JP2010184500A5 - - Google Patents
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- Publication number
- JP2010184500A5 JP2010184500A5 JP2010102354A JP2010102354A JP2010184500A5 JP 2010184500 A5 JP2010184500 A5 JP 2010184500A5 JP 2010102354 A JP2010102354 A JP 2010102354A JP 2010102354 A JP2010102354 A JP 2010102354A JP 2010184500 A5 JP2010184500 A5 JP 2010184500A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding film
- base material
- film
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 30
- 239000011344 liquid material Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- -1 polydimethylsiloxane Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 7
- 238000010438 heat treatment Methods 0.000 claims 3
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000004381 surface treatment Methods 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010102354A JP5434772B2 (ja) | 2010-04-27 | 2010-04-27 | 接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010102354A JP5434772B2 (ja) | 2010-04-27 | 2010-04-27 | 接合方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007307620A Division JP2009132749A (ja) | 2007-11-28 | 2007-11-28 | 接合方法および接合体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010184500A JP2010184500A (ja) | 2010-08-26 |
| JP2010184500A5 true JP2010184500A5 (enExample) | 2011-01-20 |
| JP5434772B2 JP5434772B2 (ja) | 2014-03-05 |
Family
ID=42765432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010102354A Expired - Fee Related JP5434772B2 (ja) | 2010-04-27 | 2010-04-27 | 接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5434772B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102287811B1 (ko) * | 2014-10-31 | 2021-08-09 | 삼성전자주식회사 | 2개 표면을 결합시키는 방법 및 그에 의하여 제조된 구조체, 및 상기 구조체를 포함하는 미세유동 장치 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09208829A (ja) * | 1996-01-31 | 1997-08-12 | Toray Dow Corning Silicone Co Ltd | 硬化性オルガノポリシロキサン組成物および該組成物を使用して基材と被着体を接着させる方法 |
| JPH09286971A (ja) * | 1996-04-19 | 1997-11-04 | Toray Dow Corning Silicone Co Ltd | シリコーン系ダイボンディング剤、半導体装置の製造方法および半導体装置 |
| US6057405A (en) * | 1996-05-28 | 2000-05-02 | General Electric Company | Silicone contact adhesive compositions |
| JPH11158437A (ja) * | 1997-11-28 | 1999-06-15 | Sekisui Chem Co Ltd | 接着方法 |
| JP2000006561A (ja) * | 1998-06-26 | 2000-01-11 | Konica Corp | Ｉｃカードの製造方法 |
| JP2000235108A (ja) * | 1999-02-15 | 2000-08-29 | Olympus Optical Co Ltd | 光学素子 |
| JP2001019936A (ja) * | 1999-07-08 | 2001-01-23 | Dow Corning Toray Silicone Co Ltd | 接着剤、および半導体装置 |
| JP2001194598A (ja) * | 2000-01-14 | 2001-07-19 | Seiko Epson Corp | 微細構造体、映像デバイスおよびそれらの製造方法 |
| JP2003066299A (ja) * | 2001-08-24 | 2003-03-05 | Canon Inc | 精密部材の固着方法および精密部材保持構造 |
-
2010
- 2010-04-27 JP JP2010102354A patent/JP5434772B2/ja not_active Expired - Fee Related
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