JP2010060385A - 液膜厚の測定装置及び測定方法 - Google Patents

液膜厚の測定装置及び測定方法 Download PDF

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JP2010060385A
JP2010060385A JP2008225105A JP2008225105A JP2010060385A JP 2010060385 A JP2010060385 A JP 2010060385A JP 2008225105 A JP2008225105 A JP 2008225105A JP 2008225105 A JP2008225105 A JP 2008225105A JP 2010060385 A JP2010060385 A JP 2010060385A
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thickness
substrate
liquid film
liquid
processing
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JP2010060385A5 (enExample
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Yuji Nagashima
裕次 長嶋
Tsutomu Kikuchi
勉 菊池
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of JP2010060385A5 publication Critical patent/JP2010060385A5/ja
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JP2008225105A 2008-09-02 2008-09-02 液膜厚の測定装置及び測定方法 Pending JP2010060385A (ja)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107401981A (zh) * 2017-07-19 2017-11-28 大连理工大学 非接触测量管内波动液膜基底膜厚的装置及使用方法
KR101935692B1 (ko) 2017-09-29 2019-01-04 서울대학교산학협력단 액막 두께 측정 장치 및 그 제어 방법
KR20190107171A (ko) * 2017-02-08 2019-09-18 케이엘에이 코포레이션 기판 및 막 두께 분포를 측정하기 위한 시스템 및 방법
CN115376963A (zh) * 2021-05-17 2022-11-22 细美事有限公司 基板处理设备和基板传送机器人
CN118189833A (zh) * 2024-02-26 2024-06-14 华侨大学 一种磨削液体薄膜厚度测量装置及其测量方法
JP7530824B2 (ja) 2020-12-24 2024-08-08 東京エレクトロン株式会社 膜厚推定方法、記憶媒体、及び膜厚推定装置
CN118632604A (zh) * 2024-08-15 2024-09-10 深圳黑晶光电技术有限公司 一种可原位监测钙钛矿薄膜闪蒸干燥时间的装置及方法
CN119803317A (zh) * 2025-01-09 2025-04-11 东华理工大学 一种基于激光衍射的溶液中微液膜厚度测量装置与方法
US12504690B2 (en) 2021-11-30 2025-12-23 Semes Co., Ltd. Apparatus for treating substrate and method for treating a substrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131408A (ja) * 1983-12-21 1985-07-13 Hitachi Ltd 微小隙間測定装置
JPS6115072U (ja) * 1984-06-29 1986-01-28 ホ−ヤ株式会社 レジスト塗布装置
JPH01248620A (ja) * 1988-03-30 1989-10-04 Tokyo Electron Ltd 塗布膜形成方法及びその装置
JPH02233176A (ja) * 1989-03-06 1990-09-14 Mitsubishi Electric Corp 塗布装置
JPH05234869A (ja) * 1992-02-03 1993-09-10 Nec Corp 塗布装置
JP2005221401A (ja) * 2004-02-06 2005-08-18 Dainippon Printing Co Ltd 膜厚測定方法および装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60131408A (ja) * 1983-12-21 1985-07-13 Hitachi Ltd 微小隙間測定装置
JPS6115072U (ja) * 1984-06-29 1986-01-28 ホ−ヤ株式会社 レジスト塗布装置
JPH01248620A (ja) * 1988-03-30 1989-10-04 Tokyo Electron Ltd 塗布膜形成方法及びその装置
JPH02233176A (ja) * 1989-03-06 1990-09-14 Mitsubishi Electric Corp 塗布装置
JPH05234869A (ja) * 1992-02-03 1993-09-10 Nec Corp 塗布装置
JP2005221401A (ja) * 2004-02-06 2005-08-18 Dainippon Printing Co Ltd 膜厚測定方法および装置

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102518197B1 (ko) * 2017-02-08 2023-04-04 케이엘에이 코포레이션 기판 및 막 두께 분포를 측정하기 위한 시스템 및 방법
KR20190107171A (ko) * 2017-02-08 2019-09-18 케이엘에이 코포레이션 기판 및 막 두께 분포를 측정하기 위한 시스템 및 방법
CN107401981A (zh) * 2017-07-19 2017-11-28 大连理工大学 非接触测量管内波动液膜基底膜厚的装置及使用方法
KR101935692B1 (ko) 2017-09-29 2019-01-04 서울대학교산학협력단 액막 두께 측정 장치 및 그 제어 방법
JP7530824B2 (ja) 2020-12-24 2024-08-08 東京エレクトロン株式会社 膜厚推定方法、記憶媒体、及び膜厚推定装置
KR102553643B1 (ko) * 2021-05-17 2023-07-13 세메스 주식회사 기판 처리 장치 및 기판 반송로봇
KR20220156680A (ko) * 2021-05-17 2022-11-28 세메스 주식회사 기판 처리 장치 및 기판 반송로봇
CN115376963A (zh) * 2021-05-17 2022-11-22 细美事有限公司 基板处理设备和基板传送机器人
US12417934B2 (en) 2021-05-17 2025-09-16 Semes Co., Ltd. Substrate treating apparatus and substrate transfer robot
US12504690B2 (en) 2021-11-30 2025-12-23 Semes Co., Ltd. Apparatus for treating substrate and method for treating a substrate
CN118189833A (zh) * 2024-02-26 2024-06-14 华侨大学 一种磨削液体薄膜厚度测量装置及其测量方法
CN118632604A (zh) * 2024-08-15 2024-09-10 深圳黑晶光电技术有限公司 一种可原位监测钙钛矿薄膜闪蒸干燥时间的装置及方法
CN119803317A (zh) * 2025-01-09 2025-04-11 东华理工大学 一种基于激光衍射的溶液中微液膜厚度测量装置与方法

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