JP2010117346A5 - - Google Patents

Download PDF

Info

Publication number
JP2010117346A5
JP2010117346A5 JP2009206599A JP2009206599A JP2010117346A5 JP 2010117346 A5 JP2010117346 A5 JP 2010117346A5 JP 2009206599 A JP2009206599 A JP 2009206599A JP 2009206599 A JP2009206599 A JP 2009206599A JP 2010117346 A5 JP2010117346 A5 JP 2010117346A5
Authority
JP
Japan
Prior art keywords
another
sensor device
substrate
joining
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009206599A
Other languages
English (en)
Japanese (ja)
Other versions
JP5713547B2 (ja
JP2010117346A (ja
Filing date
Publication date
Priority claimed from DE102008041943A external-priority patent/DE102008041943A1/de
Application filed filed Critical
Publication of JP2010117346A publication Critical patent/JP2010117346A/ja
Publication of JP2010117346A5 publication Critical patent/JP2010117346A5/ja
Application granted granted Critical
Publication of JP5713547B2 publication Critical patent/JP5713547B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009206599A 2008-09-10 2009-09-08 センサ装置及びセンサ装置を製造するための方法 Active JP5713547B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008041943.5 2008-09-10
DE102008041943A DE102008041943A1 (de) 2008-09-10 2008-09-10 Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung

Publications (3)

Publication Number Publication Date
JP2010117346A JP2010117346A (ja) 2010-05-27
JP2010117346A5 true JP2010117346A5 (enExample) 2012-10-25
JP5713547B2 JP5713547B2 (ja) 2015-05-07

Family

ID=41650625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009206599A Active JP5713547B2 (ja) 2008-09-10 2009-09-08 センサ装置及びセンサ装置を製造するための方法

Country Status (4)

Country Link
US (1) US8375796B2 (enExample)
JP (1) JP5713547B2 (enExample)
DE (1) DE102008041943A1 (enExample)
FR (1) FR2935794B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140057501A1 (en) * 2012-08-27 2014-02-27 GM Global Technology Operations LLC Electrical-mechanical fastening device for motor vehicles
DE102016225652A1 (de) * 2016-12-20 2018-06-21 Piezocryst Advanced Sensorics Gmbh Verfahren zur Herstellung eines Sensorgehäuses für einen Kraft- oder Drucksensor sowie Sensorgehäuse, Kraft- oder Drucksensor und Verwendung einer additiven Fertigungsvorrichtung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583081Y2 (ja) * 1978-02-09 1983-01-19 富士電機株式会社 拡散形半導体圧力センサ
US4222277A (en) * 1979-08-13 1980-09-16 Kulite Semiconductor Products, Inc. Media compatible pressure transducer
GB9321398D0 (en) * 1993-10-16 1993-12-08 Lucas Ind Plc Differential pressure transducer
DE10260105A1 (de) * 2002-12-19 2004-07-01 Robert Bosch Gmbh Drucksensor
US7055392B2 (en) * 2003-07-04 2006-06-06 Robert Bosch Gmbh Micromechanical pressure sensor
DE102004006201B4 (de) * 2004-02-09 2011-12-08 Robert Bosch Gmbh Drucksensor mit Siliziumchip auf einer Stahlmembran
JP2005233953A (ja) * 2004-02-17 2005-09-02 Robert Bosch Gmbh マイクロメカニカル式の高圧センサを製造するための方法及びマクロメカニカル式の圧力センサ
JP2006047190A (ja) * 2004-08-06 2006-02-16 Denso Corp 圧力センサ
DE102005027365A1 (de) 2005-06-14 2006-12-21 Robert Bosch Gmbh Hochdrucksensoreinrichtung und Verfahren zu ihrer Herstellung
DE102009002004A1 (de) * 2009-03-31 2010-10-07 Robert Bosch Gmbh Sensoranordnung zum Erfassen von hohen Drücken
US8074521B2 (en) * 2009-11-09 2011-12-13 Kulite Semiconductor Products, Inc. Enhanced static-dynamic pressure transducer suitable for use in gas turbines and other compressor applications

Similar Documents

Publication Publication Date Title
JP6426848B2 (ja) 応力軽減ｍｅｍｓ構造及びパッケージ
JP4738481B2 (ja) 付加的なバックチェンバを有する指向性シリコンコンデンサマイクロホン
EP1974646A3 (en) Cleaning element and cleaning tool
JP2017528940A5 (enExample)
WO2012047636A3 (en) Vacuum process chamber component and methods of making
WO2008008162A3 (en) Support structure for free-standing mems device and methods for forming the same
JP2008524590A5 (enExample)
WO2010031192A8 (en) Methods for manufacturing ultrasound transducers and other components
JP2014235279A5 (enExample)
WO2008099933A1 (ja) 半導体パッケージ
FI20106359A7 (fi) Menetelmä ultraäänianturin valmistamiseksi ja anturirakenne
TW200723443A (en) Method of forming self-passivating interconnects and resulting devices
ITTO20040198A1 (it) Procedimento per la fabbricazione di una preforma secca di rinforzo per un elemento strutturale composito di un aeromobile
JP2007060465A5 (enExample)
DE602006016850D1 (de) Verfahren zur herstellung von ein gettermaterial enthaltenden mikromechanischen vorrichtungen und so hergestellte vorrichtungen
JP2010124467A5 (enExample)
WO2008155297A3 (de) Mems bauelement und verfahren zur herstellung
JP2010117346A5 (enExample)
JP6051873B2 (ja) 物理量センサおよびその製造方法
JP2012084681A5 (enExample)
JP2009246940A5 (enExample)
JP2019129165A5 (enExample)
JP2008241287A5 (enExample)
EP1936678A3 (en) A method for bonding and releasing a die or substrate to/from a carrier and corresponding intermediate product
JP2006121411A5 (enExample)