CN103715275B - 立体电路零件、立体电路零件的制造方法及物理量测量装置 - Google Patents

立体电路零件、立体电路零件的制造方法及物理量测量装置 Download PDF

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Publication number
CN103715275B
CN103715275B CN201310297060.XA CN201310297060A CN103715275B CN 103715275 B CN103715275 B CN 103715275B CN 201310297060 A CN201310297060 A CN 201310297060A CN 103715275 B CN103715275 B CN 103715275B
Authority
CN
China
Prior art keywords
mentioned
conductive pattern
electronic component
block
stereo circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310297060.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN103715275A (zh
Inventor
山岸信贵
山下直树
今井敦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAGANO METER CO Ltd
Original Assignee
NAGANO METER CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAGANO METER CO Ltd filed Critical NAGANO METER CO Ltd
Publication of CN103715275A publication Critical patent/CN103715275A/zh
Application granted granted Critical
Publication of CN103715275B publication Critical patent/CN103715275B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CN201310297060.XA 2012-07-17 2013-07-16 立体电路零件、立体电路零件的制造方法及物理量测量装置 Expired - Fee Related CN103715275B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012158497A JP5728437B2 (ja) 2012-07-17 2012-07-17 物理量測定装置及び物理量測定装置の製造方法
JP2012-158497 2012-07-17

Publications (2)

Publication Number Publication Date
CN103715275A CN103715275A (zh) 2014-04-09
CN103715275B true CN103715275B (zh) 2017-05-24

Family

ID=48803403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310297060.XA Expired - Fee Related CN103715275B (zh) 2012-07-17 2013-07-16 立体电路零件、立体电路零件的制造方法及物理量测量装置

Country Status (4)

Country Link
US (1) US9615458B2 (enExample)
EP (1) EP2688375B1 (enExample)
JP (1) JP5728437B2 (enExample)
CN (1) CN103715275B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU5156300A (en) * 1999-05-27 2000-12-18 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies
DE102014216158A1 (de) * 2014-02-17 2015-08-20 Robert Bosch Gmbh Anschlussvorrichtung für einen Drucksensor, Drucksensor und Verfahren zur Herstellung einer Anschlussvorrichtung
US20210031425A1 (en) * 2018-02-13 2021-02-04 Kistler Holding Ag Pressure sensor
CN112414615B (zh) * 2020-11-10 2022-06-24 宁波中车时代传感技术有限公司 一种耐超高电压溅射薄膜压力变送器及制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5570274A (en) * 1993-11-29 1996-10-29 Nec Corporation High density multichip module packaging structure
CN101688814A (zh) * 2007-07-10 2010-03-31 罗伯特·博世有限公司 用于测压计的连接单元

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06209151A (ja) * 1993-01-12 1994-07-26 Sumitomo Bakelite Co Ltd 印刷配線板の製造方法
US5495089A (en) 1993-06-04 1996-02-27 Digital Equipment Corporation Laser soldering surface mount components of a printed circuit board
JP3211074B2 (ja) 1996-04-23 2001-09-25 松下電工株式会社 赤外線検出器
JP3457881B2 (ja) * 1998-03-16 2003-10-20 京セラ株式会社 印刷回路基板の接続装置
JP2000151071A (ja) * 1998-11-10 2000-05-30 Matsushita Electric Ind Co Ltd リードフレームインサートモールド基板およびその製造方法
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
US7317165B2 (en) * 2003-06-24 2008-01-08 Ngk Spark Plug Co., Ltd. Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate
US7302855B2 (en) * 2004-10-28 2007-12-04 Denso Corporation Pressure detection device
US7972650B1 (en) 2005-07-13 2011-07-05 Nscrypt, Inc. Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections
JP2007081086A (ja) * 2005-09-14 2007-03-29 Seiko Instruments Inc メタルマスク及び電子部品の実装方法
US8002592B2 (en) * 2008-12-17 2011-08-23 Hubbell Incorporated Data collecting connection

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5570274A (en) * 1993-11-29 1996-10-29 Nec Corporation High density multichip module packaging structure
CN101688814A (zh) * 2007-07-10 2010-03-31 罗伯特·博世有限公司 用于测压计的连接单元

Also Published As

Publication number Publication date
EP2688375B1 (en) 2016-03-23
US20140022735A1 (en) 2014-01-23
EP2688375A1 (en) 2014-01-22
CN103715275A (zh) 2014-04-09
US9615458B2 (en) 2017-04-04
JP2014022493A (ja) 2014-02-03
JP5728437B2 (ja) 2015-06-03

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