JP2010075930A - 少量の液体材料を分配するための方法 - Google Patents
少量の液体材料を分配するための方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F13/00—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
- G01F13/006—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups measuring volume in function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lift Valve (AREA)
Abstract
【解決手段】閉位置に向かってのバルブシャフトの急速な移動により、ノズルの第二流路の出口を通って前記液体又は粘性材料の流れを分出する分出工程と、バルブシャフトを閉位置まで移動させることにより、該前記液体又は粘性材料の流れを停止して、該流れを該ノズルから分断して第一の大きさの滴を形成する滴形成工程と、該分出工程と該滴形成工程とを繰り返して、前記液体又は粘性材料の複数の滴を形成する工程と、前記複数の滴を前記基材の上に堆積させ、前記複数の滴を互いに落とし、前記基板上の単一の位置でまとめて、第二の大きさの最終滴を形成する工程とを備えることを特徴とする該方法により解決する。
【選択図】図1
Description
本願は、米国特許出願第08/607,126号、(1996年2月26日提出)の一部継続出願である米国特許出願第08/559,332号(1995年11月16日提出)の関連出願である。
[発明の分野]
本発明は、液体材料を分配する分野に、より詳しくは電子部品やプリント回路基盤の組立てにおける少量の粘性接着剤、半田フラックス又は他の液体材料を迅速に分配するための方法に関する。
[発明の背景]
本発明は、電子工業でプリント回路基盤の様な表面上に流体材料を分配するための方法及び装置に関する。しかし、本発明の用途は広く、他の産業でも有利に使用できる。
本発明の目的は、先行技術の方法及び装置の問題及び制約を解決するために、プリント回路基盤の上に間隔をおいて配置されたノズルオリフィスから少量の液体又は粘性材料を高温で分配するための方法及び装置を提供することである。
d=ドットの直径
r=ドットの半径=2/d
c=糸の直径
h=糸の長さ h(d,c)=4r(d)3/6r(c)2
ρ=接着剤の密度1xgm./cm2
σ=接着剤の降伏応力=500x3Pa(パスカル)
M=糸の質量M(d,c)= ρxπxr(c)2 xh(d,c)
F(c)=分断に必要な力=σy xπxr(c)2
a(d,c)=力を発生するのに必要な加速
F(c)/M(d,c)
解析すべきドットの直径が0.020インチである場合、
c=0.006インチ
h=0.074インチ
M(d,c)=3.432x10−5gm
F(c)=2.736x10−5kg m sec−2
a(d,c)=797 m/sec2
ドットの加速及び減速、したがってドットに対する力に影響する重要な変数は、下記の通りである。
a)流体の密度及びドットの大きさにより設定される形成されるドットの質量、
b)ノズル先端における濡れた面積により設定される形成される流れの直径、
c)バルブの直径、速度及び流体粘度により設定されるバルブにより発生する圧力、
d)オリフィスの長さ及び直径により設定されるノズルオリフィス中の圧力低下、
e)シャフトとハウジングの間の輪状区域の長さ、シャフトの直径、及びハウジングの直径により設定されるバルブから供給源に戻る圧力低下、及び
f)バルブ直径及びシート直径により設定される、バルブ位置により変化するバルブとシートの間の圧力低下。
Claims (3)
- 吐出装置を用いて、基材の上に堆積される液体又は粘性材料の滴の大きさを変化させる方法であって、
前記吐出装置は、
貫通して延在し、入口と出口とを有する第一流路を有するバルブ組立体であって、前記第一流路の入口は前記液体又は粘性材料源と流体的に連通するバルブ組立体と、
ノズル入口とノズル出口とを有する第二流路を有するノズルであって、該ノズル入口は前記第一流路の出口と流体的に連通するノズルと、
該第一流路を通して可動なバルブシャフトであって、該バルブシャフトは、該ノズルまで該液体または粘性材料を流す開位置と該ノズルまでの該液体または粘性材料の流れを妨げる閉位置との間を可動なバルブシャフトとを備え、
前記方法は、
該閉位置に向かっての該バルブシャフトの急速な移動により、前記ノズルの第二流路の出口を通って前記液体又は粘性材料の流れを分出する分出工程と、
該バルブシャフトを該閉位置まで移動させることにより、該前記液体又は粘性材料の流れを停止して、該流れを該ノズルから分断して第一の大きさの滴を形成する滴形成工程と、
該分出工程と該滴形成工程とを繰り返して、前記液体又は粘性材料の複数の滴を形成する工程と、
前記複数の滴を前記基材の上に堆積させ、前記複数の滴を互いに落とし、前記基板上の単一の位置でまとめて、第二の大きさの最終滴を形成する工程とを備えることを特徴とする該方法。 - 請求項1に記載されている方法であって、前記吐出装置は、該第一流路と流体的に連通する開口を囲んで配置されるバルブシートと、該バルブシート周りに配置されるヒータとを備え、
該方法は、さらに、前記液体又は粘性材料の少量を加熱する工程を含む該方法。 - 請求項1または2に記載の該方法であって、
該バルブシャフトを該開位置まで移動し、該第二流路を前記液体又は粘性材料で満たす工程をさらに備え、
前記閉位置に向かっての該バルブシャフトの急速な移動は、前記液体又は粘性材料の大部分を該第一流路の入口に向かって流し、前記液体又は粘性材料のいくらかを該第一流路から第二流路に向かって流し、該ノズルの該第二流路から分出されるべき前記液体又は粘性材料を前記液体又は粘性材料の流れとし、そして前記一流路の入口に向かっての前記液体又は粘性材料の流れを減少させ、前記二流路を通しての前記液体又は粘性材料の流れを増加させることを特徴とする方法。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55933295A | 1995-11-16 | 1995-11-16 | |
| US08/559,332 | 1995-11-16 | ||
| US60712696A | 1996-02-26 | 1996-02-26 | |
| US08/607,126 | 1996-02-26 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004228340A Division JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010075930A true JP2010075930A (ja) | 2010-04-08 |
| JP4989716B2 JP4989716B2 (ja) | 2012-08-01 |
Family
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51911897A Expired - Lifetime JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
| JP2004228340A Expired - Lifetime JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
| JP2009292532A Expired - Lifetime JP4989716B2 (ja) | 1995-11-16 | 2009-12-24 | 少量の液体材料を分配するための方法 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51911897A Expired - Lifetime JP3616105B2 (ja) | 1995-11-16 | 1996-11-12 | 少量の液体材料を分配するための方法及び装置 |
| JP2004228340A Expired - Lifetime JP4657648B2 (ja) | 1995-11-16 | 2004-08-04 | 少量の液体材料を分配するための方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| EP (4) | EP1655094A1 (ja) |
| JP (3) | JP3616105B2 (ja) |
| AU (1) | AU1119797A (ja) |
| CA (1) | CA2235991C (ja) |
| DE (3) | DE06075088T1 (ja) |
| WO (1) | WO1997018054A1 (ja) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6267266B1 (en) | 1995-11-16 | 2001-07-31 | Nordson Corporation | Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate |
| US6253957B1 (en) | 1995-11-16 | 2001-07-03 | Nordson Corporation | Method and apparatus for dispensing small amounts of liquid material |
| US6093251A (en) | 1997-02-21 | 2000-07-25 | Speedline Technologies, Inc. | Apparatus for measuring the height of a substrate in a dispensing system |
| US5918648A (en) * | 1997-02-21 | 1999-07-06 | Speedline Techologies, Inc. | Method and apparatus for measuring volume |
| US6085943A (en) * | 1997-06-30 | 2000-07-11 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
| US5957343A (en) * | 1997-06-30 | 1999-09-28 | Speedline Technologies, Inc. | Controllable liquid dispensing device |
| US6324973B2 (en) * | 1997-11-07 | 2001-12-04 | Speedline Technologies, Inc. | Method and apparatus for dispensing material in a printer |
| ES2152817B1 (es) * | 1998-05-20 | 2001-08-16 | Barberan Sa | Perfeccionamientos en los cabezales de aplicacion por tobera de colas termofusibles o de poliuterano reactivo. |
| DE20106464U1 (de) * | 2001-04-12 | 2001-08-02 | Pac Tech - Packaging Technologies GmbH, 14641 Nauen | Vorrichtung zum Aufbringen von Lotkugeln |
| US7617951B2 (en) | 2002-01-28 | 2009-11-17 | Nordson Corporation | Compact heated air manifolds for adhesive application |
| EP2267381B1 (en) * | 2003-07-14 | 2015-12-16 | Nordson Corporation | Apparatus for dispensing discrete amounts of viscous material |
| DE10338360A1 (de) * | 2003-08-21 | 2005-03-31 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Verfahren und Vorrichtung zur Herstellung eines Wabenkörpers |
| US20050183906A1 (en) * | 2004-02-23 | 2005-08-25 | Nidec Corporation | Lubricating-Fluid Infusion Apparatus |
| JP5344262B2 (ja) * | 2004-12-20 | 2013-11-20 | Uht株式会社 | 液滴射出装置 |
| ES2559003T3 (es) | 2006-01-06 | 2016-02-10 | Nordson Corporation | Dispensador de líquidos con control individualizado de aire de proceso |
| US20080099538A1 (en) * | 2006-10-27 | 2008-05-01 | United Technologies Corporation & Pratt & Whitney Canada Corp. | Braze pre-placement using cold spray deposition |
| US20090095825A1 (en) * | 2007-10-11 | 2009-04-16 | Nordson Corporation | Dispenser nozzle having differential hardness |
| DE202008004350U1 (de) | 2008-03-31 | 2009-08-27 | Hentschel, Lothar | Dosierventil für die berührungsfreie Dosierung von reaktiven Fluiden |
| DE102008027259A1 (de) | 2008-06-06 | 2009-12-17 | Focke & Co.(Gmbh & Co. Kg) | Verfahren und Vorrichtung zur Herstellung von Zigarettenpackungen |
| US8753713B2 (en) * | 2010-06-05 | 2014-06-17 | Nordson Corporation | Jetting dispenser and method of jetting highly cohesive adhesives |
| DE202010013815U1 (de) | 2010-10-05 | 2012-01-13 | Lothar Hentschel | Elektropneumatisch betätigtes Ventil für die dosierte Abgabe von Flüssigkeiten |
| KR101869089B1 (ko) * | 2011-01-04 | 2018-06-19 | 주식회사 탑 엔지니어링 | 점성물질 젯팅 장치 |
| JP5435308B2 (ja) * | 2011-08-02 | 2014-03-05 | 株式会社安川電機 | 接着剤塗布装置 |
| DE202011107412U1 (de) | 2011-11-03 | 2013-02-04 | Lothar Hentschel | Einstellbares Ventil für die dosierte Abgabe von Flüssigkeiten |
| CH705930B1 (de) * | 2011-12-22 | 2015-08-28 | Esec Ag | Verfahren zum Auftragen von Klebstoff auf ein Substrat. |
| DE102013006106A1 (de) * | 2013-04-09 | 2014-10-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung |
| JP6445974B2 (ja) * | 2013-10-05 | 2019-01-09 | 武蔵エンジニアリング株式会社 | 液体材料充填装置および方法 |
| DE102014010843B4 (de) | 2014-07-24 | 2020-12-03 | Technische Universität Braunschweig | Dosierdüse und Verfahren zum dosierten Auftragen hochviskoser Medien |
| WO2016032746A1 (en) * | 2014-08-28 | 2016-03-03 | Nordson Corporation | Non-impact jetting dispensing module and method |
| DE102016212893A1 (de) * | 2016-07-14 | 2018-01-18 | F. Holzer Gmbh | Pumpkopf sowie Dosiervorrichtung |
| DE102016212892C5 (de) * | 2016-07-14 | 2020-01-30 | F. Holzer Gmbh | Pumpkopf sowie Dosiervorrichtung |
| DE102017126307A1 (de) | 2017-11-09 | 2019-05-09 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Dosiervorrichtung sowie Verfahren zum Dosieren von flüssigen Medien |
| SG11202008194VA (en) * | 2018-03-20 | 2020-09-29 | Musashi Engineering Inc | Liquid material ejecting apparatus |
| DE102019107836A1 (de) * | 2018-06-12 | 2019-12-12 | Marco Systemanalyse Und Entwicklung Gmbh | Jet-Ventil |
| CN110252591A (zh) * | 2018-06-12 | 2019-09-20 | 玛珂系统分析和开发有限公司 | 喷射阀 |
| DE102018133606B3 (de) | 2018-12-27 | 2019-12-24 | PerfecDos GbR (vertretungsberechtigte Gesellschafter: Lothar Hentschel, 82544 Egling; Benjamin Kratz, 82211 Hersching; Peter Friedl, 83623 Dietramszell) | Jet-Dosierventil |
| KR102326763B1 (ko) * | 2020-07-15 | 2021-11-16 | 주식회사 위너스에프에이 | 디스펜서 |
| JP7229558B2 (ja) * | 2020-12-04 | 2023-02-28 | 株式会社ワークス | 電子部品接着用ノズル |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4066188A (en) * | 1976-08-10 | 1978-01-03 | Nordson Corporation | Thermoplastic adhesive dispenser having an internal heat exchanger |
| DE4013323A1 (de) * | 1990-04-26 | 1991-10-31 | Heino Kaiser | Dosierventil |
| JPH03296461A (ja) * | 1990-04-12 | 1991-12-27 | Seiko Instr Inc | 高粘度液体定量吐出装置 |
| JPH0417177A (ja) * | 1990-05-09 | 1992-01-21 | Sony Corp | 接着剤塗布装置 |
| JPH0430593A (ja) * | 1990-05-28 | 1992-02-03 | Matsushita Electric Works Ltd | 接着剤塗布方法及びフラックス塗布方法及び半田ペースト塗布方法 |
| JPH0522054A (ja) * | 1991-07-16 | 1993-01-29 | Nec Corp | エミツタ・フオロア付差動増幅回路 |
| JPH0531458A (ja) * | 1991-07-30 | 1993-02-09 | Tdk Corp | 水性エマルジヨン接着剤の塗布方法 |
| JPH05168997A (ja) * | 1991-12-26 | 1993-07-02 | Matsushita Electric Ind Co Ltd | ディスペンサ |
| JPH0768203A (ja) * | 1992-11-19 | 1995-03-14 | Asymptotic Technol Inc | 微量の粘性材料を迅速に分配するための装置および方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2025509A (en) * | 1934-05-10 | 1935-12-24 | Hieber Karl | Electric soldering iron |
| FR2637520B1 (fr) * | 1988-10-07 | 1990-11-23 | Bourton Gilles | Fer a souder integral a ecoulement automatique et simultane de la soudure et de son decapant |
| US4942998A (en) * | 1988-12-15 | 1990-07-24 | Horvath Bruce B | Apparatus and process for automatically dispensing metal alloy paste material for joining metal components |
| JP2527926Y2 (ja) * | 1991-09-05 | 1997-03-05 | 徳興 中橋 | ホットメルトアプリケータ |
-
1996
- 1996-11-12 EP EP06075088A patent/EP1655094A1/en not_active Withdrawn
- 1996-11-12 EP EP96942008A patent/EP0861136B1/en not_active Expired - Lifetime
- 1996-11-12 EP EP04075967A patent/EP1437192A3/en not_active Withdrawn
- 1996-11-12 DE DE06075088T patent/DE06075088T1/de active Pending
- 1996-11-12 EP EP00303607A patent/EP1029626B1/en not_active Revoked
- 1996-11-12 AU AU11197/97A patent/AU1119797A/en not_active Abandoned
- 1996-11-12 WO PCT/US1996/018380 patent/WO1997018054A1/en not_active Ceased
- 1996-11-12 CA CA002235991A patent/CA2235991C/en not_active Expired - Lifetime
- 1996-11-12 DE DE69632795T patent/DE69632795T8/de not_active Revoked
- 1996-11-12 DE DE69611692T patent/DE69611692T2/de not_active Expired - Lifetime
- 1996-11-12 JP JP51911897A patent/JP3616105B2/ja not_active Expired - Lifetime
-
2004
- 2004-08-04 JP JP2004228340A patent/JP4657648B2/ja not_active Expired - Lifetime
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2009
- 2009-12-24 JP JP2009292532A patent/JP4989716B2/ja not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4066188A (en) * | 1976-08-10 | 1978-01-03 | Nordson Corporation | Thermoplastic adhesive dispenser having an internal heat exchanger |
| JPH03296461A (ja) * | 1990-04-12 | 1991-12-27 | Seiko Instr Inc | 高粘度液体定量吐出装置 |
| DE4013323A1 (de) * | 1990-04-26 | 1991-10-31 | Heino Kaiser | Dosierventil |
| JPH0417177A (ja) * | 1990-05-09 | 1992-01-21 | Sony Corp | 接着剤塗布装置 |
| JPH0430593A (ja) * | 1990-05-28 | 1992-02-03 | Matsushita Electric Works Ltd | 接着剤塗布方法及びフラックス塗布方法及び半田ペースト塗布方法 |
| JPH0522054A (ja) * | 1991-07-16 | 1993-01-29 | Nec Corp | エミツタ・フオロア付差動増幅回路 |
| JPH0531458A (ja) * | 1991-07-30 | 1993-02-09 | Tdk Corp | 水性エマルジヨン接着剤の塗布方法 |
| JPH05168997A (ja) * | 1991-12-26 | 1993-07-02 | Matsushita Electric Ind Co Ltd | ディスペンサ |
| JPH0768203A (ja) * | 1992-11-19 | 1995-03-14 | Asymptotic Technol Inc | 微量の粘性材料を迅速に分配するための装置および方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1655094A1 (en) | 2006-05-10 |
| JP2000501331A (ja) | 2000-02-08 |
| EP1029626A2 (en) | 2000-08-23 |
| DE69632795T8 (de) | 2005-10-20 |
| JP4657648B2 (ja) | 2011-03-23 |
| DE69611692D1 (de) | 2001-03-01 |
| WO1997018054A1 (en) | 1997-05-22 |
| DE69611692T2 (de) | 2001-09-06 |
| EP1029626A3 (en) | 2000-10-18 |
| EP1029626B1 (en) | 2004-06-23 |
| JP2004322099A (ja) | 2004-11-18 |
| CA2235991C (en) | 2005-02-15 |
| EP0861136B1 (en) | 2001-01-24 |
| CA2235991A1 (en) | 1997-05-22 |
| JP3616105B2 (ja) | 2005-02-02 |
| AU1119797A (en) | 1997-06-05 |
| EP0861136A1 (en) | 1998-09-02 |
| JP4989716B2 (ja) | 2012-08-01 |
| DE69632795D1 (de) | 2004-07-29 |
| DE69632795T3 (de) | 2005-07-14 |
| DE06075088T1 (de) | 2007-01-04 |
| EP1437192A3 (en) | 2005-06-08 |
| EP1437192A2 (en) | 2004-07-14 |
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