JP2014022493A5 - - Google Patents

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Publication number
JP2014022493A5
JP2014022493A5 JP2012158497A JP2012158497A JP2014022493A5 JP 2014022493 A5 JP2014022493 A5 JP 2014022493A5 JP 2012158497 A JP2012158497 A JP 2012158497A JP 2012158497 A JP2012158497 A JP 2012158497A JP 2014022493 A5 JP2014022493 A5 JP 2014022493A5
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JP
Japan
Prior art keywords
module housing
joining member
module
electronic component
housing portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012158497A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014022493A (ja
JP5728437B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012158497A priority Critical patent/JP5728437B2/ja
Priority claimed from JP2012158497A external-priority patent/JP5728437B2/ja
Priority to US13/941,630 priority patent/US9615458B2/en
Priority to EP13176742.8A priority patent/EP2688375B1/en
Priority to CN201310297060.XA priority patent/CN103715275B/zh
Publication of JP2014022493A publication Critical patent/JP2014022493A/ja
Publication of JP2014022493A5 publication Critical patent/JP2014022493A5/ja
Application granted granted Critical
Publication of JP5728437B2 publication Critical patent/JP5728437B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012158497A 2012-07-17 2012-07-17 物理量測定装置及び物理量測定装置の製造方法 Expired - Fee Related JP5728437B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012158497A JP5728437B2 (ja) 2012-07-17 2012-07-17 物理量測定装置及び物理量測定装置の製造方法
US13/941,630 US9615458B2 (en) 2012-07-17 2013-07-15 Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument
EP13176742.8A EP2688375B1 (en) 2012-07-17 2013-07-16 Physical-quantity measuring instrument and method of making the same
CN201310297060.XA CN103715275B (zh) 2012-07-17 2013-07-16 立体电路零件、立体电路零件的制造方法及物理量测量装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012158497A JP5728437B2 (ja) 2012-07-17 2012-07-17 物理量測定装置及び物理量測定装置の製造方法

Publications (3)

Publication Number Publication Date
JP2014022493A JP2014022493A (ja) 2014-02-03
JP2014022493A5 true JP2014022493A5 (enExample) 2014-07-24
JP5728437B2 JP5728437B2 (ja) 2015-06-03

Family

ID=48803403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012158497A Expired - Fee Related JP5728437B2 (ja) 2012-07-17 2012-07-17 物理量測定装置及び物理量測定装置の製造方法

Country Status (4)

Country Link
US (1) US9615458B2 (enExample)
EP (1) EP2688375B1 (enExample)
JP (1) JP5728437B2 (enExample)
CN (1) CN103715275B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100707044B1 (ko) * 1999-05-27 2007-04-13 나노넥서스, 인코포레이티드 집적회로 웨이퍼 프로브카드 조립체의 구조물 및 그 제조방법
DE102014216158A1 (de) * 2014-02-17 2015-08-20 Robert Bosch Gmbh Anschlussvorrichtung für einen Drucksensor, Drucksensor und Verfahren zur Herstellung einer Anschlussvorrichtung
WO2019158339A1 (de) * 2018-02-13 2019-08-22 Kistler Holding Ag Drucksensor
CN112414615B (zh) * 2020-11-10 2022-06-24 宁波中车时代传感技术有限公司 一种耐超高电压溅射薄膜压力变送器及制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06209151A (ja) * 1993-01-12 1994-07-26 Sumitomo Bakelite Co Ltd 印刷配線板の製造方法
US5495089A (en) 1993-06-04 1996-02-27 Digital Equipment Corporation Laser soldering surface mount components of a printed circuit board
JP2541487B2 (ja) * 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ
JP3211074B2 (ja) 1996-04-23 2001-09-25 松下電工株式会社 赤外線検出器
JP3457881B2 (ja) * 1998-03-16 2003-10-20 京セラ株式会社 印刷回路基板の接続装置
JP2000151071A (ja) * 1998-11-10 2000-05-30 Matsushita Electric Ind Co Ltd リードフレームインサートモールド基板およびその製造方法
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
CN100378969C (zh) * 2003-06-24 2008-04-02 日本特殊陶业株式会社 中间衬底及具有半导体元件、中间衬底和衬底的结构体
US7302855B2 (en) * 2004-10-28 2007-12-04 Denso Corporation Pressure detection device
US7972650B1 (en) 2005-07-13 2011-07-05 Nscrypt, Inc. Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections
JP2007081086A (ja) * 2005-09-14 2007-03-29 Seiko Instruments Inc メタルマスク及び電子部品の実装方法
DE102007031980A1 (de) * 2007-07-10 2009-01-15 Robert Bosch Gmbh Anschlusseinheit für eine Druckmesszelle
US8002592B2 (en) * 2008-12-17 2011-08-23 Hubbell Incorporated Data collecting connection

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