JP2010171380A5 - - Google Patents

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Publication number
JP2010171380A5
JP2010171380A5 JP2009240077A JP2009240077A JP2010171380A5 JP 2010171380 A5 JP2010171380 A5 JP 2010171380A5 JP 2009240077 A JP2009240077 A JP 2009240077A JP 2009240077 A JP2009240077 A JP 2009240077A JP 2010171380 A5 JP2010171380 A5 JP 2010171380A5
Authority
JP
Japan
Prior art keywords
package
mounting
pad
notch
notch recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009240077A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010171380A (ja
JP5269741B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009240077A priority Critical patent/JP5269741B2/ja
Priority claimed from JP2009240077A external-priority patent/JP5269741B2/ja
Priority to US12/643,391 priority patent/US8564077B2/en
Publication of JP2010171380A publication Critical patent/JP2010171380A/ja
Publication of JP2010171380A5 publication Critical patent/JP2010171380A5/ja
Application granted granted Critical
Publication of JP5269741B2 publication Critical patent/JP5269741B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009240077A 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置 Active JP5269741B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009240077A JP5269741B2 (ja) 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置
US12/643,391 US8564077B2 (en) 2008-12-24 2009-12-21 Package for electronic component, manufacturing method thereof and sensing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008328343 2008-12-24
JP2008328343 2008-12-24
JP2009240077A JP5269741B2 (ja) 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置

Publications (3)

Publication Number Publication Date
JP2010171380A JP2010171380A (ja) 2010-08-05
JP2010171380A5 true JP2010171380A5 (enExample) 2012-08-16
JP5269741B2 JP5269741B2 (ja) 2013-08-21

Family

ID=42264794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009240077A Active JP5269741B2 (ja) 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置

Country Status (2)

Country Link
US (1) US8564077B2 (enExample)
JP (1) JP5269741B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4342174B2 (ja) * 2002-12-27 2009-10-14 新光電気工業株式会社 電子デバイス及びその製造方法
US8435802B2 (en) 2006-05-22 2013-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Conductor layout technique to reduce stress-induced void formations
US20120126793A1 (en) * 2010-11-18 2012-05-24 Elster Solutions, Llc Polyphase meter with full service disconnect switch
US8987840B2 (en) * 2011-02-01 2015-03-24 Honeywell International Inc. Edge-mounted sensor
WO2017163815A1 (ja) * 2016-03-22 2017-09-28 パナソニックＩｐマネジメント株式会社 センサ
CN107768323B (zh) * 2017-11-24 2023-12-05 安徽芯动联科微系统股份有限公司 抗高过载电子器件封装管壳

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145359A (en) * 1979-04-27 1980-11-12 Fujitsu Ltd Mounting structure of semiconductor package
JPH0951199A (ja) * 1995-08-08 1997-02-18 Hitachi Ltd 半導体装置
EP0867939A3 (en) * 1997-03-26 1999-08-18 Matsushita Electronics Corporation Wiring substrate for semiconductor device with externally wired leads
JPH10321874A (ja) * 1997-05-21 1998-12-04 Nippon Seiki Co Ltd 半導体式圧力センサ及びその製造方法
US6235551B1 (en) * 1997-12-31 2001-05-22 Micron Technology, Inc. Semiconductor device including edge bond pads and methods
JP2005044966A (ja) * 2003-07-28 2005-02-17 Toshiba Corp 光半導体モジュールと光半導体装置
JP2007132687A (ja) * 2005-11-08 2007-05-31 Sensata Technologies Japan Ltd センサ用パッケージおよびこれを用いた検出装置

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