JP2015173302A - 印刷回路基板 - Google Patents
印刷回路基板 Download PDFInfo
- Publication number
- JP2015173302A JP2015173302A JP2015138493A JP2015138493A JP2015173302A JP 2015173302 A JP2015173302 A JP 2015173302A JP 2015138493 A JP2015138493 A JP 2015138493A JP 2015138493 A JP2015138493 A JP 2015138493A JP 2015173302 A JP2015173302 A JP 2015173302A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- buildup
- insulating layer
- copper foil
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Abstract
Description
図1は、本発明の実施例による銅張積層板を示す例示図である。
図2は、本発明の実施例による印刷回路基板100を示す例示図である。
図4から図15は、本発明の実施例による印刷回路基板の製造方法を示す例示図である。
110 銅張積層板
111 絶縁層
112 第1銅箔層
113 第2銅箔層
114 第1ビアホール
115 第1めっき層
116 第1ビア
117 第1回路層
118 第2回路層
120 第1ビルドアップ基板
121 第1ビルドアップ絶縁層
122 第3銅箔層
123 第2ビアホール
125 第2めっき層
126 第2ビア
127 第1ビルドアップ回路層
128 第1ビルドアップ層
130 第2ビルドアップ基板
131 第2ビルドアップ絶縁層
132 第4銅箔層
133 第3ビアホール
135 第3めっき層
136 第3ビア
137 第2ビルドアップ回路層
138 第2ビルドアップ層
200 印刷回路基板
210 キャリア基板
220 第1エッチングレジスト
230 第2エッチングレジスト
240 第3エッチングレジスト
250 第4エッチングレジスト
311、312、313 従来のビアホールの底面
321、322 本発明のビアホールの底面
Claims (6)
- 一面および他面を備える絶縁層と、
前記絶縁層の一面に形成された第1回路層と、
前記絶縁層の他面に形成された第2回路層と、
前記絶縁層および前記第1回路層に形成され、第1ビルドアップ絶縁層および第1ビルドアップ回路層を備える第1ビルドアップ層と、
前記絶縁層および前記第2回路層に形成され、第2ビルドアップ絶縁層および第2ビルドアップ回路層を備える第2ビルドアップ層と、
前記絶縁層、前記第1ビルドアップ層および前記第2ビルドアップ層のうち少なくとも一つの層に形成されたビアと、を含み、
前記第1回路層、前記第2回路層、前記第1ビルドアップ回路層および前記第2ビルドアップ回路層は、滑らかな面である一面および前記滑らかな面より大きい粗さを有する粗い面である他面を備えており、前記第1回路層、前記第2回路層および前記第1ビルドアップ回路層の粗い面と前記第2ビルドアップ回路層の粗い面とが対向するように形成される、印刷回路基板。 - 前記粗い面の粗さ(Rz)は3.5μm以上である、請求項1に記載の印刷回路基板。
- 前記滑らかな面の粗さ(Rz)は2.0から2.5μm以下である、請求項1に記載の印刷回路基板。
- 前記絶縁層に前記ビアが形成されると、前記ビアの一面は前記第1回路層の粗い面に連結され、他面は前記第2回路層の滑らかな面に連結される、請求項1に記載の印刷回路基板。
- 前記第1ビルドアップ絶縁層に前記ビアが形成されると、前記ビアの一面は前記第1ビルドアップ回路層の粗い面に連結され、他面は前記第1回路層の滑らかな面に連結される、請求項1に記載の印刷回路基板。
- 前記第2ビルドアップ絶縁層に前記ビアが形成されると、前記ビアの一面は前記第2回路層の粗い面に連結され、他面は前記第2ビルドアップ回路層の粗い面に連結される、請求項1に記載の印刷回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130083732A KR101494090B1 (ko) | 2013-07-16 | 2013-07-16 | 동박적층판, 인쇄회로기판 및 그 제조 방법 |
KR10-2013-0083732 | 2013-07-16 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014145132A Division JP2015023288A (ja) | 2013-07-16 | 2014-07-15 | 銅張積層板、印刷回路基板およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015173302A true JP2015173302A (ja) | 2015-10-01 |
Family
ID=52342658
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014145132A Pending JP2015023288A (ja) | 2013-07-16 | 2014-07-15 | 銅張積層板、印刷回路基板およびその製造方法 |
JP2015138493A Pending JP2015173302A (ja) | 2013-07-16 | 2015-07-10 | 印刷回路基板 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014145132A Pending JP2015023288A (ja) | 2013-07-16 | 2014-07-15 | 銅張積層板、印刷回路基板およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9578740B2 (ja) |
JP (2) | JP2015023288A (ja) |
KR (1) | KR101494090B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020161727A (ja) * | 2019-03-27 | 2020-10-01 | イビデン株式会社 | 配線基板 |
US11211316B1 (en) * | 2020-09-23 | 2021-12-28 | Advanced Semiconductor Engineering, Inc. | Wiring structure and method for manufacturing the same |
CN115066985A (zh) * | 2020-11-18 | 2022-09-16 | 株式会社藤仓 | 布线基板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0874090A (ja) * | 1994-09-09 | 1996-03-19 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔 |
JP2007165680A (ja) * | 2005-12-15 | 2007-06-28 | Toppan Printing Co Ltd | 積層用配線基板、多層配線基板およびそれらの製造方法、ならびに半導体装置 |
JP2007216662A (ja) * | 2006-01-19 | 2007-08-30 | Matsushita Electric Works Ltd | 両面銅張積層板 |
JP2010080702A (ja) * | 2008-09-26 | 2010-04-08 | Hitachi Chem Co Ltd | 多層プリント配線板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6596384B1 (en) * | 2002-04-09 | 2003-07-22 | International Business Machines Corporation | Selectively roughening conductors for high frequency printed wiring boards |
KR100467825B1 (ko) * | 2002-12-12 | 2005-01-25 | 삼성전기주식회사 | 스택형 비아홀을 갖는 빌드업 인쇄회로기판 및 그 제조 방법 |
JP2004259899A (ja) * | 2003-02-25 | 2004-09-16 | Matsushita Electric Works Ltd | プリント配線板用樹脂組成物、プリント配線板及び多層プリント配線板 |
JP3979391B2 (ja) * | 2004-01-26 | 2007-09-19 | 松下電器産業株式会社 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
JP2007311466A (ja) * | 2006-05-17 | 2007-11-29 | Matsushita Electric Ind Co Ltd | 多層プリント配線基板及びその製造方法 |
KR20100043547A (ko) | 2008-10-20 | 2010-04-29 | 삼성전기주식회사 | 필드 비아 패드를 갖는 코어리스 기판 및 그 제조방법 |
-
2013
- 2013-07-16 KR KR20130083732A patent/KR101494090B1/ko active IP Right Grant
-
2014
- 2014-07-15 JP JP2014145132A patent/JP2015023288A/ja active Pending
- 2014-07-16 US US14/333,079 patent/US9578740B2/en active Active
-
2015
- 2015-07-10 JP JP2015138493A patent/JP2015173302A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0874090A (ja) * | 1994-09-09 | 1996-03-19 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔 |
JP2007165680A (ja) * | 2005-12-15 | 2007-06-28 | Toppan Printing Co Ltd | 積層用配線基板、多層配線基板およびそれらの製造方法、ならびに半導体装置 |
JP2007216662A (ja) * | 2006-01-19 | 2007-08-30 | Matsushita Electric Works Ltd | 両面銅張積層板 |
JP2010080702A (ja) * | 2008-09-26 | 2010-04-08 | Hitachi Chem Co Ltd | 多層プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
JP2015023288A (ja) | 2015-02-02 |
US9578740B2 (en) | 2017-02-21 |
US20150021084A1 (en) | 2015-01-22 |
KR20150009351A (ko) | 2015-01-26 |
KR101494090B1 (ko) | 2015-02-16 |
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