JP2009143992A5 - - Google Patents
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- Publication number
- JP2009143992A5 JP2009143992A5 JP2007320245A JP2007320245A JP2009143992A5 JP 2009143992 A5 JP2009143992 A5 JP 2009143992A5 JP 2007320245 A JP2007320245 A JP 2007320245A JP 2007320245 A JP2007320245 A JP 2007320245A JP 2009143992 A5 JP2009143992 A5 JP 2009143992A5
- Authority
- JP
- Japan
- Prior art keywords
- base material
- bonding
- bonding film
- joining
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000000463 material Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 32
- 239000011344 liquid material Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 238000004381 surface treatment Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 230000000717 retained effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 3
- 125000006850 spacer group Chemical group 0.000 claims 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- -1 polydimethylsiloxane Polymers 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007320245A JP2009143992A (ja) | 2007-12-11 | 2007-12-11 | 接合方法および接合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007320245A JP2009143992A (ja) | 2007-12-11 | 2007-12-11 | 接合方法および接合体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009143992A JP2009143992A (ja) | 2009-07-02 |
| JP2009143992A5 true JP2009143992A5 (enExample) | 2011-01-27 |
Family
ID=40914991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007320245A Withdrawn JP2009143992A (ja) | 2007-12-11 | 2007-12-11 | 接合方法および接合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009143992A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5645068B2 (ja) * | 2009-12-09 | 2014-12-24 | 三菱レイヨン株式会社 | 透明樹脂板平面の積層接着方法 |
| JP5516954B2 (ja) * | 2010-01-19 | 2014-06-11 | 国立大学法人東京工業大学 | 微細構造を有する基板の接合方法および当該接合方法を利用したマイクロ流体デバイスの製造方法 |
| US8956494B2 (en) | 2010-01-19 | 2015-02-17 | Tokyo Institute Of Technology | Method of adhering hard silicone resin, method of adhering substrate having fine structure, and preparation method of micro fluidic device utilizing adhesion method |
-
2007
- 2007-12-11 JP JP2007320245A patent/JP2009143992A/ja not_active Withdrawn
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