股份有限公司 一种生产太阳能多晶硅片的自动传送设备
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086870A (en) * 1977-06-30 1978-05-02 International Business Machines Corporation Novel resist spinning head
US5457368A (en) * 1993-03-09 1995-10-10 University Of Utah Research Foundation Mechanical/electrical displacement transducer
JPH07278820A (ja) * 1994-04-13 1995-10-24 Anelva Corp 基板加熱ホルダー支持機構
US5851041A (en) * 1996-06-26 1998-12-22 Ontrak Systems, Inc. Wafer holder with spindle assembly and wafer holder actuator
TW484184B (en) * 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
JP4365920B2 (ja) * 1999-02-02 2009-11-18 キヤノン株式会社 分離方法及び半導体基板の製造方法
JP4307653B2 (ja) * 1999-09-17 2009-08-05 キヤノンアネルバ株式会社 基板支持装置および基板搬送機構
DE19962170A1 (de) * 1999-12-22 2001-07-12 Steag Micro Tech Gmbh Substrahthalter
JP2001216689A (ja) * 2000-01-31 2001-08-10 Anelva Corp 基板支持機構及び基板支持回転装置
US20040177813A1 (en) * 2003-03-12 2004-09-16 Applied Materials, Inc. Substrate support lift mechanism

Also Published As

Publication number Publication date
JP2010222700A (ja) 2010-10-07
US8770906B2 (en) 2014-07-08
US20100221089A1 (en) 2010-09-02
CN101901603A (zh) 2010-12-01

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