JP2010141638A - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
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- JP2010141638A JP2010141638A JP2008316452A JP2008316452A JP2010141638A JP 2010141638 A JP2010141638 A JP 2010141638A JP 2008316452 A JP2008316452 A JP 2008316452A JP 2008316452 A JP2008316452 A JP 2008316452A JP 2010141638 A JP2010141638 A JP 2010141638A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 58
- 238000009792 diffusion process Methods 0.000 claims abstract description 76
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Abstract
【解決手段】縦2画素×横2画素で、フローティングディフュージョン領域の4方を転送トランジスタで囲む構成とする。また、それらの画素で、増幅トランジスタ、リセットトランジスタ、フローティングディフュージョンを共有する。また、これらの4画素を縦に配置し、基本構成単位を8画素とする固体撮像装置を構成し、リセットトランジスタRSTのドレイン電極と増幅トランジスタAMPのドレイン電極を別々にもうける構成とする。本発明はCMOSを用いた撮像素子に適用できる。
【選択図】図2
Description
Claims (5)
- 縦2画素×横2画素で構成される4画素の中心に、フローティングディフュージョン領域を設け、
前記フローティングディフュージョンの4方向に、前記画素をそれぞれ構成する転送トランジスタを配置することで、前記フローティングディフュージョンを前記転送トランジスタで囲み、
前記フローティングディフュージョン、増幅トランジスタ、リセットトランジスタを前記4画素で共有し、
前記4画素を縦に配置した8画素を基本構成単位とする
撮像装置。 - リセットトランジスタのドレイン電極と、前記増幅トランジスタのドレイン電極は、別々に配置される
請求項1に記載の撮像装置。 - 前記リセットトランジスタのドレイン電極にパルスを加え、増幅トランジスタのドレイン電極には定電位を加える
請求項1に記載の撮像装置。 - リセットトランジスタのドレイン電極のHigh電位が、増幅トランジスタのドレイン電位より高い
請求項1に記載の撮像装置。 - 画素からの信号出力線を2列で接合する
請求項1に記載の撮像装置。
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008316452A JP5012782B2 (ja) | 2008-12-12 | 2008-12-12 | 撮像装置 |
TW98134157A TWI433307B (zh) | 2008-10-22 | 2009-10-08 | 固態影像感測器、其驅動方法、成像裝置及電子器件 |
EP20110006885 EP2393117B1 (en) | 2008-10-22 | 2009-10-19 | Solid state image sensor, imaging apparatus, and electronic device |
EP13000767.7A EP2595191B1 (en) | 2008-10-22 | 2009-10-19 | Solid state image sensor, method for driving a solid state image sensor, imaging apparatus, and electronic device |
EP09013174.9A EP2180514B1 (en) | 2008-10-22 | 2009-10-19 | Solid state image sensor, method for driving a solid state image sensor and imaging apparatus |
KR20090099594A KR20100044708A (ko) | 2008-10-22 | 2009-10-20 | 고체 촬상 센서, 고체 촬상 센서의 구동 방법, 촬상 장치 및 전자 기기 |
US12/603,059 US8570412B2 (en) | 2008-10-22 | 2009-10-21 | Solid state image sensor, method for driving a solid state image sensor, imaging apparatus, and electronic device |
CN2009102065832A CN101729805B (zh) | 2008-10-22 | 2009-10-22 | 固态图像传感器及其驱动方法、成像设备和电子装置 |
US14/031,317 US9247172B2 (en) | 2008-10-22 | 2013-09-19 | Solid state image sensor, method for driving a solid state image sensor, imaging apparatus, and electronic device |
US14/957,278 US9781371B2 (en) | 2008-10-22 | 2015-12-02 | Solid state image sensor, method for driving a solid state image sensor, imaging apparatus, and electronic device |
KR1020160021813A KR20160030139A (ko) | 2008-10-22 | 2016-02-24 | 고체 촬상 센서, 고체 촬상 센서의 구동 방법, 촬상 장치 및 전자 기기 |
KR1020170054158A KR101836039B1 (ko) | 2008-10-22 | 2017-04-27 | 고체 촬상 센서, 고체 촬상 센서의 구동 방법, 촬상 장치 및 전자 기기 |
US15/690,572 US10136092B2 (en) | 2008-10-22 | 2017-08-30 | Solid state image sensor, method for driving a solid state image sensor, imaging apparatus, and electronic device |
Applications Claiming Priority (1)
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JP2008316452A JP5012782B2 (ja) | 2008-12-12 | 2008-12-12 | 撮像装置 |
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JP2010141638A true JP2010141638A (ja) | 2010-06-24 |
JP5012782B2 JP5012782B2 (ja) | 2012-08-29 |
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JP2008316452A Expired - Fee Related JP5012782B2 (ja) | 2008-10-22 | 2008-12-12 | 撮像装置 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012186540A (ja) * | 2011-03-03 | 2012-09-27 | Toshiba Corp | 固体撮像装置 |
US8785982B2 (en) | 2011-11-15 | 2014-07-22 | Samsung Electronics Co., Ltd. | Pixel for depth sensor and image sensor including the pixel |
US9319646B2 (en) | 2013-06-26 | 2016-04-19 | Sony Corporation | Solid state imaging device having a shared pixel structure and electronic apparatus |
JP2020047942A (ja) * | 2010-08-27 | 2020-03-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2021063822A (ja) * | 2012-03-09 | 2021-04-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2021121798A (ja) * | 2010-10-07 | 2021-08-26 | 株式会社半導体エネルギー研究所 | 撮像装置、表示装置、電子機器 |
JP2022000665A (ja) * | 2012-03-21 | 2022-01-04 | 株式会社半導体エネルギー研究所 | 装置 |
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JPH11112018A (ja) * | 1997-10-06 | 1999-04-23 | Canon Inc | 固体撮像装置と信号検出装置と信号蓄積装置 |
JPH11331713A (ja) * | 1998-05-20 | 1999-11-30 | Canon Inc | 撮像装置及びそれを用いた撮像システム |
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JP2004215048A (ja) * | 2003-01-07 | 2004-07-29 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
JP2006222427A (ja) * | 2005-02-07 | 2006-08-24 | Samsung Electronics Co Ltd | 共有構造相補性金属酸化膜半導体センサアレイのレイアウト |
JP2007123765A (ja) * | 2005-10-31 | 2007-05-17 | Sharp Corp | 増幅型固体撮像装置 |
JP2007180336A (ja) * | 2005-12-28 | 2007-07-12 | Fujitsu Ltd | 半導体撮像装置 |
JP2008294218A (ja) * | 2007-05-24 | 2008-12-04 | Sony Corp | 固体撮像素子とその製造方法及び撮像装置 |
JP2009135319A (ja) * | 2007-11-30 | 2009-06-18 | Sony Corp | 固体撮像装置及びカメラ |
-
2008
- 2008-12-12 JP JP2008316452A patent/JP5012782B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11112018A (ja) * | 1997-10-06 | 1999-04-23 | Canon Inc | 固体撮像装置と信号検出装置と信号蓄積装置 |
JPH11331713A (ja) * | 1998-05-20 | 1999-11-30 | Canon Inc | 撮像装置及びそれを用いた撮像システム |
JP2000232216A (ja) * | 1998-12-31 | 2000-08-22 | Eastman Kodak Co | 配線されたフローティングディフュージョンと共通増幅器のあるアクティブピクセルセンサ |
JP2004215048A (ja) * | 2003-01-07 | 2004-07-29 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
JP2006222427A (ja) * | 2005-02-07 | 2006-08-24 | Samsung Electronics Co Ltd | 共有構造相補性金属酸化膜半導体センサアレイのレイアウト |
JP2007123765A (ja) * | 2005-10-31 | 2007-05-17 | Sharp Corp | 増幅型固体撮像装置 |
JP2007180336A (ja) * | 2005-12-28 | 2007-07-12 | Fujitsu Ltd | 半導体撮像装置 |
JP2008294218A (ja) * | 2007-05-24 | 2008-12-04 | Sony Corp | 固体撮像素子とその製造方法及び撮像装置 |
JP2009135319A (ja) * | 2007-11-30 | 2009-06-18 | Sony Corp | 固体撮像装置及びカメラ |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020047942A (ja) * | 2010-08-27 | 2020-03-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2021121798A (ja) * | 2010-10-07 | 2021-08-26 | 株式会社半導体エネルギー研究所 | 撮像装置、表示装置、電子機器 |
JP2022008626A (ja) * | 2010-10-07 | 2022-01-13 | 株式会社半導体エネルギー研究所 | 撮像装置、表示装置、電子機器 |
JP7016986B2 (ja) | 2010-10-07 | 2022-02-07 | 株式会社半導体エネルギー研究所 | 撮像装置、表示装置、電子機器 |
JP2012186540A (ja) * | 2011-03-03 | 2012-09-27 | Toshiba Corp | 固体撮像装置 |
US8760546B2 (en) | 2011-03-03 | 2014-06-24 | Kabushiki Kaisha Toshiba | Solid state imaging apparatus with a shared drain diffusion layer by adjacent cells |
USRE46660E1 (en) | 2011-03-03 | 2018-01-02 | Kabushiki Kaisha Toshiba | Solid state imaging apparatus with a shared drain diffusion layer by adjacent cells |
US8785982B2 (en) | 2011-11-15 | 2014-07-22 | Samsung Electronics Co., Ltd. | Pixel for depth sensor and image sensor including the pixel |
JP2021063822A (ja) * | 2012-03-09 | 2021-04-22 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2022000665A (ja) * | 2012-03-21 | 2022-01-04 | 株式会社半導体エネルギー研究所 | 装置 |
JP6999062B2 (ja) | 2012-03-21 | 2022-01-18 | 株式会社半導体エネルギー研究所 | 装置 |
US9319646B2 (en) | 2013-06-26 | 2016-04-19 | Sony Corporation | Solid state imaging device having a shared pixel structure and electronic apparatus |
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