CN101901603A - 衬底支承设备、衬底传输设备以及电子装置制造方法 - Google Patents

衬底支承设备、衬底传输设备以及电子装置制造方法 Download PDF

Info

Publication number
CN101901603A
CN101901603A CN201010126048.9A CN201010126048A CN101901603A CN 101901603 A CN101901603 A CN 101901603A CN 201010126048 A CN201010126048 A CN 201010126048A CN 101901603 A CN101901603 A CN 101901603A
Authority
CN
China
Prior art keywords
substrate
web joint
hole
supporting
described substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201010126048.9A
Other languages
English (en)
Chinese (zh)
Inventor
厚见正浩
石田昌昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Publication of CN101901603A publication Critical patent/CN101901603A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
CN201010126048.9A 2009-02-27 2010-02-26 衬底支承设备、衬底传输设备以及电子装置制造方法 Pending CN101901603A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009045597 2009-02-27
JP2009-045597 2009-02-27
JP2010020734A JP5457216B2 (ja) 2009-02-27 2010-02-01 基板支持装置及び基板搬送装置、電気デバイスの製造方法
JP2010-020734 2010-02-01

Publications (1)

Publication Number Publication Date
CN101901603A true CN101901603A (zh) 2010-12-01

Family

ID=42667178

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010126048.9A Pending CN101901603A (zh) 2009-02-27 2010-02-26 衬底支承设备、衬底传输设备以及电子装置制造方法

Country Status (3)

Country Link
US (1) US8770906B2 (enExample)
JP (1) JP5457216B2 (enExample)
CN (1) CN101901603A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070730B2 (en) * 2011-10-07 2015-06-30 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for removing a vertically-oriented substrate from a cassette
JP5892783B2 (ja) * 2011-12-21 2016-03-23 キヤノンアネルバ株式会社 基板支持装置及び基板搬送装置
CN113066742B (zh) * 2021-03-18 2023-11-10 浙江芯能光伏科技股份有限公司 一种生产太阳能多晶硅片的自动传送设备
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089851A (ja) * 1999-09-17 2001-04-03 Anelva Corp 基板支持装置および基板搬送機構
US20030019744A1 (en) * 1999-12-22 2003-01-30 Joachim Pokorny Substrate holder
CN1759466A (zh) * 2003-03-12 2006-04-12 应用材料有限公司 衬底支架提升机械装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086870A (en) * 1977-06-30 1978-05-02 International Business Machines Corporation Novel resist spinning head
US5457368A (en) * 1993-03-09 1995-10-10 University Of Utah Research Foundation Mechanical/electrical displacement transducer
JPH07278820A (ja) * 1994-04-13 1995-10-24 Anelva Corp 基板加熱ホルダー支持機構
US5851041A (en) * 1996-06-26 1998-12-22 Ontrak Systems, Inc. Wafer holder with spindle assembly and wafer holder actuator
TW484184B (en) * 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
JP4365920B2 (ja) * 1999-02-02 2009-11-18 キヤノン株式会社 分離方法及び半導体基板の製造方法
JP2001216689A (ja) * 2000-01-31 2001-08-10 Anelva Corp 基板支持機構及び基板支持回転装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089851A (ja) * 1999-09-17 2001-04-03 Anelva Corp 基板支持装置および基板搬送機構
US20030019744A1 (en) * 1999-12-22 2003-01-30 Joachim Pokorny Substrate holder
CN1759466A (zh) * 2003-03-12 2006-04-12 应用材料有限公司 衬底支架提升机械装置

Also Published As

Publication number Publication date
JP2010222700A (ja) 2010-10-07
US8770906B2 (en) 2014-07-08
US20100221089A1 (en) 2010-09-02
JP5457216B2 (ja) 2014-04-02

Similar Documents

Publication Publication Date Title
US11587582B2 (en) Reader noise reduction using spin hall effects
US8551627B2 (en) Magnetic disk and method of manufacturing the same
US20100215992A1 (en) Single-sided perpendicular magnetic recording medium
US20100321826A1 (en) Magnetic recording medium and manufacturing method of the magnetic recording medium
TW550731B (en) Four-bar linkage wafer clamping mechanism
US11785864B2 (en) MTJ device performance by adding stress modulation layer to mtj device structure
US9754618B1 (en) Heat-assisted magnetic recording (HAMR) medium including a split heat-sink structure (SHSS)
CN101901603A (zh) 衬底支承设备、衬底传输设备以及电子装置制造方法
US6529346B2 (en) Magnetic head slider with protrusion on surface facing recording medium
US7872830B2 (en) Magnetic medium stack assembly for a data storage and retrieval system
CN115938404A (zh) 具有高内应力以减小由冲击力引起的盘偏转的磁记录盘和用于与盘一起使用的方法
JP6303167B2 (ja) インライン式成膜装置及びそれを用いた磁気記録媒体の製造方法
US20100108496A1 (en) Sputtering apparatus, thin film formation apparatus, and magnetic recording medium manufacturing method
TW200905000A (en) Sputtering system and method for depositing thin film
US20100006420A1 (en) Inline interlayer heater apparatus
US20100108495A1 (en) Thin film formation apparatus and magnetic recording medium manufacturing method
US8208238B1 (en) Apparatus for orienting soft-underlayer deposition
JP5492453B2 (ja) 磁気記録媒体の製造方法
US9343273B2 (en) Substrate holders for uniform reactive sputtering
JP4961157B2 (ja) 成膜装置及び磁気ディスクの製造方法
JP2004030745A (ja) 磁気転写装置
JP2003217115A (ja) 磁気転写用磁気記録媒体
JP2006127736A (ja) 垂直磁気記録媒体および垂直磁気記録装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20101201