JP2010192052A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2010192052A JP2010192052A JP2009036575A JP2009036575A JP2010192052A JP 2010192052 A JP2010192052 A JP 2010192052A JP 2009036575 A JP2009036575 A JP 2009036575A JP 2009036575 A JP2009036575 A JP 2009036575A JP 2010192052 A JP2010192052 A JP 2010192052A
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- memory array
- memory
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 72
- 238000003491 array Methods 0.000 claims abstract description 36
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- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000009849 deactivation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 31
- 230000000295 complement effect Effects 0.000 description 21
- 102100040862 Dual specificity protein kinase CLK1 Human genes 0.000 description 10
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- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 108091034120 Epstein–Barr virus-encoded small RNA Proteins 0.000 description 1
- 102100037224 Noncompact myelin-associated protein Human genes 0.000 description 1
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- 230000006870 function Effects 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- 230000009467 reduction Effects 0.000 description 1
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Images
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- Static Random-Access Memory (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Dram (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009036575A JP2010192052A (ja) | 2009-02-19 | 2009-02-19 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009036575A JP2010192052A (ja) | 2009-02-19 | 2009-02-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010192052A true JP2010192052A (ja) | 2010-09-02 |
| JP2010192052A5 JP2010192052A5 (enExample) | 2012-02-02 |
Family
ID=42817932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009036575A Pending JP2010192052A (ja) | 2009-02-19 | 2009-02-19 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010192052A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113060A (zh) * | 2020-01-09 | 2021-07-13 | 华邦电子股份有限公司 | 存储装置中的阵列边缘中继器 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5965995A (ja) * | 1982-10-05 | 1984-04-14 | Toshiba Corp | 半導体装置 |
| JPH11111944A (ja) * | 1997-09-30 | 1999-04-23 | Hitachi Ltd | 半導体集積回路装置 |
| JPH11167792A (ja) * | 1997-09-30 | 1999-06-22 | Siemens Ag | 混合ローカルビットラインを備えた階層的ビットライン構造を有する半導体メモリ |
| JP2003115550A (ja) * | 2001-10-05 | 2003-04-18 | Nec Microsystems Ltd | 半導体記憶装置 |
| JP2004030839A (ja) * | 2002-06-27 | 2004-01-29 | Toshiba Corp | バースト転送メモリ |
| WO2008072354A1 (ja) * | 2006-12-15 | 2008-06-19 | Fujitsu Microelectronics Limited | コンパイルドメモリ、asicチップおよびコンパイルドメモリのレイアウト方法 |
-
2009
- 2009-02-19 JP JP2009036575A patent/JP2010192052A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5965995A (ja) * | 1982-10-05 | 1984-04-14 | Toshiba Corp | 半導体装置 |
| JPH11111944A (ja) * | 1997-09-30 | 1999-04-23 | Hitachi Ltd | 半導体集積回路装置 |
| JPH11167792A (ja) * | 1997-09-30 | 1999-06-22 | Siemens Ag | 混合ローカルビットラインを備えた階層的ビットライン構造を有する半導体メモリ |
| JP2003115550A (ja) * | 2001-10-05 | 2003-04-18 | Nec Microsystems Ltd | 半導体記憶装置 |
| JP2004030839A (ja) * | 2002-06-27 | 2004-01-29 | Toshiba Corp | バースト転送メモリ |
| WO2008072354A1 (ja) * | 2006-12-15 | 2008-06-19 | Fujitsu Microelectronics Limited | コンパイルドメモリ、asicチップおよびコンパイルドメモリのレイアウト方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113060A (zh) * | 2020-01-09 | 2021-07-13 | 华邦电子股份有限公司 | 存储装置中的阵列边缘中继器 |
| CN113113060B (zh) * | 2020-01-09 | 2024-04-12 | 华邦电子股份有限公司 | 存储装置中的阵列边缘中继器 |
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