JP2010214939A - 銅張積層板及びその製造方法 - Google Patents
銅張積層板及びその製造方法 Download PDFInfo
- Publication number
- JP2010214939A JP2010214939A JP2009162236A JP2009162236A JP2010214939A JP 2010214939 A JP2010214939 A JP 2010214939A JP 2009162236 A JP2009162236 A JP 2009162236A JP 2009162236 A JP2009162236 A JP 2009162236A JP 2010214939 A JP2010214939 A JP 2010214939A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- copper
- clad laminate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
【解決手段】ガラス繊維104に第1樹脂102aが含浸されたプリプレグ106、前記プレプレグ106の両側面に形成された第2樹脂102B、及び前記プリプレグ106及び前記第2樹脂102bの一面または両面に形成された銅箔層108a、108bを含む。
【選択図】図3
Description
Claims (8)
- ガラス繊維に第1樹脂が含浸されたプリプレグ;
前記プレプレグの両側面に形成された第2樹脂;及び
前記プリプレグ及び前記第2樹脂の一面または両面に形成された銅箔層;
を含むことを特徴とする銅張積層板。 - 前記プリプレグには有機フィラーまたは無機フィラーが含浸されていることを特徴とする、請求項1に記載の銅張積層板。
- 前記第1樹脂及び前記第2樹脂はエポキシ樹脂、ポリ樹脂、またはビスマレイミド樹脂であることを特徴とする、請求項1に記載の銅張積層板。
- 前記プレプレグのビア形成領域はガラス繊維を含まない第3樹脂で形成されたことを特徴とする、請求項1に記載の銅張積層板。
- (A)ガラス繊維に第1樹脂が含浸されたプリプレグを準備する段階;
(B)前記プリプレグの一面または両面に前記プリプレグと同じ大きさの中空部を持つ第2樹脂、及び前記プリプレグと前記第2樹脂をカバーする大きさを持つ銅箔層を順に配置する段階;及び
(C)前記プリプレグ、第2樹脂、及び前記銅箔層を加圧して積層する段階;
を含むことを特徴とする、銅張積層板の製造方法。 - 前記プリプレグには有機フィラーまたは無機フィラーが含浸されていることを特徴とする、請求項5に記載の銅張積層板の製造方法。
- 前記第1樹脂及び前記第2樹脂はエポキシ樹脂、ポリ樹脂、またはビスマレイミド樹脂であることを特徴とする、請求項5に記載の銅張積層板の製造方法。
- 前記プレプレグのビア形成領域はガラス繊維を含まない第3樹脂で形成されたことを特徴とする、請求項5に記載の銅張積層板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0021227 | 2009-03-12 | ||
KR1020090021227A KR101077392B1 (ko) | 2009-03-12 | 2009-03-12 | 동박 적층판 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010214939A true JP2010214939A (ja) | 2010-09-30 |
JP4954246B2 JP4954246B2 (ja) | 2012-06-13 |
Family
ID=42974273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009162236A Expired - Fee Related JP4954246B2 (ja) | 2009-03-12 | 2009-07-08 | 銅張積層板及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4954246B2 (ja) |
KR (1) | KR101077392B1 (ja) |
TW (1) | TW201032998A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106604545A (zh) * | 2015-10-16 | 2017-04-26 | 健鼎(无锡)电子有限公司 | 铜箔基板的制作方法 |
EP3162561A4 (en) * | 2014-05-27 | 2018-04-11 | Shengyi Technology Co., Ltd. | Thermoset resin sandwiched pre-preg body, manufacturing method and copper clad plate |
CN109796706A (zh) * | 2019-01-30 | 2019-05-24 | 常州中英科技股份有限公司 | 一种聚多巴胺改性的含氟树脂混合物及其制备的半固化片和覆铜板 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI554175B (zh) * | 2015-10-22 | 2016-10-11 | 健鼎科技股份有限公司 | 銅箔基板的製作方法 |
KR102173113B1 (ko) * | 2017-08-24 | 2020-11-02 | 주식회사 엘지화학 | 금속 박 적층판의 제조 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02172730A (ja) * | 1988-12-26 | 1990-07-04 | Hitachi Chem Co Ltd | 銅張積層板 |
JPH06246871A (ja) * | 1993-03-01 | 1994-09-06 | Sumitomo Chem Co Ltd | エポキシ樹脂銅張り積層板 |
WO2007040125A1 (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Bakelite Co., Ltd. | キャリア付きプリプレグの製造方法、キャリア付きプリプレグ、薄型両面板の製造方法、薄型両面板、及び多層プリント配線板の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001199009A (ja) | 2000-01-21 | 2001-07-24 | Risho Kogyo Co Ltd | 銅張り積層板 |
-
2009
- 2009-03-12 KR KR1020090021227A patent/KR101077392B1/ko not_active IP Right Cessation
- 2009-07-08 JP JP2009162236A patent/JP4954246B2/ja not_active Expired - Fee Related
- 2009-07-09 TW TW098123200A patent/TW201032998A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02172730A (ja) * | 1988-12-26 | 1990-07-04 | Hitachi Chem Co Ltd | 銅張積層板 |
JPH06246871A (ja) * | 1993-03-01 | 1994-09-06 | Sumitomo Chem Co Ltd | エポキシ樹脂銅張り積層板 |
WO2007040125A1 (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Bakelite Co., Ltd. | キャリア付きプリプレグの製造方法、キャリア付きプリプレグ、薄型両面板の製造方法、薄型両面板、及び多層プリント配線板の製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3162561A4 (en) * | 2014-05-27 | 2018-04-11 | Shengyi Technology Co., Ltd. | Thermoset resin sandwiched pre-preg body, manufacturing method and copper clad plate |
CN106604545A (zh) * | 2015-10-16 | 2017-04-26 | 健鼎(无锡)电子有限公司 | 铜箔基板的制作方法 |
CN109796706A (zh) * | 2019-01-30 | 2019-05-24 | 常州中英科技股份有限公司 | 一种聚多巴胺改性的含氟树脂混合物及其制备的半固化片和覆铜板 |
CN109796706B (zh) * | 2019-01-30 | 2021-05-14 | 常州中英科技股份有限公司 | 一种聚多巴胺改性的含氟树脂混合物及其制备的半固化片和覆铜板 |
Also Published As
Publication number | Publication date |
---|---|
KR101077392B1 (ko) | 2011-10-26 |
JP4954246B2 (ja) | 2012-06-13 |
TW201032998A (en) | 2010-09-16 |
KR20100102917A (ko) | 2010-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2002319764A (ja) | 多層プリント配線板 | |
JP2006140502A (ja) | 半導体パッケージ用回路基板及びその製造方法 | |
JP4954246B2 (ja) | 銅張積層板及びその製造方法 | |
KR101794874B1 (ko) | 금속장 적층판, 프린트 배선판, 다층 프린트 배선판 | |
US10674615B2 (en) | Method for manufacturing wiring board | |
KR100843368B1 (ko) | 다층 인쇄회로기판의 제조방법 | |
US20140318834A1 (en) | Wiring board and method for manufacturing the same | |
US20130139382A1 (en) | Printed circuit board having electro component and manufacturing method thereof | |
KR101044105B1 (ko) | 휨 발생 방지를 위한 기판의 제조방법 | |
JP2010034197A (ja) | ビルドアップ基板 | |
JP2013115136A (ja) | 電子部品内蔵基板及びその製造方法 | |
JP2007180211A (ja) | 配線基板製造用コア基板、配線基板の製造方法 | |
KR101167422B1 (ko) | 캐리어 부재 및 이를 이용한 인쇄회로기판의 제조방법 | |
US20140357147A1 (en) | Core of printed circuit board and method of manufacturing the same | |
JP2015173302A (ja) | 印刷回路基板 | |
JP2015076589A (ja) | 積層板 | |
JP2013080823A (ja) | プリント配線板及びその製造方法 | |
JP2010010488A (ja) | 配線基板の製造方法及び配線基板 | |
KR101154605B1 (ko) | 인쇄회로기판 및 그의 제조 방법 | |
JP4276227B2 (ja) | 多層プリント配線板 | |
US20120312591A1 (en) | Printed Circuit Board and Method of Manufacturing the Same | |
KR102172674B1 (ko) | 인쇄회로기판 및 이의 제조 방법 | |
KR101519153B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
JP2016201508A (ja) | 半導体素子内蔵配線板及びその製造方法 | |
JP6386252B2 (ja) | プリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110726 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111026 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120306 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120313 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150323 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |